International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 107

Process management for avionics

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 1071D. BurdickANW2016-06 

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
107/225/NP pdf file 194 kB
2013-11-29 
ANW
107/239/RVN pdf file 217 kB
2014-06-132014-04-15
1CD
 2014-12-31

Project

IEC/TS 62647-4 Ed. 1.0

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) package re-balling

 

Remark:

- Project plan: DTS 2015-12 TS 2016-06