International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47F |
Micro-electromechanical systems |
SC 47F Working Documents since 2012-04-06
  Reference, Title | Downloads | Circulation Date | Closing Date | CENELEC | Voting / Comment | Authorized Committees |
|---|---|---|---|---|---|---|
47F/153/NPFuture IEC 62047-26: Semiconductor devices Micro-electromechanical devices Part 26: Description and measurement methods for micro trench and needle structures | 2013-04-05 | 2013-07-05 | ? | |||
47F/147A/CDVIEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials | 2013-04-05 | 2013-07-05 | yes | |||
47F/148/CDVIEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates | 2013-03-29 | 2013-07-05 | yes | |||
47F/152/RVNResult of voting on 47F/141/NP: Future IEC 62047-25: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area
| 2013-03-29 | ? | ||||
47F/151/CDIEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods | 2013-03-22 | 2013-05-24 | ? | |||
47F/149/CDIEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass | 2013-02-22 | 2013-05-24 | ? | |||
47F/135A/CCRevised compilation of comments on 47F/135/CC: IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass | 2013-02-22 | ? | ||||
47F/143A/RVCResult of voting on 47F/113/CDV: IEC 62047-11 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for Linear Thermal Expansion Coefficients of Freestanding MEMS materials
| 2013-02-22 | yes | ||||
47F/147/CDVThis document has been replaced by 47F/147A/CDV
| 2013-01-25 | yes | ||||
47F/146/CDIEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films | 2013-01-11 | 2013-04-12 | ? | |||
47F/132A/CCRevised compilation of comments on 47F/121/CD: IEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
| 2012-12-21 | ? | ||||
47F/144/RVCResult of voting on 47F/117/CDV: IEC 62047-19 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
| 2012-12-07 | yes | ||||
47F/145/RMUnconfirmed Minutes of SC 47F Plenary Meeting held in Jeju, Korea on October 24, 2012 | 2012-12-07 | |||||
47F/134A/CCRevised compilation of comments on 47F/125/CD: IEC 62047-16 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods | 2012-12-07 | ? | ||||
47F/136A/CCRevised compilation of comments on 47F/127/CD: IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials | 2012-12-07 | yes | ||||
47F/137A/CCRevised compilation of comments on 47F/128/CD: IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates | 2012-12-07 | yes | ||||
47F/138A/CCRevised compilation of comments on 47F/130/CD: IEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes | 2012-12-07 | yes | ||||
47F/143/RVCThis document has been replaced by 47F/143A/CC | 2012-11-30 | yes | ||||
47F/142/RVCResult of voting on 47F/120/CDV: IEC 62047-18 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials | 2012-11-23 | yes | ||||
47F/139/NPFuture IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: General rules for the assessment of micro-geometrical parameters | 2012-11-16 | 2013-02-22 | ? | Voting Result | ||
47F/140/NPFuture IEC 62047-24: Semiconductor devices - Micro-electromechanical devices - Part 24: Silicon-based MEMS fabrication technology - Basic regulation for layout design | 2012-11-16 | 2013-02-22 | ? | Voting Result | ||
47F/141/NPFuture IEC 62047-25: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area | 2012-11-16 | 2013-02-22 | ? | Voting Result | ||
47F/136/CCCompilation of comments on 47F/127/CD: IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials | 2012-10-19 | yes | ||||
47F/137/CCCompilation of comments on 47F/128/CD: IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates | 2012-10-19 | yes | ||||
47F/138/CCCompilation of comments on 47F/130/CD: IEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes | 2012-10-19 | yes | ||||
47F/135/CCCompilation of comments on 47F/135/CC: IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass | 2012-10-12 | ? | ||||
47F/134/CCCompilation of comments on 47F/125/CD: IEC 62047-16 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods | 2012-10-05 | ? | ||||
47F/133/PWProgramme of Work of SC 47F as recorded by the IEC Central Office in its database. | 2012-09-28 | |||||
47F/124A/DARevised draft agenda for the meeting to be held in Jeju, Korea, on 2012-10-24 (09:00 h to 12:30 h) | 2012-09-28 | |||||
47F/131/INFReport of Comments on 47F/123/DC: Maintenance - call for comments/proposals on publications coming up for review and a call for experts | 2012-09-21 | |||||
47F/132/CCCompilation of comments on 47F/121/CD: IEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
| 2012-09-21 | ? | ||||
47F/127/CDIEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials | 2012-08-10 | 2012-10-12 | yes | Report of Comments | ||
47F/128/CDIEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates | 2012-08-10 | 2012-10-12 | yes | Report of Comments | ||
47F/129/CCCompilation of comments on 47F/122/CD - IEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes | 2012-08-10 | yes | ||||
47F/130/CDIEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes | 2012-08-10 | 2012-10-12 | yes | Report of Comments | ||
47F/112A/RVNRevised result of voting on 47F/96/NP: Future IEC 62047-22: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates | 2012-08-10 | yes | ||||
47F/126/CDIEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass | 2012-08-03 | 2012-10-05 | ? | Report of Comments | ||
47F/115A/RVNRevised result of voting on 47F/106/NP: Future IEC 62047-15: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass | 2012-08-03 | ? | ||||
47F/125/CDIEC 62047-16 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods | 2012-07-27 | 2012-09-28 | ? | Report of Comments | ||
47F/116A/RVNResult of voting on 47F/107/NP: Future IEC 62047-16: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods | 2012-07-27 | ? | ||||
47F/123/DCMaintenance - call for comments/ proposals on publications coming up for review and a call for experts
| 2012-07-20 | 2012-09-14 | Report of Comments | |||
47F/124/DADraft agenda for the meeting to be held in Jeju, Korea, on 2012-10-24 (09:00 h to 12:30 h) | 2012-07-20 | |||||
47F/122/CDIEC 62047-20 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes | 2012-04-06 | 2012-06-08 | yes | Report of Comments | ||
47F/110A/RVNRevised result of voting on 47F/91/NP: Future IEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
| 2012-04-06 | yes |
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