International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | DEL | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW | 1991-11-01 | |||||
| ANW | 1992-03-15 | |||||
| 1CD |
| 1994-03-11 | ||||
| DEL | 1995-12-31 | |||||
Project
IEC 60191-2 f16 Ed. 1.0
Recommended values for QFP, 0.30, 0.40, 0.50, 0.65, 0.80 and 1.00 mm lead spacing, for inclusion into IEC 191-2
Remark:
Associated Documents:
47D/96/RM