International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | MERGED | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1994-01-01 | ||||
| ANW |
| 1994-05-27 | ||||
| MERGED | 1995-02-10 | |||||
Project
IEC 60191-2 am2 f18 Ed. 1.0
Flange-mounted header family (peripheral terminals) - 0.100 spacing for inclusion in IEC 191-2
Remark:
- JEDEC TO-257.