International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 02 | M. Etienne | DELPUB | 2003-03 | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2000-01-21 | ||||
| ANW |
| 2000-04-21 | 2000-06-15 | |||
| 1CD |
| 2000-07-14 | 2000-07-31 | |||
| ACDV |
| 2001-10-26 | 2000-11-30 | |||
| CCDV |
| 2001-11-02 | 2001-11-30 | |||
| ADIS |
| 2002-08-15 | 2002-07-15 | |||
| DEC | 2002-08-15 | 2002-08-31 | ||||
| RDIS | 2002-08-19 | 2002-09-15 | ||||
| CDIS |
| 2002-10-18 | 2002-11-30 | |||
| APUB |
| 2003-01-17 | 2003-01-15 | |||
| BPUB | 2003-01-20 | 2003-02-15 | ||||
| PPUB | 2003-02-07 | 2003-03-31 | ||||
| DELPUB | 2010-10-28 | |||||
27 kBProject
IEC 60749-15 Ed. 1.0
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Remark:
- formerly IEC/PAS 62174 - Ref. JESD22-B106-B - CA decision Florence: ACDV target extended 01-12-31 - MRD revised as per decision in London, 2006-10
Associated Documents:
CA/2125/DL