International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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SC 47D Working Documents since 2013-12-20

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47D/857A/DA

Revised draft agenda for the meeting to be held in Tokyo, Japan, from 2014-11-13 (starting time: 9:00) to 2014-11-14 (approximate finishing time: 17:00)
2014-10-17
47D/858/PW

Programme of Work of SC 47D as recorded by the IEC Central Office in its database
2014-10-17
47D/851/CC

Compilation of comments on 47D/842/CD: IEC 60191-1 Ed.3: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
2014-08-22yes
47D/852/CC

Compilation of comments on 47D/844/CD: IEC 60191-2/F70 Ed.1: Proposed new package outline - P-ZMP-P165
2014-08-22no
47D/853/CC

Compilation of comments on 47D/845/CD: IEC 60191-2/F71 Ed.1: Proposed new package outline - P-ZMP-P89
2014-08-22no
47D/854/RVC

Result of voting on 47D/850A/CDV: IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
2014-08-22yes
47D/855/INF

Compilation of comments on 47D/847/DC: Proposal for a future IEC Technical Report on Glossary for Semiconductor device packages - Semiconductor package name and parts name
2014-08-22
47D/856/DC

Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2014-08-222014-10-24Report of Comments
47D/857/DA

Draft agenda for the meeting to be held in Tokyo, Japan, from 2014-11-13 (starting time: 9:00) to 2014-11-14 (approximate finishing time: 17:00)
2014-08-22
47D/850A/CDV

IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
2014-03-282014-07-04yesVoting Result
47D/850/CDV

This document has been replaced by 47D/850A/CDV
2014-02-28yes
47D/839A/CC

Revised compilation of comments on 47D/834/CD: IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
2013-12-20yes