International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
export to xls file

SC 47F Working Documents since 2015-12-09

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Authorized

Committees

47F/263/CDV

IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

2016-11-11 2017-02-03 N
47F/267/RM

Unconfirmed minutes of SC 47F plenary meeting held at Room VDE-Ohm held in Frankfurt, Germany on Oct. 05, 2016

2016-11-04 N/A
47F/266/FDIS

IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

2016-10-28 2016-12-09 Y
47F/254/CDV

IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

2016-10-14 2017-01-06 N
47F/260A/INF

Report of comments on 47F/247/DC: Maintenance - call for comments/ proposals on publications coming up for review and a call for experts

2016-09-23 N/A
47F/248A/DA

Revised draft agenda for the meeting to be held in Frankfurt, Germany on 2016-10-05 (14:00 h to 17:30 h)

2016-09-09 N/A
47F/262/RVN

Result of voting on 47F/246/NP: Future IEC 62047-31: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2016-09-09 U
47F/264/INF

Review of Active Participation of P-members in the Work of SC 47F

2016-09-09 N/A
47F/265/PW

Programme of Work of SC 47F as recorded by the IEC Central Office in its database

2016-09-09 N/A
47F/259/RVC

Result of voting on 47F/230A/CDV: IEC 62047-27 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

2016-09-02 Y
47F/260/INF

This document has been replaced by 47F/260A/INF

2016-09-02 N/A
47F/261/RVC

Result of voting on 47F/242/CDV: IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

2016-09-02 Y
47F/255/NP

Future IEC 62047-32: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators

2016-08-26 2016-11-18 U Voting Result
47F/256/NP

Future IEC 62047-33: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

2016-08-26 2016-11-18 U Voting Result
47F/257/NP

Future IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device

2016-08-26 2016-11-18 U Voting Result
47F/258/CC

Compilation of comments on 47F/243/CD: IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

2016-08-26 N
47F/252/RVD

Report of Voting on 47F/249: IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

2016-08-12 Y
47F/253/CC

Compilation of comments on 47F/241/CD: IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

2016-08-12 N
47F/251/RQ

Result of 47F/245/Q: Questionnaire on the appointment of a new convenor of WG 1 (Terminologies and generic specification for micro-electromechanical systems) of IEC SC 47F

2016-07-29 N/A
47F/250/RQ

Nomination for Chair of SC 47F

2016-07-01 N/A
47F/249/FDIS

IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

2016-06-24 2016-08-05 Y Voting Result
47F/248/DA

Draft agenda for the meeting to be held in Frankfurt, Germany on 2016-10-05 (14:00 h to 17:30 h)

2016-06-10 N/A
47F/245/Q

Questionnaire on the appointment of a new convenor of WG 1 (Terminologies and generic specification for micro-electromechanical systems) of IEC SC 47F

2016-06-03 2016-07-15 N/A Report of Comments
47F/246/NP

Future IEC 62047-31: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2016-06-03 2016-08-26 U Voting Result
47F/247/DC

Maintenance - call for comments/ proposals on publications coming up for review and a call for experts

2016-06-03 2016-08-26 N/A Report of Comments
47F/244/Q

Nomination for Chair of SC 47F

2016-05-13 2016-06-24 N/A Report of Comments
47F/242/CDV

IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

2016-04-29 2016-07-22 Y Voting Result
47F/234A/RVN

Result of voting on 47F/224/NP: Future IEC 62047-29: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding MEMS materials under room temperature

2016-03-25 N
47F/243/CD

IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

2016-03-25 2016-05-20 N Report of Comments
47F/241/CD

IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

2016-02-12 2016-05-06 N Report of Comments
47F/240/AC

Call for nominations for Chair of SC 47F: Micro-electromechanical systems

2016-02-05 2016-05-06 N/A Report of Comments
47F/230A/CDV

IEC 62047-27 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

2016-01-15 2016-02-19 Y Voting Result
47F/239/RVD

Report of Voting on 47F/233/FDIS: IEC 62047-26 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

2015-12-18 Y
47F/235A/RVN

Revised result of voting on 47F/225/NP: Future IEC 62047-30: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film and reporting schema

2015-12-11 N