International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | Hiroyoshi YOSHIDA | PPUB | 2011-10 | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2007-06-01 | ||||||
| 1CD |
| 2007-06-01 | ||||||
| CDM |
| 2007-10-12 | 2007-10-31 | |||||
| A2CD |
| 2008-01-04 | 2007-12-31 | |||||
| 2CD |
| 2009-02-06 | 2008-06-30 | |||||
| CDM |
| 2009-08-21 | 2009-06-30 | |||||
| ACDV |
| 2010-01-08 | 2009-12-31 | |||||
| CCDV |
| 2010-08-27 | 2010-02-28 | |||||
| ADIS |
| 2011-04-08 | 2011-04-30 | |||||
| DEC | 2011-05-18 | 2011-06-30 | ||||||
| RDIS | 2011-05-20 | 2011-06-15 | ||||||
| CDIS |
| 2011-06-24 | 2011-08-31 | |||||
| APUB |
| 2011-09-06 | 2011-08-31 | |||||
| BPUB | 2011-09-07 | 2011-09-15 | ||||||
| PPUB | 2011-11-22 | 2011-10-15 | ||||||
90 kB
544 kBProject
IEC 60191-2 am18 Ed. 1.0
Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Remark:
Previous project was IEC 60191-2/f65 Will be outline 183E Targets - CDV: 2008-07 FDIS: 2009-05
Associated Documents:
SMB/4204/DL