International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Working Documents since 2013-09-22

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47F/197A/DA

Draft agenda for the meeting to be held in Tokyo, Japan on 2014-11-13 (14:00 h to 17:30 h)
2014-09-19
47F/202/Q

Questionnaire to establish SC 47F/MT1 and to approve the proposed convenors for the new working groups in SC 47F
2014-09-192014-10-31
47F/199/CC

Compilation of comments on 47F/178/CD: IEC 62047-26 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
2014-08-15?
47F/201/RVC

Result of voting on 47F/166/CDV: IEC 62047-17 Ed.1 : Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
2014-08-15yes
47F/198/RVN

Result of voting on 47F/187/NP: Future IEC 62047-28: Semiconductor devices - Micro-electromechanical devices - Part 28: Vibration-driven MEMS electret energy harvesting devices
2014-08-08?
47F/196/DC

Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2014-07-252014-09-26
47F/197/DA

This document has been replaced by 47F/197A/DA
2014-07-25
47F/192/CC

Compilation of comments on 47F/177/CD: IEC 62047-1 Ed.2: Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
2014-07-18yes
47F/193/CC

Compilation of comments on 47F/183/CD: IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2014-07-18?
47F/194/CD

IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2014-07-182014-10-24?
47F/191/RVD

Report of Voting on 47F/188/FDIS: IEC 62047-20 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
2014-06-13yes
47F/189/RVD

Report of Voting on 47F/185/FDIS: IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
2014-05-23yes
47F/190/RVD

Report of Voting on 47F/186/FDIS: IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
2014-05-23yes
47F/188/FDIS

IEC 62047-20 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
2014-04-042014-06-06yesVoting Result
47F/185/FDIS

IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
2014-03-142014-05-16yesVoting Result
47F/186/FDIS

IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
2014-03-142014-05-16yesVoting Result
47F/187/NP

Future IEC 62047-28: Semiconductor devices - Micro-electromechanical devices - Part 28: Vibration-driven MEMS electret energy harvesting devices
2014-03-142014-06-20?Voting Result
47F/180/CDV

IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
2014-02-072014-05-09yesVoting Result
47F/181/CDV

IEC 62047-16 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
2014-02-072014-05-09yesVoting Result
47F/184/RVN

Result of voting on 47F/173/NP: Future IEC 62047-27: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
2014-02-07?
47F/152A/RVN

Revised result of voting on 47F/141/NP: Future IEC 62047-25: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area
2014-01-03?
47F/183/CD

IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2014-01-032014-04-04?Report of Comments
47F/182/AC

New WG 1, WG 2 and WG 3 - Call for experts
2013-12-20
47F/169A/CC

Revised compilation of comments on 47F/149/CD: IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
2013-11-29yes
47F/179/RM

Unconfirmed minutes of SC 47F plenary meeting held in London, UK on October 09, 2013
2013-11-29
47F/178/CD

IEC 62047-26 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
2013-11-222014-02-28?Report of Comments
47F/176/RR

Review report on IEC 62047-1 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
2013-11-01yes
47F/177/CD

IEC 62047-1 Ed.2: Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
2013-11-012014-02-07yesReport of Comments
47F/166/CDV

IEC 62047-17 Ed.1 : Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
2013-10-252014-01-31yesVoting Result
47F/175/RVC

Result of voting on 47F/150/CDV: IEC 62047-20 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
2013-10-25yes