International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 
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TC 91 Document de Travail depuis 2015-05-06

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91/1363/RVD

Rapport de vote sur le 91/1350
2016-04-29yes
91/1364/RVD

Rapport de vote sur le 91/1351
2016-04-29yes
91/1358/CC

[Compilation of comments on 91/1344/CD: IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method]

Titre français non disponible
2016-04-15?
91/1359/FDIS

[IEC 61636 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA) (IEEE 1636-2009)]

Titre français non disponible
2016-04-152016-05-27?
91/1360/FDIS

[IEC 61636-1 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML) (IEEE 1636.1 - 2013)]

Titre français non disponible
2016-04-152016-05-27?
91/1361/FDIS

[IEC 61636-99 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements (IEEE 1636.99 - 2013)]

Titre français non disponible
2016-04-152016-05-27?
91/1362/FDIS

[IEC 63055 Ed.1: IEEE Standard Format for LSI-Package-Board Interoperable Design (IEEE 2401-2015)]

Titre français non disponible
2016-04-152016-05-27?
91/1356/RVD

Rapport de vote sur le 91/1345
2016-04-08yes
91/1357/NP

[Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design]

Titre français non disponible
2016-04-082016-06-03?
91/1353A/NP

[Future IEC 61189-5-504 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)]

Titre français non disponible
2016-03-252016-05-20?
91/1355/RVC

[Result of voting on 91/1255/CDV: IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications]

Titre français non disponible
2016-03-25yes
91/1336/CDV

[IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards]

Titre français non disponible
2016-03-182016-06-10yes
91/1352/RVN

[Result of voting on 91/1321/NP: Future IEC 62878-2-5: Device embedded substrate - Part 2-5: Implementation of 3D data format requirements for device embedded substrate]

Titre français non disponible
2016-03-18?
91/1353/NP

[This document has been replaced by 91/1353A/NP]

Titre français non disponible
2016-03-18?
91/1354/RVC

[Result of voting on 91/1273/CDV: IEC 61189-5-1 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies]

Titre français non disponible
2016-03-18yes
91/1349/DTR

[IEC/TR 63051 Ed.1: Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)]

Titre français non disponible
2016-03-112016-05-13no
91/1350/FDIS

IEC 61249-2-43 Ed.1: Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-43: Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/papier cellulose époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb
2016-03-112016-04-22yesVoting Result
91/1351/FDIS

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-44: Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non-tissé époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb
2016-03-112016-04-22yesVoting Result
91/1348/DTS

[IEC/TS 61189-3-301 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB]

Titre français non disponible
2016-03-042016-06-10no
91/1347/RQ

[Result of Questionnaire on 91/1337/Q : Proposal to withdraw IEC 61182-1 Ed.1.0, IEC 61182-7 Ed.1.0, IEC 61182-10 Ed.1.0, IEC 60097 Ed.4.0 and IEC 62014-1 Ed.1.0. ]

Titre français non disponible
2016-02-26
91/1345/FDIS

IEC 60068-3-13 Ed.1: Essais d'environnement - Partie 3-13: Documentation d'accompagnement et guide sur les essais T - Brasage
2016-02-192016-04-01yesVoting Result
91/1346/RVN

[Result of voting on 91/1291/NP: Future IEC/TS 61189-3-XXX: Appearance Inspection Method for Plated Surfaces on PWB]

Titre français non disponible
2016-02-19no
91/1326/CDV

IEC 60068-2-69 Ed.3: Essais d'environnement: Partie 2-69: Essais - Essai Te: Essai de brasabilité des composants et cartes électroniques par la méthode de la balance de mouillage (mesure de la force)
2016-02-122016-05-13yes
91/1344/CD

[IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method]

Titre français non disponible
2016-02-122016-04-08?Report of Comments
91/1343A/RM

[Unconfirmed Minutes of the TC 91 Plenary meeting held in Dongguan, China on October 30 in 2015]

