International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
export to xls file

SC 47F Working Documents since 2015-06-02

sort upsort down
Reference, Title
Downloads
sort down

Circulation

Date

sort upsort down

Closing

Date

sort upsort down
CENELEC

Voting /

Comment

Comit?s

Authoris?s

47F/244/Q

Nomination for Chair of SC 47F
2016-05-132016-06-24
47F/242/CDV

IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
2016-04-292016-07-22yes
47F/234A/RVN

Result of voting on 47F/224/NP: Future IEC 62047-29: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding MEMS materials under room temperature
2016-03-25?
47F/243/CD

IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
2016-03-252016-05-20?Report of Comments
47F/241/CD

IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
2016-02-122016-05-06?Report of Comments
47F/240/AC

Call for nominations for Chair of SC 47F: Micro-electromechanical systems
2016-02-052016-05-06Report of Comments
47F/230A/CDV

IEC 62047-27 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
2016-01-152016-02-19yesVoting Result
47F/239/RVD

Report of Voting on 47F/233/FDIS: IEC 62047-26 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
2015-12-18yes
47F/235A/RVN

Revised result of voting on 47F/225/NP: Future IEC 62047-30: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film and reporting schema
2015-12-11?
47F/238/RVD

Report of Voting on 47F/232/FDIS: IEC 62047-1 Ed.2: Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
2015-12-04yes
47F/237/RM

Unconfirmed minutes of SC 47F plenary meeting held at Victoria Olimp in Minsk, Belarus on October 07, 2015
2015-11-26
47F/236/RVC

Result of voting on 47F/219/CDV: IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2015-11-20yes
47F/230/CDV

This document has been replaced by 47F/230A/CDV
2015-11-13yes
47F/234/RVN

This document has been replaced by 47F/234A/RVN
2015-11-06?
47F/235/RVN

Result of voting on 47F/225/NP: Future IEC 62047-30: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film and reporting schema
2015-11-06?
47F/233/FDIS

IEC 62047-26 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
2015-10-092015-12-11yesVoting Result
47F/232/FDIS

IEC 62047-1 Ed.2: Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
2015-09-252015-11-27yesVoting Result
47F/227A/DA

Revised draft agenda for the meeting to be held in Minsk, Belarus on 2015-10-07 (14:00 h to 17:30 h)
2015-09-04
47F/229/INF

Report of Comments on 47F/226/DC: Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2015-09-04
47F/231/PW

Programme of Work of SC 47F as recorded by the IEC Central Office in its database
2015-09-04
47F/228/CC

Compilation of comments on 47F/220/CD: IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
2015-08-28yes
47F/226/DC

Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2015-07-032015-08-28Report of Comments
47F/227/DA

Draft agenda for the meeting to be held in Minsk, Belarus on 2015-10-07 (14:00 h to 17:30 h)
2015-07-03
47F/225/NP

Future IEC 62047-30: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film and reporting schema
2015-06-262015-10-02?Voting Result
47F/219F/CDV

IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2015-06-12yes
47F/219/CDV

IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2015-06-052015-09-11yesVoting Result
47F/223/CC

Compilation of comments on 47F/216/CD: IEC 62047-27 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
2015-06-05yes
47F/224/NP

Future IEC 62047-29: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding MEMS materials under room temperature
2015-06-052015-09-11?Voting Result