International

Electrotechnical

Commission

International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

Detail

Committee	Working Groups	Project Leader	Current Status	Frcst Pub Date	Stability Date
TC 47	02	Jim LYNCH	PPUB	2009-04	2014

History

Stage

Document

Downloads

Decision Date

Target Date

47/1775/CD

2004-08-20

47/1810/CC	173 kB
47/1810A/CC	145 kB

2005-03-11

2005-05-31

47/1810/CC	173 kB
47/1810A/CC	145 kB

2007-06-01

2007-06-30

47/1917/CDV

2007-06-29

2007-09-15

47/1986/RVC

2008-08-22

2008-02-29

2008-10-03

2008-10-31

2008-10-13

2008-10-31

47/2010/FDIS

2009-01-16

2009-01-15

47/2013/RVD

2009-03-23

2009-03-31

2009-03-24

2009-03-31

2009-04-07

2009-04-30

Project

IEC 60749-20-1 Ed. 1.0

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Remark:

- Ext of targets for ACDV: 2007-06, CCDV: 2007-09 - SMB/3445B/INF - CDV of IEC 60749-20-1 issued following the revision of IEC 60749-20 to Ed. 2 - This PR is based on general basic 47/1421/NP and 47/1424/RVN on complete update of IEC 60749. cc: TC 91, 101, 104 - Will replace IEC/PAS 62168 and 62169

Associated Documents:

47/1468/PAS

47/1469/PAS

47/1501/RVD

47/1502/RVD

SMB/3445B/INF