International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Working Documents since 2016-08-18

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Authorized

Committees

47F/273A/RVC

Revised result of voting on 47F/263/CDV - IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

2017-08-04 N
47F/268A/RVN

Result of Voting on 47F/255/NP - Future IEC 62047-32: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators

2017-07-28 N
47F/287/CD

IEC 62047-32 ED1: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators

2017-07-28 2017-09-22 N
47F/285/RVN

Result of Voting on 47F/276/NP - PNW 47F-276: Semiconductor devices - Micro-electromechanical devices - Part 35: Standard test procedure for the anti-failure robustness of flexible or foldable electro-mechanical devices against bending deformation

2017-07-14 U
47F/286/FDIS

IEC 62047-30 ED1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

2017-07-14 2017-08-25 N
47F/269A/RVN

Revised result of voting on 47F/256/NP - Future IEC 62047-33: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

2017-07-07 N
47F/270A/RVN

Revised result of voting on 47F/257/NP - Future IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device

2017-07-07 N
47F/274A/RVN

Revised result of voting on 47F/272/NP - PNW 47F-272: Future IEC 62047-XX Semiconductor devices – Micro-electromechanical devices – Part XX: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

2017-07-07 N
TC 49
47F/281/CD

IEC 62047-36 ED1: Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

2017-07-07 2017-09-01 N
TC 49
47F/282/CD

IEC 62047-33 ED1: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

2017-07-07 2017-09-01 N
47F/283/CD

IEC 62047-34 ED1: Semiconductor devices - Micro-electromechanical devices - Part 34: Test method for MEMS piezoresistive pressure-sensitive device on wafer

2017-07-07 2017-09-01 N
47F/284/DA

Draft agenda for the meeting to be held in Vladivostok, Russia, on 2017-10-12 (starting time: 9:30 to approximate finishing time: 12:00)

2017-07-07 N/A
47F/277A/RVC

Revised result of voting on 47F/254/CDV - IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

2017-06-30 N
47F/280/DC

Maintenance – call for comments/ proposals on publications coming up for review and a call for experts

2017-06-30 2017-08-25 N/A
47F/279/AC

Appointment of a secretary and an assistant secretary

2017-06-23 N/A
47F/278/RQ

Result of Questionnaire on 47F/275/Q: Questionnaire on the nomination of a new Co-Convenor of WG 2 (Characterizations and testing methods of materials and structures for microelectromechanical systems)

2017-06-02 N/A
47F/277/RVC

Result of Voting on 47F/254/CDV - IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

2017-05-05 N
47F/275/Q

Questionnaire on the nomination of a new Co-Convenor of WG 2 (Characterizations and testing methods of materials and structures for microelectromechanical systems)

2017-04-14 2017-05-26 N/A Report of Comments
47F/276/NP

PNW 47F-276: Semiconductor devices - Micro-electromechanical devices - Part 35: Standard test procedure for the anti-failure robustness of flexible or foldable electro-mechanical devices against bending deformation

2017-04-14 2017-07-07 U Voting Result
47F/274/RVN

Result of Voting on 47F/272/NP - PNW 47F-272: Future IEC 62047-XX Semiconductor devices – Micro-electromechanical devices – Part XX: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

2017-04-07 N
TC 49
47F/273/RVC

Result of Voting on 47F/263/CDV - IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

2017-02-17 N
47F/268/RVN

Result of Voting on 47F/255/NP - Future IEC 62047-32: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators

2016-12-16 N
47F/269/RVN

Result of Voting on 47F/256/NP - Future IEC 62047-33: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

2016-12-16 N
47F/270/RVN

Result of Voting on 47F/257/NP - Future IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device

2016-12-16 N
47F/271/RVD

Result of Voting on 47F/266/FDIS - IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

2016-12-16 Y
47F/272/NP

PNW 47F-272: Future IEC 62047-XX Semiconductor devices – Micro-electromechanical devices – Part XX: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

2016-12-16 2017-03-10 N Voting Result
TC 49
47F/263/CDV

IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

2016-11-11 2017-02-03 N Voting Result
47F/267/RM

Unconfirmed minutes of SC 47F plenary meeting held at Room VDE-Ohm held in Frankfurt, Germany on Oct. 05, 2016

2016-11-04 N/A
47F/266/FDIS

IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

2016-10-28 2016-12-09 Y Voting Result
47F/254/CDV

IEC 62047-30 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

2016-10-14 2017-01-06 N Voting Result
47F/260A/INF

Report of comments on 47F/247/DC: Maintenance - call for comments/ proposals on publications coming up for review and a call for experts

2016-09-23 N/A
47F/248A/DA

Revised draft agenda for the meeting to be held in Frankfurt, Germany on 2016-10-05 (14:00 h to 17:30 h)

2016-09-09 N/A
47F/262/RVN

Result of voting on 47F/246/NP: Future IEC 62047-31: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2016-09-09 U
47F/264/INF

Review of Active Participation of P-members in the Work of SC 47F

2016-09-09 N/A
47F/265/PW

Programme of Work of SC 47F as recorded by the IEC Central Office in its database

2016-09-09 N/A
47F/259/RVC

Result of voting on 47F/230A/CDV: IEC 62047-27 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

2016-09-02 Y
47F/260/INF

This document has been replaced by 47F/260A/INF

2016-09-02 N/A
47F/261/RVC

Result of voting on 47F/242/CDV: IEC 62047-28 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

2016-09-02 Y
47F/255/NP

Future IEC 62047-32: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators

2016-08-26 2016-11-18 N Voting Result
47F/256/NP

Future IEC 62047-33: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

2016-08-26 2016-11-18 N Voting Result
47F/257/NP

Future IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device

2016-08-26 2016-11-18 N Voting Result
47F/258/CC

Compilation of comments on 47F/243/CD: IEC 62047-29 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

2016-08-26 N