International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Working Documents since 2015-09-27

Reference, Title
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Date

Closing

Date

CENELEC

Voting /

Comment

Comit?s

Authoris?s

91/1374A/DA

Revised draft agenda for the TC 91 meeting to be held in Frankfurt, Germany on 2016-10-14 from 9:00 am to 5:00 pm

2016-09-16
91/1382/CDV

IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

2016-09-16 2016-12-09 yes
91/1395/INF

Review of Active Participation of P-members in the Work of TC 91

2016-09-16
91/1396/RVC

Result of voting on 91/1349/DTR: IEC/TR 63051 Ed.1: Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)

2016-09-16 no
91/1397/PW

Programme of Work of TC 91 as recorded by the IEC Central Office in its database

2016-09-16
91/1391/RVN

Result of voting on 91/1301/NP: Future IEC 61189-2-XXX Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-XXX: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning

2016-08-26 ?
91/1392/RR

Review report on IEC 60068-2-82 Ed.1: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

2016-08-26 yes
91/1393/DC

Maintenance - Call for comments / proposals for amendment / revisions on IEC 61760-1 Ed. 2.0 and call for experts for maintenance team

2016-08-26 2016-10-07
91/1390/AC

Next meeting of TC 91 to be held in London, Chiswick, United Kingdom from 16 to 20 October 2017

2016-08-19
91/1387/CC

Compilation of comments on 91/1318/CD: IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies

2016-08-12 yes
91/1388/RR

Review report on IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2016-08-12 yes
91/1389/CD

Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2016-08-12 2016-10-07 yes
TC 23
TC 40
TC 47
TC 48
TC 51
91/1384/INF

Comments received on 91/1377/DC: Maintenance Call for comments / proposals for amendment / Revision on IEC 60068-2-21, Edition 6.0 and call for experts for maintenance team

2016-08-05
91/1385/CC

Compilation of comments on 91/1367/CD: IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

2016-08-05 yes
91/1368/CDV

IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method

2016-07-29 2016-10-21 yes
91/1383/RVC

Result of voting on 91/1326/CDV: IEC 60068-2-69 Ed.3: Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method

2016-07-29 yes
91/1381/RVN

Result of voting on 91/1357/NP: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design

2016-07-08 ?
91/1378/DTR

IEC/TR 61189-3-914 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

2016-06-24 2016-08-26 no Voting Result
91/1379/RVD

Report of Voting on 91/1365/FDIS: IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

2016-06-24 yes
91/1380/RVD

Report of Voting on 91/1366/FDIS: IEC 61189-2-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

2016-06-24 yes
91/1329A/CC

Revised compilation of comments on 91/1300/CD: IEC 61191-3 Ed.2: Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

2016-06-17 yes
91/1334A/CC

Compilation of comments on 91/1285/CD: IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

2016-06-17 yes
91/1335A/CC

Compilation of comments on 91/1290/CD: IEC 61191-4 Ed.2: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

2016-06-17 yes
91/1376/RVC

Result of voting on 91/1348/DTS: IEC/TS 61189-3-301 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

2016-06-17 no
91/1377/DC

Maintenance - Call for comments / proposals for amendment / revision on IEC 60068-2-21, Edition 6.0 and call for experts for maintenance team

2016-06-17 2016-07-29 Report of Comments
91/1374/DA

Draft agenda for the TC 91 meeting to be held in Frankfurt, Germany on 2016-10-14 from 9:00 am to 5:00 pm

2016-06-10
91/1370/RVD

Report of Voting on 91/1359/FDIS: IEC 61636 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA) (IEEE 1636-2009)

2016-06-03 ?
91/1371/RVD

Report of Voting on 91/1360/FDIS: IEC 61636-1 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML) (IEEE 1636.1 - 2013)

2016-06-03 ?
91/1372/RVD

Report of Voting on 91/1361/FDIS: IEC 61636-99 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements (IEEE 1636.99 - 2013)

2016-06-03 ?
91/1373/RVD

Report of Voting on 91/1362/FDIS: IEC 63055 Ed.1: IEEE Standard Format for LSI-Package-Board Interoperable Design (IEEE 2401-2015)

2016-06-03 ?
91/1369/INF

Demise of Dr. Hajime Tomokage, Co- Convener, IEC TC 91 WG 6

2016-05-27
91/1367/CD

IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

2016-05-20 2016-07-15 yes Report of Comments
91/1365/FDIS

IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

2016-05-06 2016-06-17 yes Voting Result
91/1366/FDIS

IEC 61189-2-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

2016-05-06 2016-06-17 yes Voting Result
91/1363/RVD

Report of Voting on 91/1350/FDIS: IEC 61249-2-43 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

