International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 02 | Dr J. Lynch | RDIS | 2013-11 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PWI | 2006-06-30 | |||||||
| PNW |
| 2012-03-20 | ||||||
| CCDV |
| 2012-03-21 | ||||||
| ANW |
| 2012-07-26 | 2012-08-15 | |||||
| ADIS |
| 2012-12-18 | 2012-11-30 | |||||
| DEC | 2013-05-02 | 2013-03-31 | ||||||
| RDIS | 2013-05-16 | 2013-05-31 | ||||||
| CDIS | 2013-08-15 | |||||||
| APUB | 2013-10-15 | |||||||
| BPUB | 2013-10-31 | |||||||
| PPUB | 2013-11-30 | |||||||
1825 kB
200 kBProject
IEC 62483 Ed. 1.0
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
Remark:
Functions concerned - Safety and Quality assurance Project plan - FDIS: 2013-03 This project may involve co-operation with JEDEC Need for coordination within IEC TC91/WG3 Ex-IEC/PAS 62483 (JESD22A121)
Associated Documents:
47/1842/NP
47/1876/RVN