International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 02 | WPUB |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| CDPAS |
| 2000-01-21 | ||||
| APUB |
| 2000-04-10 | 2000-04-30 | |||
| BPUB | 2000-04-17 | 2000-05-30 | ||||
| PPUB | 2000-08-22 | 2000-06-15 | ||||
| WPUB |
| 2002-07-01 | 2002-06-30 | |||
27 kBProject
IEC/PAS 62185 Ed. 1.0
Thermal shock test method
Remark:
- Pub withdrawn 02-06-30 - 47/1631/MCR - Replaced/Superseded by IEC 60749-11 /Ed.1
Associated Documents:
47/1631/MCR