Titre français non disponible
2016-01-22
91/1342/CC

[Compilation of comments on 91/1319/CD: IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction]

Titre français non disponible
2016-01-15yes
91/1343/RM

[This document has been replaced by 91/1343A/RM]

Titre français non disponible
2016-01-15
91/1333/CC

[Compilation of comments on 91/1276/CD: IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies]

Titre français non disponible
2016-01-08yes
91/1334/CC

[Compilation of comments on 91/1285/CD: IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies]

Titre français non disponible
2016-01-08yes
91/1335/CC

[Compilation of comments on 91/1290/CD: IEC 61191-4 Ed.2: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies]

Titre français non disponible
2016-01-08yes
91/1337/Q

[Questionnaire: Proposal to withdraw IEC 61182-1 Ed.1.0, IEC 61182-7 Ed. 1.0, IEC 61182-10 Ed. 1.0, IEC 60097 Ed. 4.0 and IEC 62014-1 Ed.1.0 ]

Titre français non disponible
2016-01-082016-02-19Report of Comments
91/1338/RVD

[Report of Voting on 91/1314/FDIS: IEC 61671-2 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description (IEEE 1671.2 - 2012)]

Titre français non disponible
2016-01-08?
91/1339/RVD

[Report of Voting on 91/1315/FDIS: IEC 61671-4 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration (IEEE 1671.4 - 2014)]

Titre français non disponible
2016-01-08?
91/1340/RVD

[Report of Voting on 91/1316/FDIS: IEC 61671-5 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description (IEEE 1671.5 - 2015)]

Titre français non disponible
2016-01-08?
91/1341/RVD

[Report of Voting on 91/1317/FDIS: IEC 61671-6 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description (IEEE 1671.6 - 2015)]

Titre français non disponible
2016-01-08?
91/1332/RVC

[Result of voting on 91/1286/CDV: IEC 61189-2-719 Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)]

Titre français non disponible
2016-01-01yes
91/1330/RVD

Rapport de vote sur le 91/1311
2015-12-25yes
91/1331/RVN

[Result of voting on 91/1297/NP: Future IEC 62878-1: Device embedded substrate - Generic specification]

Titre français non disponible
2015-12-25?
91/1328/RVD

Rapport de vote sur le 91/1304a
2015-12-11yes
91/1329/CC

[Compilation of comments on 91/1300/CD: IEC 61191-3 Ed.2: Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies]

Titre français non disponible
2015-12-11yes
91/1324/CC

[Compilation of comments on 91/1307/CD: IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards]

Titre français non disponible
2015-12-04yes
91/1325/CC

[Compilation of comments on 91/1190/CD: IEC 60068-2-69 Ed. 3: Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method ]

Titre français non disponible
2015-12-04yes
91/1327/RVD

Rapport de vote sur le 91/1303
2015-12-04yes
91/1321/NP

[Future IEC 62878-2-5: Device embedded substrate - Part 2-5: Implementation of 3D data format requirements for device embedded substrate]

Titre français non disponible
2015-11-272016-03-04?Voting Result
TC 40
TC 47
TC 86
91/1322/RR

[Review report on IEC 61189-5 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies ]

Titre français non disponible
2015-11-27yes
91/1323/RVC

[Result of voting on 91/1265/CDV: IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing]

Titre français non disponible
2015-11-27yes
91/1104B/RVC

[Result of voting on 91/1078/CDV: IEC 62699 Ed.1: Mapping rules and exchange methods for heterogeneous parts libraries ]

Titre français non disponible
2015-11-20no
91/1312/RVC

[Result of voting on 91/1175/CDV: IEC 61249-2-43 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly]

Titre français non disponible
2015-11-13yes
91/1320/RVC

[Result of voting on 91/1176/CDV: IEC 61249-2-44 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly ]

Titre français non disponible
2015-11-13yes
91/1318/CD

[IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies]

