International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01Hiroyoshi YOSHIDAPPUB2011-102014

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/688/MCR  
2007-06-01 
1CD
47D/689/CD  
2007-06-01 
CDM
47D/704/CC  
47D/704A/CC  
2007-10-122007-10-31
A2CD
47D/704/CC  
47D/704A/CC  
2008-01-042007-12-31
2CD
47D/737/CD  
2009-02-062008-06-30
CDM
47D/748/CC  
47D/748A/CC  
2009-08-212009-06-30
ACDV
47D/748/CC  
47D/748A/CC  
2010-01-082009-12-31
CCDV
47D/780/CDV  
2010-08-272010-02-28
ADIS
47D/796/RVC  
2011-04-082011-04-30
DEC
2011-05-182011-06-30
RDIS
2011-05-202011-06-15
CDIS
47D/805/FDIS  
2011-06-242011-08-31
APUB
47D/808/RVD  
2011-09-062011-08-31
BPUB
2011-09-072011-09-15
PPUB
2011-11-222011-10-15

Project

IEC 60191-2 am18 Ed. 1.0

Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

 

Remark:

Previous project was IEC 60191-2/f65 Will be outline 183E Targets - CDV: 2008-07 FDIS: 2009-05

 

Associated Documents:

SMB/4204/DL