International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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SC 47D Working Documents since 2016-08-24

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Authorized

Committees

47D/893A/DA

Revised draft agenda for the meeting to be held in Regensburg, Germany, from 2017-09-11 (starting time: 9:00) to 2017-09-12 (approximate finishing time: 17:00)

2017-08-04 N/A
47D/898/INF

Review of Active Participation of P-members in the Work of SC 47D

2017-08-04 N/A
47D/896/RVC

Result of Voting on 47D/886/CDV - IEC 60191-1 Ed.3: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

2017-07-28 Y
47D/894/NP

PNW 47D-894: Future IEC 60191-7: Mechanical standardization of semiconductor devices – Part 7: Requirements to design electronics devices using thermal characteristics of semiconductor packages

2017-07-14 2017-09-08 U
47D/895/NP

PNW 47D-895: Future IEC 60191-8: Mechanical standardization of semiconductor devices – Part 8: Requirements to Semiconductor Devices Packaging Materials from the Environment point of View - Low Cl and Br Molding Compound

2017-07-14 2017-09-08 U
TC 111
47D/892/RM

Unconfirmed Minutes of SC 47D Meeting held in Frankfurt, Germany on October 5 to 6 October, 2016

2017-07-07 N/A
47D/893/DA

Draft agenda for the meeting to be held in Regensburg, Germany, from 2017-09-11 (starting time: 9:00) to 2017-09-12 (approximate finishing time: 17:00)

2017-07-07 N/A
47D/891/RQ

Result of Questionnaire on 47D/890/Q: Nomination of a new convenor of SC 47D / WG 1: Package outlines

2017-06-30 N/A
47D/890/Q

Nomination of a new convenor of SC 47D/WG 1: Package outlines

2017-05-12 2017-06-23 N/A Report of Comments
47D/889/AC

Next meeting of SC 47D to be held in Regensburg, Germany from 11 to 12 September 2017 (online registration)

2017-05-05 N/A
47D/888/AC

Next meeting of SC 47D to be held in Regensburg, Germany on 11 and 12 September 2017 (announcement)

2017-03-24 N/A
47D/886/CDV

IEC 60191-1 Ed.3: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

2016-12-23 2017-03-17 Y Voting Result
47D/887/CC

Compilation of Comments on 47D/882/CD - Amendment 1 to IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2016-11-25 Y
TC 40
TC 91
47D/851A/CC

Compilation of comments on 47D/842/CD: IEC 60191-1 Ed.3: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

2016-10-21 Y
47D/885/RVD

Report of Voting on 47D/878/FDIS: IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

2016-09-16 Y
47D/880A/DA

Revised draft agenda for the meeting to be held in Frankfurt, Germany, from 2016-10-05 (starting time: 9:00) to 2016-10-06 (approximate finishing time: 17:00)

2016-09-09 N/A
47D/883/INF

Review of Active Participation of P-members in the Work of SC 47D

2016-09-09 N/A
47D/884/PW

Programme of Work of SC 47D as recorded by the IEC Central Office in its database

2016-09-09 N/A
47D/881/RR

Review report on IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2016-08-26 Y
TC 40
TC 91
47D/882/CD

Amendment 1 to IEC 60191-4 Ed.3: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2016-08-26 2016-11-18 Y Report of Comments
TC 40
TC 91