International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Boîtiers des dispositifs semi-conducteurs

 
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SC 47D Document de Travail depuis 2016-07-27

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Date de

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CENELEC

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Authoris?s

47D/894/NP

[PNW 47D-894: Future IEC 60191-7: Mechanical standardization of semiconductor devices – Part 7: Requirements to design electronics devices using thermal characteristics of semiconductor packages]

Titre français non disponible

2017-07-14 2017-09-08 U
47D/895/NP

[PNW 47D-895: Future IEC 60191-8: Mechanical standardization of semiconductor devices – Part 8: Requirements to Semiconductor Devices Packaging Materials from the Environment point of View - Low Cl and Br Molding Compound]

Titre français non disponible

2017-07-14 2017-09-08 U
TC 111
47D/892/RM

[Unconfirmed Minutes of SC 47D Meeting held in Frankfurt, Germany on October 5 to 6 October, 2016]

Titre français non disponible

2017-07-07 N/A
47D/893/DA

[Draft agenda for the meeting to be held in Regensburg, Germany, from 2017-09-11 (starting time: 9:00) to 2017-09-12 (approximate finishing time: 17:00)]

Titre français non disponible

2017-07-07 N/A
47D/891/RQ

[Result of Questionnaire on 47D/890/Q: Nomination of a new convenor of SC 47D / WG 1: Package outlines]

Titre français non disponible

2017-06-30 N/A
47D/890/Q

[Nomination of a new convenor of SC 47D/WG 1: Package outlines]

Titre français non disponible

2017-05-12 2017-06-23 N/A Report of Comments
47D/889/AC

[Next meeting of SC 47D to be held in Regensburg, Germany from 11 to 12 September 2017 (online registration)]

Titre français non disponible

2017-05-05 N/A
47D/888/AC

[Next meeting of SC 47D to be held in Regensburg, Germany on 11 and 12 September 2017 (announcement)]

Titre français non disponible

2017-03-24 N/A
47D/886/CDV

[IEC 60191-1 Ed.3: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices]

Titre français non disponible

2016-12-23 2017-03-17 Y Voting Result
47D/887/CC

[Compilation of Comments on 47D/882/CD - Amendment 1 to IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages]

Titre français non disponible

2016-11-25 Y
47D/851A/CC

[Compilation of comments on 47D/842/CD: IEC 60191-1 Ed.3: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices]

Titre français non disponible

2016-10-21 Y
47D/885/RVD

Rapport de vote sur le 47D/878

2016-09-16 Y
47D/880A/DA

[Revised draft agenda for the meeting to be held in Frankfurt, Germany, from 2016-10-05 (starting time: 9:00) to 2016-10-06 (approximate finishing time: 17:00)]

Titre français non disponible

2016-09-09 N/A
47D/883/INF

[Review of Active Participation of P-members in the Work of SC 47D]

Titre français non disponible

2016-09-09 N/A
47D/884/PW

[Programme of Work of SC 47D as recorded by the IEC Central Office in its database]

Titre français non disponible

2016-09-09 N/A
47D/881/RR

[Review report on IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages]

Titre français non disponible

2016-08-26 Y
47D/882/CD

[Amendment 1 to IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages]

Titre français non disponible

2016-08-26 2016-11-18 Y Report of Comments
47D/879/DC

[Maintenance - call for comments/ proposals on publications coming up for review and a call for experts ]

Titre français non disponible

2016-08-12 2016-09-30 N/A Report of Comments
47D/880/DA

[Draft agenda for the meeting to be held in Frankfurt, Germany, from 2016-10-05 (starting time: 9:00) to 2016-10-06 (approximate finishing time: 17:00)]

Titre français non disponible

2016-08-12 N/A
47D/878/FDIS

IEC 60191-6-13 Ed.2: Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-13: Guide de conception pour les supports sans couvercle pour les boîtiers matriciels à billes et à pas fins (FBGA) et les boîtiers matriciels à zone de contact plate et à pas fins (FLGA)

2016-07-29 2016-09-09 Y Voting Result