International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 02 | WPUB |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| CDPAS |
| 2000-01-21 | ||||
| APUB |
| 2000-04-10 | 2000-04-30 | |||
| BPUB | 2000-04-17 | 2000-05-30 | ||||
| PPUB | 2000-08-22 | 2000-06-15 | ||||
| WPUB | 2003-03-31 | |||||
27 kBProject
IEC/PAS 62174 Ed. 1.0
Resistance to soldering temperature for through-hole mounted devices
Remark:
- PUB will be withdrawn 2003-03-31 - 47/1687/MCR - Replaced/superseded by IEC 60749-15
Associated Documents:
47/1687/MCR