International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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SC 47D Working Documents since 2014-08-30

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47D/852A/CC

Revised compilation of comments on 47D/844/CD: IEC 60191-2/F70 Ed.1: Proposed new package outline - P-ZMP-P165
2015-07-10no
47D/853A/CC

Revised compilation of comments on 47D/845/CD: IEC 60191-2/F71 Ed.1: Proposed new package outline - P-ZMP-P89
2015-07-10no
47D/862A/CD

IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax
2015-07-102015-09-04no
47D/865/DA

Draft agenda for the meeting to be held in Minsk, Belarus, from 2015-10-08 (starting time: 9:00) to 2015-10-09 (approximate finishing time: 17:00)
2015-07-10
47D/866/NP

Future IEC 60191-7 Ed.1: Package thermal characteristics guideline in semiconductor products
2015-07-102015-10-16?
47D/862/CD

This document has been replaced by 47D/862A/CD
2015-07-032015-09-04no
47D/860/NP

Standardization of semiconductor mechanical test methodology - Package warpage test sample preparation method by using BGA solder ball removal tool
2015-06-262015-10-02?
47D/861/RR

Review report on IEC 60191-2 Ed.1: Mechanical standardization of semiconductor devices. Part 2: Dimensions
2015-06-26no
47D/859/RM

Unconfirmed Minutes of SC 47D Meeting held in Tokyo, Japan, from 13 to 14 November, 2014
2015-01-16
47D/857A/DA

Revised draft agenda for the meeting to be held in Tokyo, Japan, from 2014-11-13 (starting time: 9:00) to 2014-11-14 (approximate finishing time: 17:00)
2014-10-17
47D/858/PW

Programme of Work of SC 47D as recorded by the IEC Central Office in its database
2014-10-17