International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | James Bird | PPUB | 2006-09 | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2003-04-11 | ||||||
| ANW |
| 2003-08-01 | 2003-08-31 | |||||
| 1CD |
| 2004-10-08 | 2003-12-31 | |||||
| CDM |
| 2005-03-25 | 2005-04-30 | |||||
| ACDV |
| 2005-04-25 | 2005-05-31 | |||||
| CCDV |
| 2005-06-17 | 2005-07-31 | |||||
| ADIS |
| 2006-02-17 | 2006-02-28 | |||||
| DEC | 2006-02-28 | 2006-03-31 | ||||||
| RDIS | 2006-03-03 | 2006-04-15 | ||||||
| CDIS |
| 2006-04-07 | 2006-06-30 | |||||
| APUB |
| 2006-06-12 | 2006-09-30 | |||||
| BPUB | 2006-06-13 | 2006-10-31 | ||||||
| PPUB | 2006-07-17 | 2006-11-30 | ||||||
686 kBProject
IEC 60191-2 am13 Ed. 1.0
Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Remark:
- validity extended with Toulouse mtg, 2007-11 - Previous project was IEC 60191-2/F59 - To be published as outline 178E - US No 03-126 CCDV: 2005-07 CDIS: 2006-07