International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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SC 47D Working Documents since 2015-10-02

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Comit?s

Authoris?s

47D/885/RVD

Report of Voting on 47D/878/FDIS: IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

2016-09-16 yes
47D/880A/DA

Revised draft agenda for the meeting to be held in Frankfurt, Germany, from 2016-10-05 (starting time: 9:00) to 2016-10-06 (approximate finishing time: 17:00)

2016-09-09
47D/883/INF

Review of Active Participation of P-members in the Work of SC 47D

2016-09-09
47D/884/PW

Programme of Work of SC 47D as recorded by the IEC Central Office in its database

2016-09-09
47D/881/RR

Review report on IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2016-08-26 yes
47D/882/CD

Amendment 1 to IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2016-08-26 2016-11-18 yes
47D/879/DC

Maintenance - call for comments/ proposals on publications coming up for review and a call for experts

2016-08-12 2016-09-30 Report of Comments
47D/880/DA

Draft agenda for the meeting to be held in Frankfurt, Germany, from 2016-10-05 (starting time: 9:00) to 2016-10-06 (approximate finishing time: 17:00)

2016-08-12
47D/878/FDIS

IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

2016-07-29 2016-09-09 yes Voting Result
47D/875/RVC

Result of voting on 47D/863/CDV: IEC 60191-2 f70 Ed.1: Proposed new package outline - P-ZMP-P165

2016-05-27 no
47D/876/RVC

Result of voting on 47D/864/CDV: IEC 60191-2 f71 Ed.1: Proposed new package outline - P-ZMP-P89

2016-05-27 no
47D/877/CC

Compilation of comments on 47D/870/CD: IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax

2016-05-27 no
47D/874/RM

Unconfirmed Minutes of SC 47D Meeting held in Minsk, Belarus, from 7 to 8 October, 2015

2016-03-11
47D/873/RVN

Result of voting on 47D/869A/NP: Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound

2016-02-19 ?
47D/871/RVN

Result of voting on 47D/860/NP: Standardization of semiconductor mechanical test methodology - Package warpage test sample preparation method by using BGA solder ball removal tool

2016-01-15 ?
47D/872/RVN

Result of voting on 47D/866/NP: Future IEC 60191-7 Ed.1: Package thermal characteristics guideline in semiconductor products

2016-01-15 ?
47D/867A/CC

Revised compilation of comments on 47D/862A/CD: IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax

2015-10-30 no
47D/870/CD

IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax

2015-10-30 2016-01-01 no Report of Comments
47D/869A/NP

Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound

2015-10-09 2015-12-25 ?