International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 4702M. EtienneDELPUB2003-032013

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47/1447/PAS  
2000-01-21 
ANW
47/1480/RVD  
2000-04-212000-06-15
1CD
47/1525/CD  
2000-07-142000-07-31
ACDV
47/1578/CC  
2001-10-262000-11-30
CCDV
47/1583/CDV  
2001-11-022001-11-30
ADIS
47/1654/RVC  
2002-08-152002-07-15
DEC
2002-08-152002-08-31
RDIS
2002-08-192002-09-15
CDIS
47/1663/FDIS  
2002-10-182002-11-30
APUB
47/1683/RVD  
2003-01-172003-01-15
BPUB
2003-01-202003-02-15
PPUB
2003-02-072003-03-31
DELPUB
2010-10-28 

Project

IEC 60749-15 Ed. 1.0

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

 

Remark:

- formerly IEC/PAS 62174 - Ref. JESD22-B106-B - CA decision Florence: ACDV target extended 01-12-31 - MRD revised as per decision in London, 2006-10

 

Associated Documents:

CA/2125/DL