Titre français non disponible
2015-11-062016-01-08yesReport of Comments
TC 40
91/1319/CD

[IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction]

Titre français non disponible
2015-11-062016-01-08yesReport of Comments
91/1313/RVN

[Result of voting on 91/1266/NP: Future IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods]

Titre français non disponible
2015-10-23?
91/1314/FDIS

[IEC 61671-2 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description (IEEE 1671.2 - 2012)]

Titre français non disponible
2015-10-232015-12-25?Voting Result
91/1315/FDIS

[IEC 61671-4 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration (IEEE 1671.4 - 2014)]

Titre français non disponible
2015-10-232015-12-25?Voting Result
91/1316/FDIS

[IEC 61671-5 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description (IEEE 1671.5 - 2015)]

Titre français non disponible
2015-10-232015-12-25?Voting Result
91/1317/FDIS

[IEC 61671-6 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description (IEEE 1671.6 - 2015)]

Titre français non disponible
2015-10-232015-12-25?Voting Result
91/1277B/DA

[Revised draft agenda for the TC 91 meeting to be held in Dongguan, China on 2015-10-30 from 9:00 am to 5:00 pm]

Titre français non disponible
2015-10-09
91/1304A/FDIS

IEC 61189-3-913 Ed.1: Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 3-913: Méthodes d'essai pour la conductivité thermique des circuits imprimés pour les LED à forte luminosité
2015-10-092015-11-27yesVoting Result
91/1305A/PW

[Programme of Work of TC 91 as recorded by the IEC Central Office in its database]

Titre français non disponible
2015-10-09
91/1311/FDIS

IEC 62326-20 Ed.1: Cartes imprimées - Partie 20: Cartes de circuits imprimés destinées aux LED à haute luminosité
2015-10-092015-12-11yesVoting Result
91/1308/RVC

[Result of voting on 91/1283/DTR: IEC/TR 63017 Ed.1: Guideline for Impedance Compensation with Using Noise Suppression Materials for FPCB - Impedance measuring method and impedance compensation method for impedance variation of FPCBs using NSMs with prevailing TDR method]

Titre français non disponible
2015-10-02no
91/1309/RVC

[Result of voting on 91/1284/DTR: IEC/TR 63018 Ed.1: Guideline for Improvement of Signal Loss with Using Noise Suppression Materials for FPCB - Signal loss measuring method and signal loss improvement method for impedance variation of FPCBs using NSMs]

Titre français non disponible
2015-10-02no
91/1310/RQ

[Result of Questionnaire on 91/1282/Q : Proposal to withdraw IEC 61188-1-1 Ed.1.0 and IEC 61188-1-2 Ed.1.0]

Titre français non disponible
2015-10-02
91/1277A/DA

[This document has been replaced by 91/1277B/DA]

Titre français non disponible
2015-09-25
91/1303/FDIS

IEC 61189-3-719 Ed.1: Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 3-719: Méthodes d'essai pour les structures d'interconnexion (cartes imprimées) - Contrôles de la variation de résistance des trous métallisés uniques (PTH) au cours des cycles de températures
2015-09-252015-11-27yesVoting Result
91/1304/FDIS

[This document has been replaced by 91/1304A/FDIS]

Titre français non disponible
2015-09-25yes
91/1305/PW

[This document has been replaced by 91/1305A/PW]

Titre français non disponible
2015-09-25
91/1306/RVN

[Result of voting on 91/1269/NP: Future IEC 61189-5-503: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards]

Titre français non disponible
2015-09-25yes
91/1307/CD

[IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards]

Titre français non disponible
2015-09-252015-11-27yesReport of Comments
91/1301/NP

[Future IEC 61189-2-XXX Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-XXX: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning ]

Titre français non disponible
2015-09-182015-12-18?Voting Result
91/1302/RVN

[Result of voting on 91/1247/NP: Future IEC 61188-8-2: Component shape data specification for CAD library Part 2: 3D shape data specifications ]

