International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | MERGED | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW | 1989-01-01 | |||||
| ANW | 1989-01-02 | |||||
| 1CD | 1989-01-03 | |||||
| ADIS | 1989-10-06 | |||||
| CDIS |
| 1990-05-09 | ||||
| APUB |
| 1991-05-03 | ||||
| MERGED | 1995-01-12 | |||||
Project
IEC 60191-2 am1 f9 Ed. 1.0
Surface mounted packages - Introduction of the outline family 129E in IEC 191-2
Remark:
- Transferred from TC 47. - Former 47.19.57.