2016-04-29 yes
91/1364/RVD

Report of Voting on 91/1351/FDIS: IEC 61249-2-44 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

2016-04-29 yes
91/1358/CC

Compilation of comments on 91/1344/CD: IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method

2016-04-15 yes
91/1359/FDIS

IEC 61636 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA) (IEEE 1636-2009)

2016-04-15 2016-05-27 ? Voting Result
91/1360/FDIS

IEC 61636-1 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML) (IEEE 1636.1 - 2013)

2016-04-15 2016-05-27 ? Voting Result
91/1361/FDIS

IEC 61636-99 Ed.1: IEEE Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements (IEEE 1636.99 - 2013)

2016-04-15 2016-05-27 ? Voting Result
91/1362/FDIS

IEC 63055 Ed.1: IEEE Standard Format for LSI-Package-Board Interoperable Design (IEEE 2401-2015)

2016-04-15 2016-05-27 ? Voting Result
91/1356/RVD

Report of Voting on 91/1345/FDIS: IEC 60068-3-13 Ed.1: Environmental Testing - Part 3-13: Supporting documentation and guidance on test T - Soldering

2016-04-08 yes
91/1357/NP

Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design

2016-04-08 2016-06-03 ? Voting Result
91/1353A/NP

Future IEC 61189-5-504 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

2016-03-25 2016-05-20 ? Voting Result
91/1355/RVC

Result of voting on 91/1255/CDV: IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

2016-03-25 yes
91/1336/CDV

IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards

2016-03-18 2016-06-10 yes Voting Result
91/1352/RVN

Result of voting on 91/1321/NP: Future IEC 62878-2-5: Device embedded substrate - Part 2-5: Implementation of 3D data format requirements for device embedded substrate

2016-03-18 ?
91/1353/NP

This document has been replaced by 91/1353A/NP

2016-03-18 ?
91/1354/RVC

Result of voting on 91/1273/CDV: IEC 61189-5-1 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

2016-03-18 yes
91/1349/DTR

IEC/TR 63051 Ed.1: Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)

2016-03-11 2016-05-13 no
91/1350/FDIS

IEC 61249-2-43 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

2016-03-11 2016-04-22 yes Voting Result
91/1351/FDIS

IEC 61249-2-44 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

2016-03-11 2016-04-22 yes Voting Result
91/1348/DTS

IEC/TS 61189-3-301 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

2016-03-04 2016-06-10 no Voting Result
91/1347/RQ

Result of Questionnaire on 91/1337/Q : Proposal to withdraw IEC 61182-1 Ed.1.0, IEC 61182-7 Ed.1.0, IEC 61182-10 Ed.1.0, IEC 60097 Ed.4.0 and IEC 62014-1 Ed.1.0.

2016-02-26
91/1345/FDIS

IEC 60068-3-13 Ed.1: Environmental Testing - Part 3-13: Supporting documentation and guidance on test T - Soldering

2016-02-19 2016-04-01 yes Voting Result
91/1346/RVN

Result of voting on 91/1291/NP: Future IEC/TS 61189-3-XXX: Appearance Inspection Method for Plated Surfaces on PWB

2016-02-19 no
91/1326/CDV

IEC 60068-2-69 Ed.3: Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method

2016-02-12 2016-05-13 yes Voting Result
91/1344/CD

IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method

2016-02-12 2016-04-08 yes Report of Comments
91/1343A/RM

Unconfirmed Minutes of the TC 91 Plenary meeting held in Dongguan, China on October 30 in 2015

2016-01-22
91/1342/CC

Compilation of comments on 91/1319/CD: IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

2016-01-15 yes
91/1343/RM

This document has been replaced by 91/1343A/RM

2016-01-15
91/1333/CC

Compilation of comments on 91/1276/CD: IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

2016-01-08 yes
91/1334/CC

This document has been replaced by 91/1334A/CC

2016-01-08 yes
91/1335/CC

This document has been replaced by 91/1335A/CC

2016-01-08 yes
91/1337/Q

Questionnaire: Proposal to withdraw IEC 61182-1 Ed.1.0, IEC 61182-7 Ed. 1.0, IEC 61182-10 Ed. 1.0, IEC 60097 Ed. 4.0 and IEC 62014-1 Ed.1.0

2016-01-08 2016-02-19 Report of Comments
91/1338/RVD

Report of Voting on 91/1314/FDIS: IEC 61671-2 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description (IEEE 1671.2 - 2012)

