International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 
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TC 91 Document de Travail depuis 2016-02-28

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Date de

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91/1433/FDIS

[IEC 61189-5-503 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards]

Titre français non disponible

2017-02-24 2017-04-07 Y
91/1431/INF

[Next TC 91 Working Group meetings to be held in Sapporo, Japan from 12 to 16 June 2017 (registration)]

Titre français non disponible

2017-02-17 N/A
91/1432/RQ

[Result of Questionnaire 91/1416/Q: Proposal for a new scope for TC 91]

Titre français non disponible

2017-02-17 N/A
91/1417A/INF

[Next TC 91 Working Group meetings to be held in Sapporo, Japan from 12 to 16 June 2017 (announcement)]

Titre français non disponible

2017-02-10 N/A
91/1419/CDV

[IEC 61760-4/AMD1 ED1: Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices]

Titre français non disponible

2017-02-10 2017-05-05 Y
91/1427/INF

[Comments received on 91/1398/DC : Proposed new framework of IEC 61188-5]

Titre français non disponible

2017-02-03 N/A
91/1428/RVC

[Result of Voting on 91/1382/CDV - IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction]

Titre français non disponible

2017-02-03 Y
91/1429/RVC

[Result of Voting on 91/1386/CDV - IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies]

Titre français non disponible

2017-02-03 Y
91/1430/RVC

[Result of Voting on 91/1394/CDV - IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies]

Titre français non disponible

2017-02-03 Y
91/1423/NP

[PNW 91-1423: Future IEC 61249-2-45 Ed.1.0: Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly]

Titre français non disponible

2017-01-27 2017-03-24 U
91/1424/NP

[PNW 91-1424: Future IEC 61249-2-46 Ed.1.0: Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly]

Titre français non disponible

2017-01-27 2017-03-24 U
91/1425/NP

[PNW 91-1425: Future IEC 61249-2-47 Ed.1.0: Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly]

Titre français non disponible

2017-01-27 2017-03-24 U
91/1426/RVD

[Result of Voting on 91/1405/FDIS - IEC 60068-2-69 ED3: Environmental testing: Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method]

Titre français non disponible

2017-01-27 Y
91/1352A/RVN

[Revised result of voting on 91/1321/NP - Future IEC 62878-2-5: Device embedded substrate - Part 2-5: Implementation of 3D data format requirements for device embedded substrate]

Titre français non disponible

2017-01-13 U
91/1417/INF

[Replaced by 91/1417A/INF]

Titre français non disponible

2017-01-13 N/A
91/1421/CD

[IEC 60194-2 ED1: Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies]

Titre français non disponible

2017-01-06 2017-03-31 N
TC 40
TC 47
SC 47A
SC 47D
91/1422/CD

[IEC 60068-2-82 ED2: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components ]

Titre français non disponible

2017-01-06 2017-03-31 Y
TC 47
91/1402/CDV

[Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)]

Titre français non disponible

2016-12-30 2017-03-24 Y
TC 23
TC 40
TC 47
TC 48
TC 51
91/1420/RR

[Review report of IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions]

Titre français non disponible

2016-12-30 N
TC 40
TC 47
SC 47A
SC 47D
91/1375/CDV

[IEC 61191-3 Ed.2: Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies]

Titre français non disponible

2016-12-23 2017-03-17 Y
91/1399/CDV

[IEC 61191-4 Ed.2: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies ]

Titre français non disponible

2016-12-23 2017-03-17 Y
91/1418/RR

Essais d'environnement - Partie 2-21: Essais - Essai U: Robustesse des sorties et des dispositifs de montage incorporés

2016-12-23 Y
91/1406/INF

[Comments received on 91/1393/DC: Maintenance – Call for comments / proposals for amendment / revisions on IEC 61760-1 Ed.2.0 and call for experts for maintenance team]

Titre français non disponible

2016-12-16 N/A
91/1407/RR

[Review report of IEC 61182-1 Ed.1: Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form]

Titre français non disponible

2016-12-16 U
91/1408/RR

[Review report of IEC 61182-7 Ed.1: Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form]

Titre français non disponible

2016-12-16 Y
91/1409/RR

[Review report of IEC 61182-10 Ed.1: Printed boards - Electronic data description and transfer - Part 10: Electronic data hierarchy]

Titre français non disponible

2016-12-16 U
91/1410/RM

[Unconfirmed Minutes of the TC 91 Plenary meeting held in Frankfurt, Germany on October 14, in 2016]

Titre français non disponible

2016-12-16 N/A
91/1411/RR

[Review report of IE 61182-2 Ed.1: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements ]

Titre français non disponible

2016-12-16 N
91/1412/RR

[Review report of IE 61182-2-2 Ed.1: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description]

Titre français non disponible

2016-12-16 Y
91/1413/RR

[Review report of IEC 60097 Ed.4: Grid systems for printed circuits]

Titre français non disponible

2016-12-16 U
91/1414/RR

[Review report of IEC 62014-1 Ed.1: Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2)]

