International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Systèmes microélectromécaniques

 
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SC 47F Document de Travail depuis 2016-07-23

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47F/285/RVN

[Result of Voting on 47F/276/NP - PNW 47F-276: Semiconductor devices - Micro-electromechanical devices - Part 35: Standard test procedure for the anti-failure robustness of flexible or foldable electro-mechanical devices against bending deformation]

Titre français non disponible

2017-07-14 U
47F/286/FDIS

[IEC 62047-30 ED1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film]

Titre français non disponible

2017-07-14 2017-08-25 N
47F/269A/RVN

[Revised result of voting on 47F/256/NP - Future IEC 62047-33: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device ]

Titre français non disponible

2017-07-07 N
47F/270A/RVN

[Revised result of voting on 47F/257/NP - Future IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device]

Titre français non disponible

2017-07-07 N
47F/274A/RVN

[Revised result of voting on 47F/272/NP - PNW 47F-272: Future IEC 62047-XX Semiconductor devices – Micro-electromechanical devices – Part XX: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films]

Titre français non disponible

2017-07-07 N
TC 49
47F/281/CD

[IEC 62047-36 ED1: Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films]

Titre français non disponible

2017-07-07 2017-09-01 N
TC 49
47F/282/CD

[IEC 62047-33 ED1: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device]

Titre français non disponible

2017-07-07 2017-09-01 N
47F/283/CD

[IEC 62047-34 ED1: Semiconductor devices - Micro-electromechanical devices - Part 34: Test method for MEMS piezoresistive pressure-sensitive device on wafer]

Titre français non disponible

2017-07-07 2017-09-01 N
47F/284/DA

[Draft agenda for the meeting to be held in Vladivostok, Russia, on 2017-10-12 (starting time: 9:30 to approximate finishing time: 12:00)]

Titre français non disponible

2017-07-07 N/A
47F/277A/RVC

[Revised result of voting on 47F/254/CDV - IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film]

Titre français non disponible

2017-06-30 N
47F/280/DC

[Maintenance – call for comments/ proposals on publications coming up for review and a call for experts]

Titre français non disponible

2017-06-30 2017-08-25 N/A
47F/279/AC

[Appointment of a secretary and an assistant secretary]

Titre français non disponible

2017-06-23 N/A
47F/278/RQ

[Result of Questionnaire on 47F/275/Q: Questionnaire on the nomination of a new Co-Convenor of WG 2 (Characterizations and testing methods of materials and structures for microelectromechanical systems)]

Titre français non disponible

2017-06-02 N/A
47F/277/RVC

[Result of Voting on 47F/254/CDV - IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film]

Titre français non disponible

2017-05-05 N
47F/275/Q

[Questionnaire on the nomination of a new Co-Convenor of WG 2 (Characterizations and testing methods of materials and structures for microelectromechanical systems)]

Titre français non disponible

2017-04-14 2017-05-26 N/A Report of Comments
47F/276/NP

[PNW 47F-276: Semiconductor devices - Micro-electromechanical devices - Part 35: Standard test procedure for the anti-failure robustness of flexible or foldable electro-mechanical devices against bending deformation]

Titre français non disponible

2017-04-14 2017-07-07 U Voting Result
47F/274/RVN

[Result of Voting on 47F/272/NP - PNW 47F-272: Future IEC 62047-XX Semiconductor devices – Micro-electromechanical devices – Part XX: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films]

Titre français non disponible

2017-04-07 N
TC 49
47F/273/RVC

[Result of Voting on 47F/263/CDV - IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature]

Titre français non disponible

2017-02-17 N
47F/268/RVN

[Result of Voting on 47F/255/NP - Future IEC 62047-32: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators]

Titre français non disponible

2016-12-16 U
47F/269/RVN

[Result of Voting on 47F/256/NP - Future IEC 62047-33: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device ]

Titre français non disponible

2016-12-16 N
47F/270/RVN

[Result of Voting on 47F/257/NP - Future IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device]

Titre français non disponible

2016-12-16 N
47F/271/RVD

[Result of Voting on 47F/266/FDIS - IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices]

Titre français non disponible

2016-12-16 Y
47F/272/NP

[PNW 47F-272: Future IEC 62047-XX Semiconductor devices – Micro-electromechanical devices – Part XX: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films]

Titre français non disponible

2016-12-16 2017-03-10 N Voting Result
TC 49
47F/263/CDV

[IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature]

Titre français non disponible

2016-11-11 2017-02-03 N Voting Result
47F/267/RM

[Unconfirmed minutes of SC 47F plenary meeting held at Room VDE-Ohm held in Frankfurt, Germany on Oct. 05, 2016]

Titre français non disponible

2016-11-04 N/A
47F/266/FDIS

[IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices]

Titre français non disponible

2016-10-28 2016-12-09 Y Voting Result
47F/254/CDV

[IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film]

Titre français non disponible

2016-10-14 2017-01-06 N Voting Result
47F/260A/INF

[Report of comments on 47F/247/DC: Maintenance - call for comments/ proposals on publications coming up for review and a call for experts]

Titre français non disponible

2016-09-23 N/A
47F/248A/DA

[Revised draft agenda for the meeting to be held in Frankfurt, Germany on 2016-10-05 (14:00 h to 17:30 h)]

Titre français non disponible

2016-09-09 N/A
47F/262/RVN

[Result of voting on 47F/246/NP: Future IEC 62047-31: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials ]

Titre français non disponible

2016-09-09 U
47F/264/INF

[Review of Active Participation of P-members in the Work of SC 47F]

Titre français non disponible

2016-09-09 N/A
47F/265/PW

[Programme of Work of SC 47F as recorded by the IEC Central Office in its database]

Titre français non disponible

2016-09-09 N/A
47F/259/RVC

[Result of voting on 47F/230A/CDV: IEC 62047-27 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)]

Titre français non disponible

2016-09-02 Y
47F/260/INF

[This document has been replaced by 47F/260A/INF]

Titre français non disponible

2016-09-02 N/A
47F/261/RVC

[Result of voting on 47F/242/CDV: IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices]

Titre français non disponible

2016-09-02 Y
47F/255/NP

[Future IEC 62047-32: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators]

Titre français non disponible

2016-08-26 2016-11-18 U Voting Result
47F/256/NP

[Future IEC 62047-33: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device ]

Titre français non disponible

2016-08-26 2016-11-18 N Voting Result
47F/257/NP

[Future IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device]

Titre français non disponible

2016-08-26 2016-11-18 N Voting Result
47F/258/CC

[Compilation of comments on 47F/243/CD: IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature]

Titre français non disponible

2016-08-26 N
47F/252/RVD

Rapport de vote sur le 47F/249

2016-08-12 Y
47F/253/CC

[Compilation of comments on 47F/241/CD: IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film]

Titre français non disponible

2016-08-12 N
47F/251/RQ

[Result of 47F/245/Q: Questionnaire on the appointment of a new convenor of WG 1 (Terminologies and generic specification for micro-electromechanical systems) of IEC SC 47F]

Titre français non disponible

2016-07-29 N/A