International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 02 | CAN |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2000-01-21 | ||||||
| ANW |
| 2000-04-21 | 2000-06-15 | |||||
| CAN |
| 2000-09-01 | 2002-04-30 | |||||
28 kBProject
IEC 62176 Ed. 1.0
Wire bond shear test method
Remark:
- Formerly IEC/PAS (47/1449/PAS) - EIA/JESD22-B116 - This PAS has been withdrawn acc. to AC/67/1999 as subject is covered by IEC 60749/A1