International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 02 | Jim LYNCH | PPUB | 2016 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1998-02-27 | ||||
| ANW |
| 1998-06-19 | 1998-07-15 | |||
| 1CD |
| 1999-07-16 | 1999-11-30 | |||
| ACDV |
| 2000-07-14 | 1999-12-31 | |||
| CCDV |
| 2000-10-27 | 2000-07-31 | |||
| ADIS |
| 2001-11-02 | 2001-06-30 | |||
| DEC | 2001-11-15 | 2001-11-30 | ||||
| RDIS | 2001-11-19 | 2001-12-15 | ||||
| CDIS |
| 2002-01-18 | 2002-02-28 | |||
| APUB |
| 2002-03-26 | 2002-04-30 | |||
| BPUB | 2002-03-27 | 2002-05-31 | ||||
| PPUB | 2002-04-12 | 2002-05-31 | ||||
93 kBProject
IEC 60749-6 Ed. 1.0
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
Remark:
- Formerly IEC/PAS 62205 (47/1513/PAS-47/1543/RVD) cc: TC 104