International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | MERGED | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW | 1986-09-01 | |||||
| ANW | 1986-09-12 | |||||
| ADIS | 1988-04-15 | |||||
| CDIS | 1990-05-09 | |||||
| APUB | 1991-05-17 | |||||
| MERGED | 1995-01-12 | |||||
Project
IEC 60191-2 am1 f3 Ed. 1.0
Additional outline drawing of power semiconductor device, to be included in IEC 191-2
Remark:
- Transferred from TC 47. - Former 47.19.35.