International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Working Documents since 2014-08-02

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47F/226/DC

Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2015-07-032015-08-28
47F/227/DA

Draft agenda for the meeting to be held in Minsk, Belarus on 2015-10-07 (14:00 h to 17:30 h)
2015-07-03
47F/225/NP

Future IEC 62047-30: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film and reporting schema
2015-06-262015-10-02?
47F/219F/CDV

IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2015-06-12yes
47F/219/CDV

IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2015-06-052015-09-11yes
47F/223/CC

Compilation of comments on 47F/216/CD: IEC 62047-27 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
2015-06-05yes
47F/224/NP

Future IEC 62047-29: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding MEMS materials under room temperature
2015-06-052015-09-11?
47F/222/AC

Appointment of an assistant secretary
2015-05-22
47F/221/RVC

Result of voting on 47F/200/CDV: IEC 62047-26 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
2015-05-15yes
47F/198A/RVN

Result of voting on 47F/187/NP: Future IEC 62047-28: Semiconductor devices - Micro-electromechanical devices - Part 28: Vibration-driven MEMS electret energy harvesting devices
2015-04-03?
47F/220/CD

IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
2015-04-032015-06-05?Report of Comments
47F/218/CC

Compilation of comments on 47F/194/CD: IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2015-03-27yes
47F/217/RVC

Result of voting on 47F/195/CDV: IEC 62047-1 Ed.2: Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
2015-03-20yes
47F/184A/RVN

Revised result of voting on 47F/173/NP: Future IEC 62047-27: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
2015-02-27yes
47F/216/CD

IEC 62047-27 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
2015-02-272015-05-01yesReport of Comments
47F/213/RVD

Report of Voting on 47F/208/FDIS: IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
2015-02-13yes
47F/214/RVD

Report of Voting on 47F/209/FDIS: IEC 62047-16 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
2015-02-13yes
47F/215/RVD

Report of Voting on 47F/210/FDIS: IEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
2015-02-13yes
47F/211A/RM

Unconfirmed minutes of SC 47F plenary meeting held in Tokyo, Japan on November 13, 2014
2014-12-26
47F/212/INF

Report of Comments on 47F/196/DC: Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2014-12-26
47F/211/RM

This document has been replaced by 47F/211A/RM
2014-12-19
47F/208/FDIS

IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
2014-12-052015-02-06yesVoting Result
47F/209/FDIS

IEC 62047-16 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
2014-12-052015-02-06yesVoting Result
47F/210/FDIS

IEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
2014-12-052015-02-06yesVoting Result
47F/207/RQ

Result of 47F/202/Q: Questionnaire to establish SC 47F/MT1 and to approve the proposed convenors for the new working groups in SC 47F
2014-11-07
47F/200/CDV

IEC 62047-26 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
2014-10-242015-01-30yesVoting Result
47F/197B/DA

Revised draft agenda for the meeting to be held in Tokyo, Japan on 2014-11-13 (14:00 h to 17:30 h)
2014-10-17
47F/206/PW

Programme of Work of SC 47F as recorded by the IEC Central Office in its database
2014-10-17
47F/203/RVC

Result of voting on 47F/180/CDV: IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
2014-10-03yes
47F/204/RVC

Result of voting on 47F/181/CDV: IEC 62047-16 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
2014-10-03yes
47F/205/INF

Report of Comments on 47F/196/DC: Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2014-10-03
47F/195/CDV

IEC 62047-1 Ed.2: Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
2014-09-262015-01-09yesVoting Result
47F/197A/DA

Draft agenda for the meeting to be held in Tokyo, Japan on 2014-11-13 (14:00 h to 17:30 h)
2014-09-19
47F/202/Q

Questionnaire to establish SC 47F/MT1 and to approve the proposed convenors for the new working groups in SC 47F
2014-09-192014-10-31Report of Comments
47F/199/CC

Compilation of comments on 47F/178/CD: IEC 62047-26 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
2014-08-15yes
47F/201/RVC

Result of voting on 47F/166/CDV: IEC 62047-17 Ed.1 : Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
2014-08-15yes
47F/198/RVN

This document has been replaced by 47F/198A/RVN
2014-08-08?