International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
SC 47D Working Documents since 2012-02-05
  Reference, Title | Downloads | Circulation Date | Closing Date | CENELEC | Voting / Comment | Authorized Committees |
|---|---|---|---|---|---|---|
47D/831/RMUnconfirmed Minutes of SC 47D Meeting held in Jeju, Korea from 24 to 25 October, 2012 | 2013-01-25 | |||||
47D/830/RVDReport of Voting on 47D/829/FDIS: IEC 60191-6-5 Ed.2: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
| 2012-12-14 | yes | ||||
47D/829/FDISIEC 60191-6-5 Ed.2: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) | 2012-10-05 | 2012-12-07 | yes | Voting Result | TC 91 | |
47D/826A/DARevised draft agenda for the meeting to be held in Jeju, Korea, from 2012-10-24 (starting time: 9:00) to 2012-10-25 (approximate finishing time: 17:00) | 2012-09-28 | |||||
47D/828/PWProgramme of work of SC 47D as recorded by the IEC Central Office in its database. | 2012-09-28 | |||||
47D/827/INFCompilation of comments on 47D/825/DC: Maintenance - call for comments/ proposals on publications coming up for review and a call for experts | 2012-08-31 | |||||
47D/826/DADraft agenda for the meeting to be held in Jeju, Korea, from 2012-10-24 (starting time: 9:00) to 2012-10-25 (approximate finishing time: 17:00) | 2012-07-13 | |||||
47D/825/DCMaintenance call for comments/ proposals on publications coming up for review and a call for experts
| 2012-06-01 | 2012-08-03 | Report of Comments | |||
47D/820/RVCResult of voting on 47D/812/CDV: IEC 60191-6-22 Ed. 1: Mechanical Standardization Of Semiconductor Devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) | 2012-05-18 | yes | ||||
47D/824/RVCResult of voting on IEC 60191-2 f69 Ed.1: IEC 60191-2 f69 Ed.1: Proposed new package outline - flange mount package with flat leads, P-SFM-F8 - To be published as outline 187E, if approved.
| 2012-05-18 | no | ||||
47D/823/RVCResult of voting on IEC 60191-2 f68 Ed.1: IEC 60191-2 f68 Ed.1: Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F, if approved.
| 2012-05-18 | no | ||||
47D/822/RVCResult of voting on IEC 60191-2 f67 Ed.1: IEC 60191-2 f67 Ed.1: Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved.
| 2012-05-18 | no | ||||
47D/821/RVCResult of voting on IEC 60191-2 f66 Ed.1: Proposed new package outline - large power package with 4 load terminals, P-UMP-A4. To be published as outline 184B, if approved | 2012-05-18 | no | ||||
47D/812F/CDVIEC 60191-6-22 Ed. 1: Mechanical Standardization Of Semiconductor Devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) | 2012-02-17 | yes |
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