International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D  DEL 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D(DE)/1/NP  
1993-11-01 
ANW
47D(SEC.)/27/RVN  
1994-03-18 
1CD
47D/112/CD  
1996-04-191996-10-30
DEL
47D/142/CC  
1996-10-041997-07-16

Project

IEC 60191-2 f17 Ed. 1.0

Inclusion of a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2

 

Remark:

 

Associated Documents:

47D/149/RM