International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 01 | DEL | 2010 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW | 1986-08-01 | |||||
| ANW | 1986-08-02 | |||||
| 1CD | 1988-11-01 | |||||
| 3CD |
| 1991-05-31 | ||||
| A4CD | 1992-11-01 | |||||
| ACDV | 1994-10-28 | |||||
| 4CD |
| 1995-10-13 | ||||
| DEL | 1997-10-24 | |||||
Project
IEC 60749 am1 f1 Ed. 2.0
Resistance to dissolution of metallization on SMD's
Remark:
- TC 91/WG 3.
Associated Documents:
47/1387/RM
30 kB