International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Boîtiers des dispositifs semi-conducteurs

 
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SC 47D Document de Travail depuis 2015-09-30

Référence, Titre
Downloads

Date de

Circulation

Date de

Fermeture

CENELEC

Votes /

Commentaires

Comit?s

Authoris?s

47D/885/RVD

Rapport de vote sur le 47D/878

2016-09-16 yes
47D/880A/DA

[Revised draft agenda for the meeting to be held in Frankfurt, Germany, from 2016-10-05 (starting time: 9:00) to 2016-10-06 (approximate finishing time: 17:00)]

Titre français non disponible

2016-09-09
47D/883/INF

[Review of Active Participation of P-members in the Work of SC 47D]

Titre français non disponible

2016-09-09
47D/884/PW

[Programme of Work of SC 47D as recorded by the IEC Central Office in its database]

Titre français non disponible

2016-09-09
47D/881/RR

[Review report on IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages]

Titre français non disponible

2016-08-26 yes
47D/882/CD

[Amendment 1 to IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages]

Titre français non disponible

2016-08-26 2016-11-18 yes
47D/879/DC

[Maintenance - call for comments/ proposals on publications coming up for review and a call for experts ]

Titre français non disponible

2016-08-12 2016-09-30
47D/880/DA

[Draft agenda for the meeting to be held in Frankfurt, Germany, from 2016-10-05 (starting time: 9:00) to 2016-10-06 (approximate finishing time: 17:00)]

Titre français non disponible

2016-08-12
47D/878/FDIS

IEC 60191-6-13 Ed.2: Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-13: Guide de conception pour les supports sans couvercle pour les boîtiers matriciels à billes et à pas fins (FBGA) et les boîtiers matriciels à zone de contact plate et à pas fins (FLGA)

2016-07-29 2016-09-09 yes Voting Result
47D/875/RVC

[Result of voting on 47D/863/CDV: IEC 60191-2 f70 Ed.1: Proposed new package outline - P-ZMP-P165]

Titre français non disponible

2016-05-27 no
47D/876/RVC

[Result of voting on 47D/864/CDV: IEC 60191-2 f71 Ed.1: Proposed new package outline - P-ZMP-P89]

Titre français non disponible

2016-05-27 no
47D/877/CC

[Compilation of comments on 47D/870/CD: IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax]

Titre français non disponible

2016-05-27 no
47D/874/RM

[Unconfirmed Minutes of SC 47D Meeting held in Minsk, Belarus, from 7 to 8 October, 2015]

Titre français non disponible

2016-03-11
47D/873/RVN

[Result of voting on 47D/869A/NP: Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound]

Titre français non disponible

2016-02-19 ?
47D/871/RVN

[Result of voting on 47D/860/NP: Standardization of semiconductor mechanical test methodology - Package warpage test sample preparation method by using BGA solder ball removal tool]

Titre français non disponible

2016-01-15 ?
47D/872/RVN

[Result of voting on 47D/866/NP: Future IEC 60191-7 Ed.1: Package thermal characteristics guideline in semiconductor products]

Titre français non disponible

2016-01-15 ?
47D/867A/CC

[Revised compilation of comments on 47D/862A/CD: IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax]

Titre français non disponible

2015-10-30 no
47D/870/CD

[IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax]

Titre français non disponible

2015-10-30 2016-01-01 no Report of Comments
47D/869A/NP

[Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound]

Titre français non disponible

2015-10-09 2015-12-25 ?