International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D01Michael AhrPPUB2012-092014

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/786/RR pdf file 19 kB
2010-11-18 
1CD
47D/787/CD pdf file 1313 kB
2010-11-192010-12-31
ACDV
47D/797/CC doc file 99 kB
pdf file 228 kB
2011-04-082011-03-31
CCDV
47D/816/CDV pdf file 25 kB
pdf file 270 kB
47D/816A/CDV pdf file 1032 kB
pdf file 1117 kB
2011-11-292011-06-30
APUB
47D/821/RVC doc file 85 kB
pdf file 113 kB
2012-05-182012-07-31
DEC
2012-07-232012-11-30
BPUB
2012-08-032012-08-15
PPUB
2012-10-022012-12-15

Project

IEC 60191-2 am19 Ed. 1.0

Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

 

Remark:

- Previous project was IEC 60191-2/F66, will become outline 184B. - F66, F67, F68 & F69 will be merged and published as Amendment 19 Project plan - CDV: 2011-12 FDIS: 2012-12 IS: 2013-06