International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
export to xls file

SC 47D Working Documents since 2015-05-30

sort upsort down
Reference, Title
Downloads
sort down

Circulation

Date

sort upsort down

Closing

Date

sort upsort down
CENELEC

Voting /

Comment

Authorized

Committees

47D/875/RVC

Result of voting on 47D/863/CDV: IEC 60191-2 f70 Ed.1: Proposed new package outline - P-ZMP-P165
2016-05-27no
47D/876/RVC

Result of voting on 47D/864/CDV: IEC 60191-2 f71 Ed.1: Proposed new package outline - P-ZMP-P89
2016-05-27no
47D/877/CC

Compilation of comments on 47D/870/CD: IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax
2016-05-27no
47D/874/RM

Unconfirmed Minutes of SC 47D Meeting held in Minsk, Belarus, from 7 to 8 October, 2015
2016-03-11
47D/873/RVN

Result of voting on 47D/869A/NP: Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound
2016-02-19?
47D/871/RVN

Result of voting on 47D/860/NP: Standardization of semiconductor mechanical test methodology - Package warpage test sample preparation method by using BGA solder ball removal tool
2016-01-15?
47D/872/RVN

Result of voting on 47D/866/NP: Future IEC 60191-7 Ed.1: Package thermal characteristics guideline in semiconductor products
2016-01-15?
47D/867A/CC

Revised compilation of comments on 47D/862A/CD: IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax
2015-10-30no
47D/870/CD

IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax
2015-10-302016-01-01noReport of Comments
47D/869A/NP

Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound
2015-10-092015-12-25?
47D/869/NP

This document has been replaced by 47D/869A/NP
2015-09-25?
TC 111
47D/863/CDV

IEC 60191-2 f70 Ed.1: Proposed new package outline - P-ZMP-P165
2015-09-182015-12-18noVoting Result
47D/864/CDV

IEC 60191-2 f71 Ed.1: Proposed new package outline - P-ZMP-P89
2015-09-182015-12-18noVoting Result
47D/854A/RVC

Revised result of voting on 47D/850A/CDV: IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
2015-09-11yes
47D/865A/DA

Revised draft agenda for the meeting to be held in Minsk, Belarus, from 2015-10-08 (starting time: 9:00) to 2015-10-09 (approximate finishing time: 17:00)
2015-09-11
47D/867/CC

Compilation of comments on 47D/862A/CD: IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax
2015-09-11no
47D/868/PW

Programme of Work of SC 47D as recorded by the IEC Central Office in its database
2015-09-11
47D/852A/CC

Revised compilation of comments on 47D/844/CD: IEC 60191-2/F70 Ed.1: Proposed new package outline - P-ZMP-P165
2015-07-10no
47D/853A/CC

Revised compilation of comments on 47D/845/CD: IEC 60191-2/F71 Ed.1: Proposed new package outline - P-ZMP-P89
2015-07-10no
47D/862A/CD

IEC 60191-2 f72 Ed.1: Proposed new package outline - P-UMP-Ax
2015-07-102015-09-04no
47D/865/DA

Draft agenda for the meeting to be held in Minsk, Belarus, from 2015-10-08 (starting time: 9:00) to 2015-10-09 (approximate finishing time: 17:00)
2015-07-10
47D/866/NP

Future IEC 60191-7 Ed.1: Package thermal characteristics guideline in semiconductor products
2015-07-102015-10-16?Voting Result
47D/862/CD

This document has been replaced by 47D/862A/CD
2015-07-03no
47D/860/NP

Standardization of semiconductor mechanical test methodology - Package warpage test sample preparation method by using BGA solder ball removal tool
2015-06-262015-10-02?Voting Result
47D/861/RR

Review report on IEC 60191-2 Ed.1: Mechanical standardization of semiconductor devices. Part 2: Dimensions
2015-06-26no