International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
export to xls file

SC 47D Working Documents since 2013-09-22

sort upsort down
Reference, Title
Downloads
sort down

Circulation

Date

sort upsort down

Closing

Date

sort upsort down
CENELEC

Voting /

Comment

Comit?s

Authoris?s

47D/851/CC

Compilation of comments on 47D/842/CD: IEC 60191-1 Ed.3: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
2014-08-22yes
47D/852/CC

Compilation of comments on 47D/844/CD: IEC 60191-2/F70 Ed.1: Proposed new package outline - P-ZMP-P165
2014-08-22no
47D/853/CC

Compilation of comments on 47D/845/CD: IEC 60191-2/F71 Ed.1: Proposed new package outline - P-ZMP-P89
2014-08-22no
47D/854/RVC

Result of voting on 47D/850A/CDV: IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
2014-08-22yes
47D/855/INF

Compilation of comments on 47D/847/DC: Proposal for a future IEC Technical Report on Glossary for Semiconductor device packages - Semiconductor package name and parts name
2014-08-22
47D/856/DC

Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2014-08-222014-10-24
47D/857/DA

Draft agenda for the meeting to be held in Tokyo, Japan, from 2014-11-13 (starting time: 9:00) to 2014-11-14 (approximate finishing time: 17:00)
2014-08-22
47D/850A/CDV

IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
2014-03-282014-07-04yesVoting Result
47D/850/CDV

This document has been replaced by 47D/850A/CDV
2014-02-28yes
47D/839A/CC

Revised compilation of comments on 47D/834/CD: IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
2013-12-20yes
47D/830A/RVD

Report of Voting on 47D/829/FDIS: IEC 60191-6-5 Ed.2: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
2013-10-25yes
47D/833A/RR

Review report on IEC 60191-6-16 Ed.1: Semiconductor Packaging - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
2013-10-25yes
47D/840A/CC

Compilation of comments on 47D/835/CD: IEC 60191-6-16 Ed.2: Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
2013-10-25yes
47D/849/RM

Unconfirmed Minutes of SC 47D Meeting held in London, United Kingdom, from 9 to 10 October, 2013
2013-10-25
47D/848/RVD

Report of Voting on 47D/837/FDIS: IEC 60191-4 Ed. 3: Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
2013-09-27yes