Titre français non disponible
2015-09-18?
91/1286/CDV

IEC 61189-2-719 Ed.1: Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-719: Méthodes d'essai pour les cartes imprimées et les matériaux d'assemblage - Permittivité relative et tangente de perte (500 MHz à 10 GHz)
2015-09-112015-12-11yesVoting Result
91/1298/RVD

[Report of Voting on 91/1274/FDIS: IEC 63003 Ed.1: IEEE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505 (IEEE 1505.1-2008)]

Titre français non disponible
2015-09-04?
91/1299/RVD

[Report of Voting on 91/1275/FDIS: IEC 63004 Ed.1: IEEE Standard for Receiver Fixture Interface (IEEE 1505-2010)]

Titre français non disponible
2015-09-04?
91/1300/CD

[IEC 61191-3 Ed.2: Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies]

Titre français non disponible
2015-09-042015-11-06yesReport of Comments
91/1273/CDV

IEC 61189-5-1 Ed.1: Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-1: Méthodes d'essai générales pour les matériaux et assemblages - Lignes directrices pour les assemblages de cartes à circuit imprimé
2015-08-282015-12-04yesVoting Result
91/1293/RQ

[Result of Questionnaire on 91/1278/Q: IEEE 1671.2-2012 - IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description]

Titre français non disponible
2015-08-28
91/1294/RQ

[Result of Questionnaire on 91/1279/Q: IEEE 1671.4-2014 - IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration]

Titre français non disponible
2015-08-28
91/1295/RQ

[Result of Questionnaire on 91/1280/Q: IEEE 1671.5-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description]

Titre français non disponible
2015-08-28
91/1296/RQ

[Result of Questionnaire on 91/1281/Q: IEEE 1671.6-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description]

Titre français non disponible
2015-08-28
91/1297/NP

[Future IEC 62878-1: Device embedded substrate - Generic specification]

Titre français non disponible
2015-08-282015-12-04?Voting Result
TC 40
TC 47
91/1249A/INF

[Revised comments received on 91/1233/DC: Proposed new framework of IEC 61189-5]

Titre français non disponible
2015-08-21
91/1292/DC

[Proposed withdrawal of IEC 61189-5-601, 5-602, 5-603]

Titre français non disponible
2015-08-212015-10-09Report of Comments
91/1265/CDV

IEC 62739-2 Ed. 1: Méthode d'essai de l'érosion de l'équipement de brasage à la vague utilisant un alliage à braser sans plomb fondu - Partie 2: Méthode d'essai d'érosion de matériaux métalliques avec traitement de surface
2015-08-142015-11-20yesVoting Result
91/1291/NP

[Future IEC/TS 61189-3-XXX: Appearance Inspection Method for Plated Surfaces on PWB]

Titre français non disponible
2015-08-142015-11-20noVoting Result
91/1289/RR

[Review report on IEC 61188-7 Ed.1: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction]

Titre français non disponible
2015-08-07yes
91/1290/CD

[IEC 61191-4 Ed.2: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies]

Titre français non disponible
2015-08-072015-10-09yesReport of Comments
91/1288/AC

[Next meeting of TC 91 to be held in Dongguan, China from 26 to 30 October 2015 (online registration)]

Titre français non disponible
2015-07-24
91/1287/RVC

[Result of voting on 91/1241/CDV: IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering]

Titre français non disponible
2015-07-17yes
91/1277/DA

[Draft agenda for the TC 91 meeting to be held in Dongguan, China on 2015-10-30 from 9:00 am to 5:00 pm]

Titre français non disponible
2015-07-03
91/1278/Q

[IEEE 1671.2-2012 - IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description]

Titre français non disponible
2015-07-032015-08-21Report of Comments
91/1279/Q

[IEEE 1671.4-2014 - IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration]

