International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | Michael AHR | PPUB | 2008-05 | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2005-07-15 | ||||||
| 1CD |
| 2005-07-15 | ||||||
| ACDV |
| 2006-02-17 | 2005-11-30 | |||||
| CCDV |
| 2006-05-12 | 2006-06-30 | |||||
| ADIS |
| 2007-08-10 | 2007-01-15 | |||||
| DEC | 2008-01-03 | 2007-11-15 | ||||||
| RDIS | 2008-01-29 | 2008-01-31 | ||||||
| CDIS |
| 2008-02-22 | 2008-04-15 | |||||
| APUB |
| 2008-04-28 | 2008-04-30 | |||||
| BPUB | 2008-04-29 | 2008-05-15 | ||||||
| PPUB | 2008-05-27 | 2008-06-15 | ||||||
125 kBProject
IEC 60191-2 am17 Ed. 1.0
Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Remark:
- Prev PROJ was IEC 60191-2/F63, will become outline 181E - F62 & F63 will be merged and published as Amendment 17 - Ext of FDIS: 2007-05 -> 2007-11