International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01 MERGED 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
1988-11-01 
ANW
1988-11-02 
1CD
1988-11-03 
ADIS
1989-10-06 
CDIS
1990-05-09 
APUB
1991-05-03 
MERGED
1995-01-12 

Project

IEC 60191-2 am1 f10 Ed. 1.0

Dual in line packages for 0.07 inches pitch (1.778 mm) - Introduction of the outline family 101G in IEC 191-2

 

Remark:

- Transferred from TC 47. - Former 47.19.54. - Includes 47D.2.13 .