Titre français non disponible
2015-07-032015-08-21Report of Comments
91/1280/Q

[IEEE 1671.5-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description]

Titre français non disponible
2015-07-032015-08-21Report of Comments
91/1281/Q

[IEEE 1671.6-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description]

Titre français non disponible
2015-07-032015-08-21Report of Comments
91/1282/Q

[Questionnaire: Proposal to withdraw IEC 61188-1-1 Ed.1.0 and IEC 61188-1-2 Ed.1.0 ]

Titre français non disponible
2015-07-032015-09-25Report of Comments
91/1283/DTR

[IEC/TR 63017 Ed.1: Guideline for Impedance Compensation with Using Noise Suppression Materials for FPCB - Impedance measuring method and impedance compensation method for impedance variation of FPCBs using NSMs with prevailing TDR method]

Titre français non disponible
2015-07-032015-09-04noVoting Result
91/1284/DTR

[IEC/TR 63018 Ed.1: Guideline for Improvement of Signal Loss with Using Noise Suppression Materials for FPCB - Signal loss measuring method and signal loss improvement method for impedance variation of FPCBs using NSMs]

Titre français non disponible
2015-07-032015-09-04noVoting Result
91/1285/CD

[IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies]

Titre français non disponible
2015-07-032015-09-04yesReport of Comments
91/1274/FDIS

[IEC 63003 Ed.1: IEEE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505 (IEEE 1505.1-2008)]

Titre français non disponible
2015-06-262015-08-28?Voting Result
91/1275/FDIS

[IEC 63004 Ed.1: IEEE Standard for Receiver Fixture Interface (IEEE 1505-2010)]

Titre français non disponible
2015-06-262015-08-28?Voting Result
91/1276/CD

[IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies]

Titre français non disponible
2015-06-262015-08-28yesReport of Comments
91/1270/INF

[Comments received on 91/1256/DC: Maintenance - Call for comments / proposals for amendment / revision on IEC 62090 Edition 1.0 and call for experts for maintenance team]

Titre français non disponible
2015-06-19
91/1271/RR

[Review report on IEC 62090 Ed.1: Product package labels for electronic components using bar code and two-dimensional symbologies]

Titre français non disponible
2015-06-19yes
91/1272/CC

[Compilation of comments on 91/1272/CC: IEC 61189-5-1 Ed.1: Test methods for electrical materials, Interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks]

Titre français non disponible
2015-06-19yes
91/1264/RVD

[Report of Voting on 91/1257/PAS: IEC/PAS 62878-2-5 Ed.1: Device embedded substrate - Guidelines - Data format]

Titre français non disponible
2015-06-12?
91/1266/NP

[Future IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods]

Titre français non disponible
2015-06-122015-09-18?Voting Result
91/1267/RR

[Review report on IEC 61191-1 Ed.2: Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies]

Titre français non disponible
2015-06-12yes
91/1268/RR

[Review report on IEC 61191-2 Ed.2: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies]

Titre français non disponible
2015-06-12yes
91/1269/NP

[Future IEC 61189-5-503: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards]

Titre français non disponible
2015-06-122015-09-18yesVoting Result
91/1255/CDV

[IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications]

Titre français non disponible
2015-05-292015-09-04yesVoting Result
91/1262/RVC

[Result of voting on 91/1214/CDV: IEC 61189-3-913 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies- Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs]

Titre français non disponible
2015-05-29yes
91/1263/RVC

[Result of voting on 91/1219/CDV: IEC 62326-20 Ed.1: Printed boards - Part 20: Printed circuit board for high-brightness LEDs]

Titre français non disponible
2015-05-29yes
91/1252A/CC

[Compilation of comments on 91/1221/CD: IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing]

Titre français non disponible
2015-05-15yes
91/1261/AC

[Next meeting of TC 91 to be held in Dongguan, China from 26 to 30 October 2015 (announcement)]

Titre français non disponible
2015-05-08