International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Working Documents since 2013-04-17

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47F/188/FDIS

IEC 62047-20 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
2014-04-042014-06-06yes
47F/185/FDIS

IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
2014-03-142014-05-16yes
47F/186/FDIS

IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
2014-03-142014-05-16yes
47F/187/NP

Future IEC 62047-28: Semiconductor devices - Micro-electromechanical devices - Part 28: Vibration-driven MEMS electret energy harvesting devices
2014-03-142014-06-20?
47F/180/CDV

IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
2014-02-072014-05-09yes
47F/181/CDV

IEC 62047-16 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
2014-02-072014-05-09yes
47F/184/RVN

Result of voting on 47F/173/NP: Future IEC 62047-27: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
2014-02-07?
47F/152A/RVN

Revised result of voting on 47F/141/NP: Future IEC 62047-25: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area
2014-01-03?
47F/183/CD

IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
2014-01-032014-04-04?Report of Comments
47F/182/AC

New WG 1, WG 2 and WG 3 - Call for experts
2013-12-20
47F/169A/CC

Revised compilation of comments on 47F/149/CD: IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
2013-11-29yes
47F/179/RM

Unconfirmed minutes of SC 47F plenary meeting held in London, UK on October 09, 2013
2013-11-29
47F/178/CD

IEC 62047-26 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
2013-11-222014-02-28?Report of Comments
47F/176/RR

Review report on IEC 62047-1 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
2013-11-01yes
47F/177/CD

IEC 62047-1 Ed.2: Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
2013-11-012014-02-07yesReport of Comments
47F/166/CDV

IEC 62047-17 Ed.1 : Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
2013-10-252014-01-31yesVoting Result
47F/175/RVC

Result of voting on 47F/150/CDV: IEC 62047-20 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
2013-10-25yes
47F/160A/DA

Revised draft agenda for the meeting to be held in London, UK on 2013-10-09 (14:00 h to 17:30 h)
2013-09-06
47F/173/NP

Future IEC 62047-27: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
2013-09-062013-12-06?Voting Result
47F/174/PW

Programme of Work of SC 47F as recorded by the IEC Central Office in its database
2013-09-06
47F/169/CC

Compilation of comments on 47F/149/CD: IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
2013-08-30yes
47F/170/CC

Compilation of comments on 47F/151/CD: IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
2013-08-30yes
47F/171/RVC

Result of voting on 47F/147A/CDV: IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
2013-08-30yes
47F/172/RVC

Result of voting on 47F/148/CDV: IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
2013-08-30yes
47F/167/DC

Structures and tasks of new working groups - call for comments/ proposals
2013-08-232013-10-04Report of Comments
47F/168/INF

Report of Comments on 47F/159/DC: Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2013-08-23
47F/165/CC

Compilation of comments on 47F/146/CD: IEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
2013-08-09yes
47F/164/RVN

Compilation of comments on 47F/153/NP: Future IEC 62047-26: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
2013-07-12?
47F/161/RVD

Report of Voting on 47F/154/FDIS: IEC 62047-11 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
2013-07-05yes
47F/162/RVD

Report of Voting on 47F/155/FDIS: IEC 62047-18 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
2013-07-05yes
47F/163/RVD

Report of Voting on 47F/156/FDIS: IEC 62047-19 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
2013-07-05yes
47F/159/DC

Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2013-06-142013-08-16Report of Comments
47F/160/DA

Draft agenda for the meeting to be held in London, UK on 2013-10-09 (14:00 h to 17:30 h)
2013-06-14
47F/150/CDV

IEC 62047-20 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
2013-05-172013-09-06yesVoting Result
47F/157/RVN

Compilation of comments on 47F/139/NP: Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: General rules for the assessment of micro-geometrical parameters
2013-05-03?
47F/158/RVN

Compilation of comments on 47F/140/NP: Future IEC 62047-24: Semiconductor devices Micro-electromechanical devices Part 24: Silicon-based MEMS fabrication technology - Basic regulation for layout design
2013-05-03?
47F/154/FDIS

IEC 62047-11 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
2013-04-262013-06-28yesVoting Result
47F/155/FDIS

IEC 62047-18 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
2013-04-262013-06-28yesVoting Result
47F/156/FDIS

IEC 62047-19 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
2013-04-262013-06-28yesVoting Result