Titre français non disponible

2016-12-16 Y
91/1415/RR

[Review report of IEC 61760-4 Ed.1: Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices]

Titre français non disponible

2016-12-16 Y
91/1416/Q

[Questionnaire: Proposal for a new scope for TC 91]

Titre français non disponible

2016-12-16 2017-01-27 N/A Report of Comments
91/1405/FDIS

IEC 60068-2-69 ED3: Essais d'environnement: Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilité des composants électroniques et cartes imprimées par la méthode de la balance de mouillage (mesure de la force)

2016-12-02 2017-01-13 Y Voting Result
91/1404/RVC

[Result of voting on 91/1336/CDV: IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards]

Titre français non disponible

2016-11-18 Y
91/1394/CDV

[IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies]

Titre français non disponible

2016-10-28 2017-01-20 Y Voting Result
TC 40
91/1400/RVC

[Result of voting on 91/1368/CDV: IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method]

Titre français non disponible

2016-10-28 Y
91/1401/CC

[Compilation of comments on 91/1389/CD: Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)]

Titre français non disponible

2016-10-28 Y
91/1403/RVC

[Result of voting on 91/1378/DTR: IEC/TR 61189-3-914 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines]

Titre français non disponible

2016-10-28 N
91/1387A/CC

[Compilation of comments on 91/1318/CD: IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies]

Titre français non disponible

2016-10-21 Y
91/1398/DC

[Proposed new framework of IEC 61188-5]

Titre français non disponible

2016-10-21 2016-12-02 N/A Report of Comments
91/1386/CDV

[IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies]

Titre français non disponible

2016-10-07 2016-12-30 Y Voting Result
91/1374A/DA

[Revised draft agenda for the TC 91 meeting to be held in Frankfurt, Germany on 2016-10-14 from 9:00 am to 5:00 pm]

Titre français non disponible

2016-09-16 N/A
91/1382/CDV

[IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction]

Titre français non disponible

2016-09-16 2016-12-09 Y Voting Result
91/1395/INF

[Review of Active Participation of P-members in the Work of TC 91]

Titre français non disponible

2016-09-16 N/A
91/1396/RVC

[Result of voting on 91/1349/DTR: IEC/TR 63051 Ed.1: Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)]

Titre français non disponible

2016-09-16 N
91/1397/PW

[Programme of Work of TC 91 as recorded by the IEC Central Office in its database]

Titre français non disponible

2016-09-16 N/A
91/1391/RVN

[Result of voting on 91/1301/NP: Future IEC 61189-2-XXX Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-XXX: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning]

Titre français non disponible

2016-08-26 U
91/1392/RR

[Review report on IEC 60068-2-82 Ed.1: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components ]

Titre français non disponible

2016-08-26 Y
TC 47
91/1393/DC

[Maintenance - Call for comments / proposals for amendment / revisions on IEC 61760-1 Ed. 2.0 and call for experts for maintenance team]

Titre français non disponible

2016-08-26 2016-10-07 N/A Report of Comments
91/1390/AC

[Next meeting of TC 91 to be held in London, Chiswick, United Kingdom from 16 to 20 October 2017]

Titre français non disponible

2016-08-19 N/A
91/1387/CC

[This document has been replaced by 91/1387A/CC]

Titre français non disponible

2016-08-12 Y
91/1388/RR

[Review report on IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)]

Titre français non disponible

2016-08-12 Y
91/1389/CD

[Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)]

Titre français non disponible

2016-08-12 2016-10-07 Y Report of Comments
TC 23
TC 40
TC 47
TC 48
TC 51
91/1384/INF

[Comments received on 91/1377/DC: Maintenance Call for comments / proposals for amendment / Revision on IEC 60068-2-21, Edition 6.0 and call for experts for maintenance team]

Titre français non disponible

2016-08-05 N/A
91/1385/CC

[Compilation of comments on 91/1367/CD: IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies]

Titre français non disponible

2016-08-05 Y
91/1368/CDV

[IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method]

Titre français non disponible

2016-07-29 2016-10-21 Y Voting Result
91/1383/RVC

[Result of voting on 91/1326/CDV: IEC 60068-2-69 Ed.3: Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method]

Titre français non disponible

2016-07-29 Y
91/1381/RVN

[Result of voting on 91/1357/NP: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design]

Titre français non disponible

2016-07-08 U
91/1378/DTR

[IEC/TR 61189-3-914 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines]

Titre français non disponible

2016-06-24 2016-08-26 N Voting Result
91/1379/RVD

Rapport de vote sur le 91/1365

2016-06-24 Y
91/1380/RVD

Rapport de vote sur le 91/1366

2016-06-24 Y
91/1329A/CC

[Revised compilation of comments on 91/1300/CD: IEC 61191-3 Ed.2: Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies]

Titre français non disponible

2016-06-17 Y
91/1334A/CC

[Compilation of comments on 91/1285/CD: IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies]

Titre français non disponible

2016-06-17 Y
91/1335A/CC

[Compilation of comments on 91/1290/CD: IEC 61191-4 Ed.2: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies]