2016-01-08 no
91/1339/RVD

Report of Voting on 91/1315/FDIS: IEC 61671-4 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration (IEEE 1671.4 - 2014)

2016-01-08 no
91/1340/RVD

Report of Voting on 91/1316/FDIS: IEC 61671-5 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description (IEEE 1671.5 - 2015)

2016-01-08 no
91/1341/RVD

Report of Voting on 91/1317/FDIS: IEC 61671-6 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description (IEEE 1671.6 - 2015)

2016-01-08 no
91/1332/RVC

Result of voting on 91/1286/CDV: IEC 61189-2-719 Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)

2016-01-01 yes
91/1330/RVD

Report of Voting on 91/1311/FDIS: IEC 62326-20 Ed.1: Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

2015-12-25 yes
91/1331/RVN

Result of voting on 91/1297/NP: Future IEC 62878-1: Device embedded substrate - Generic specification

2015-12-25 ?
91/1328/RVD

Report of Voting on 91/1304A/FDIS: IEC 61189-3-913 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs

2015-12-11 yes
91/1329/CC

This document has been replaced by 91/1329A/CC

2015-12-11 yes
91/1324/CC

Compilation of comments on 91/1307/CD: IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards

2015-12-04 yes
91/1325/CC

Compilation of comments on 91/1190/CD: IEC 60068-2-69 Ed. 3: Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method

2015-12-04 yes
91/1327/RVD

Report of Voting on 91/1303/FDIS: IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

2015-12-04 yes
91/1321/NP

Future IEC 62878-2-5: Device embedded substrate - Part 2-5: Implementation of 3D data format requirements for device embedded substrate

2015-11-27 2016-03-04 ? Voting Result
TC 40
TC 47
TC 86
91/1322/RR

Review report on IEC 61189-5 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

2015-11-27 yes
91/1323/RVC

Result of voting on 91/1265/CDV: IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

2015-11-27 yes
91/1104B/RVC

Result of voting on 91/1078/CDV: IEC 62699 Ed.1: Mapping rules and exchange methods for heterogeneous parts libraries

2015-11-20 no
91/1312/RVC

Result of voting on 91/1175/CDV: IEC 61249-2-43 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

2015-11-13 yes
91/1320/RVC

Result of voting on 91/1176/CDV: IEC 61249-2-44 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

2015-11-13 yes
91/1318/CD

IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies

2015-11-06 2016-01-08 yes Report of Comments
TC 40
91/1319/CD

IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

2015-11-06 2016-01-08 yes Report of Comments
91/1313/RVN

Result of voting on 91/1266/NP: Future IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

2015-10-23 yes
91/1314/FDIS

IEC 61671-2 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description (IEEE 1671.2 - 2012)

2015-10-23 2015-12-25 no Voting Result
91/1315/FDIS

IEC 61671-4 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration (IEEE 1671.4 - 2014)

2015-10-23 2015-12-25 no Voting Result
91/1316/FDIS

IEC 61671-5 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description (IEEE 1671.5 - 2015)

2015-10-23 2015-12-25 no Voting Result
91/1317/FDIS

IEC 61671-6 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description (IEEE 1671.6 - 2015)

2015-10-23 2015-12-25 no Voting Result
91/1277B/DA

Revised draft agenda for the TC 91 meeting to be held in Dongguan, China on 2015-10-30 from 9:00 am to 5:00 pm

2015-10-09
91/1304A/FDIS

IEC 61189-3-913 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs

2015-10-09 2015-11-27 yes Voting Result
91/1305A/PW

Programme of Work of TC 91 as recorded by the IEC Central Office in its database

2015-10-09
91/1311/FDIS

IEC 62326-20 Ed.1: Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

2015-10-09 2015-12-11 yes Voting Result
91/1308/RVC

Result of voting on 91/1283/DTR: IEC/TR 63017 Ed.1: Guideline for Impedance Compensation with Using Noise Suppression Materials for FPCB - Impedance measuring method and impedance compensation method for impedance variation of FPCBs using NSMs with prevailing TDR method

2015-10-02 no
91/1309/RVC

Result of voting on 91/1284/DTR: IEC/TR 63018 Ed.1: Guideline for Improvement of Signal Loss with Using Noise Suppression Materials for FPCB - Signal loss measuring method and signal loss improvement method for impedance variation of FPCBs using NSMs

2015-10-02 no
91/1310/RQ

Result of Questionnaire on 91/1282/Q : Proposal to withdraw IEC 61188-1-1 Ed.1.0 and IEC 61188-1-2 Ed.1.0

2015-10-02