International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 02 | DELPUB | 2009 |
History
Stage | Document | Downloads | Decision Date | Target Date |
|---|---|---|---|---|
| BPUB | 2003-07-18 | |||
| PPUB | 2003-08-13 | 2003-08-31 | ||
| DELPUB | 2008-12-09 | |||
Project
IEC 60749-20 fC1 Ed. 1.0
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Remark:
- Acc. to SMB OK decision on SMB/2530/R