Titre français non disponible

2016-06-17 Y
91/1376/RVC

[Result of voting on 91/1348/DTS: IEC/TS 61189-3-301 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB]

Titre français non disponible

2016-06-17 N
91/1377/DC

[Maintenance - Call for comments / proposals for amendment / revision on IEC 60068-2-21, Edition 6.0 and call for experts for maintenance team]

Titre français non disponible

2016-06-17 2016-07-29 N/A Report of Comments
91/1374/DA

[Draft agenda for the TC 91 meeting to be held in Frankfurt, Germany on 2016-10-14 from 9:00 am to 5:00 pm]

Titre français non disponible

2016-06-10 N/A
91/1370/RVD

[Report of Voting on 91/1359/FDIS: IEC 61636 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA) (IEEE 1636-2009)]

Titre français non disponible

2016-06-03 U
91/1371/RVD

[Report of Voting on 91/1360/FDIS: IEC 61636-1 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML) (IEEE 1636.1 - 2013)]

Titre français non disponible

2016-06-03 U
91/1372/RVD

[Report of Voting on 91/1361/FDIS: IEC 61636-99 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements (IEEE 1636.99 - 2013)]

Titre français non disponible

2016-06-03 U
91/1373/RVD

[Report of Voting on 91/1362/FDIS: IEC 63055 Ed.1: IEEE Standard Format for LSI-Package-Board Interoperable Design (IEEE 2401-2015)]

Titre français non disponible

2016-06-03 U
91/1369/INF

[Demise of Dr. Hajime Tomokage, Co- Convener, IEC TC 91 WG 6]

Titre français non disponible

2016-05-27 N/A
91/1367/CD

[IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies]

Titre français non disponible

2016-05-20 2016-07-15 Y Report of Comments
91/1365/FDIS

IEC 62739-2 Ed.1: Méthode d'essai de l'érosion de l'équipement de brasage à la vague utilisant un alliage à braser sans plomb fondu - Partie 2: Méthode d'essai d'érosion de matériaux métalliques avec traitement de surface

2016-05-06 2016-06-17 Y Voting Result
91/1366/FDIS

IEC 61189-2-719 Ed.1: Méthode d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-719: Méthodes d'essai des matériaux pour structures d'interconnexion - Permittivité relative et tangente de perte (500 MHz à 10 GHz)

2016-05-06 2016-06-17 Y Voting Result
91/1363/RVD

Rapport de vote sur le 91/1350

2016-04-29 Y
91/1364/RVD

Rapport de vote sur le 91/1351

2016-04-29 Y
91/1358/CC

[Compilation of comments on 91/1344/CD: IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method]

Titre français non disponible

2016-04-15 Y
91/1359/FDIS

[IEC 61636 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA) (IEEE 1636-2009)]

Titre français non disponible

2016-04-15 2016-05-27 U Voting Result
91/1360/FDIS

[IEC 61636-1 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML) (IEEE 1636.1 - 2013)]

Titre français non disponible

2016-04-15 2016-05-27 U Voting Result
91/1361/FDIS

[IEC 61636-99 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements (IEEE 1636.99 - 2013)]

Titre français non disponible

2016-04-15 2016-05-27 U Voting Result
91/1362/FDIS

[IEC 63055 Ed.1: IEEE Standard Format for LSI-Package-Board Interoperable Design (IEEE 2401-2015)]

Titre français non disponible

2016-04-15 2016-05-27 U Voting Result
91/1356/RVD

Rapport de vote sur le 91/1345

2016-04-08 Y
91/1357/NP

[Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design]

Titre français non disponible

2016-04-08 2016-06-03 U Voting Result
91/1353A/NP

[Future IEC 61189-5-504 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)]

Titre français non disponible

2016-03-25 2016-05-20 U Voting Result
91/1355/RVC

[Result of voting on 91/1255/CDV: IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications]

Titre français non disponible

2016-03-25 Y
91/1336/CDV

[IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards]

Titre français non disponible

2016-03-18 2016-06-10 Y Voting Result
91/1352/RVN

[Result of voting on 91/1321/NP: Future IEC 62878-2-5: Device embedded substrate - Part 2-5: Implementation of 3D data format requirements for device embedded substrate]

Titre français non disponible

2016-03-18 U
91/1353/NP

[This document has been replaced by 91/1353A/NP]

Titre français non disponible

2016-03-18 U
91/1354/RVC

[Result of voting on 91/1273/CDV: IEC 61189-5-1 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies]

Titre français non disponible

2016-03-18 Y
91/1349/DTR

[IEC/TR 63051 Ed.1: Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)]

Titre français non disponible

2016-03-11 2016-05-13 N
91/1350/FDIS

IEC 61249-2-43 Ed.1: Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-43: Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/papier cellulose époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb

2016-03-11 2016-04-22 Y Voting Result
91/1351/FDIS

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-44: Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non-tissé époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb

2016-03-11 2016-04-22 Y Voting Result
91/1348/DTS

[IEC/TS 61189-3-301 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB]

Titre français non disponible

2016-03-04 2016-06-10 N Voting Result