International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Working Documents since 2013-12-20

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91/1219/CDV

IEC 62326-20 Ed.1: Printed boards - Part 20: Printed circuit board for high-brightness LEDs
2014-12-192015-03-20yes
91/1223/RVD

Report of Voting on 91/1210/FDIS: IEC 61189-5-2 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
2014-12-12yes
91/1224/RVD

Report of Voting on 91/1211/FDIS: IEC 61189-5-3 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
2014-12-12yes
91/1225/RVD

Report of Voting on 91/1212/FDIS: IEC 61189-5-4 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
2014-12-12yes
91/1226/RVD

Report of Voting on 91/1207/FDIS: IEC 62014-4 Ed.1: IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating and Reusing IP within Tool flows (IEEE 1685-2009)
2014-12-12no
91/1227/RVD

Report of Voting on 91/1208/FDIS: IEC 62014-5 Ed.1: IEEE Standard for Quality of Electronic and Software Intellectual Property used in System and System on Chip (SoC) Designs (IEEE 1734-2011)
2014-12-12no
91/1228/RVD

Report of Voting on 91/1209/FDIS: IEC 61523-4 Ed.1: IEEE Standard for Design and Verification of Low-Power Integrated Circuits (IEEE 1801-2013)
2014-12-12no
91/1229/RR

Review report on IEC 61190-1-3 Ed.2: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
2014-12-12?
91/1230/RQ

Result of Questionnaire on the relevance of IEC 60068-2-77 : 1999 and any necessity to develop a new test method to determine dynamic mechanical shock impact
2014-12-12
91/1231/CD

IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
2014-12-122015-03-13?
91/1214/CDV

IEC 61189-3-913 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies- Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs
2014-12-052015-03-06yes
91/1222/FDIS

IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2014-12-052015-02-06yes
91/1221/CD

IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials with surface processing
2014-11-212015-02-27?
91/1220/DTR

IEC/TR 62878-2-2 Ed. 1: Device embedded substrate - Part 2-2: Guidelines - Electrical testing
2014-10-312015-01-02no
91/1198A/DA

Revised draft agenda for the TC 91 meeting to be held in Tokyo, Japan on 2014-11-14 from 9:00 am to 5.30 pm
2014-10-17
91/1218/PW

Programme of Work of TC 91 as recorded by the IEC Central Office in its database
2014-10-17
91/1203A/RVC

Result of voting on 91/1169/CDV: IEC 61189-2-721 Ed.1: Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
2014-10-10yes
91/1216/INF

Review of publication plan
2014-10-10
91/1217/CC

Compilation of comments on 91/1184/CD: IEC 62326-20 Ed.1: Printed boards - Part 20: Electronic circuit board for high-brightness LEDs
2014-10-10yes
91/1215/CD

IEC 61189-2-719 Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
2014-10-032015-01-09?
91/1207/FDIS

IEC 62014-4 Ed.1: IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating and Reusing IP within Tool flows (IEEE 1685-2009)
2014-09-262014-11-28noVoting Result
91/1208/FDIS

IEC 62014-5 Ed.1: IEEE Standard for Quality of Electronic and Software Intellectual Property used in System and System on Chip (SoC) Designs (IEEE 1734-2011)
2014-09-262014-11-28noVoting Result
91/1209/FDIS

IEC 61523-4 Ed.1: IEEE Standard for Design and Verification of Low-Power Integrated Circuits (IEEE 1801-2013)
2014-09-262014-11-28noVoting Result
91/1210/FDIS

IEC 61189-5-2 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
2014-09-262014-11-28yesVoting Result
91/1211/FDIS

IEC 61189-5-3 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
2014-09-262014-11-28yesVoting Result
91/1212/FDIS

IEC 61189-5-4 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
2014-09-262014-11-28yesVoting Result
91/1213/CC

Compilation of comments on 91/1186/CD: IEC 61189-3-913 Ed.1: Test methods for printed boards - Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
2014-09-26yes
91/1205/RVD

Report of Voting on 91/1188/FDIS: IEC 62137-4 Ed.1: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
2014-09-19yes
91/1206/AC

Chair of TC 91 : Electronics assembly technology
2014-09-192014-12-19Report of Comments
91/1189/CDV

IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
2014-09-122014-12-12yesVoting Result
91/1203/RVC

This document has been replaced by 91/1203A/RVC
2014-09-05yes
91/1204/RVN

Result of voting on 91/1185/NP: Future IEC 61189-2-719: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
2014-09-05?
91/1202/RVC

Result of voting on 91/1127/CDV: IEC 61760-4 Ed.1: Surface mounting technology - Part 4: Standard method for classification, packaging, labelling and handling of moisture sensitive devices
2014-08-22yes
91/1200/RVC

Result of voting on 91/1187/DTR: IEC/TR 62699-1 Ed.1: Mapping rules and exchanges methods for heterogeneous electronic parts libraries - Building an integrated search system
2014-08-01no
91/1201/INF

Demise of Mr Dieter W. Bergman, Chairman of IEC TC 91
2014-08-01
91/1104A/RVC

Compilation of comments on 91/1078/CDV: IEC 62699 Ed.1: Mapping rules and exchange methods for heterogeneous parts libraries
2014-07-18no
91/1193A/Q

Questionnaire on the relevance of IEC 60068-2-77:1999 and any necessity to develop a new test method to determine dynamic mechanical shock impact
2014-07-112014-09-26Report of Comments
TC 3
TC 40
TC 46
TC 47
TC 48
TC 49
TC 51
TC 104
TC 107
TC 109
TC 111
TC 119
91/1199/RVC

Result of voting on 91/1136/CDV: IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2014-07-11yes
91/1190/CD

IEC 60068-2-69 Ed. 3: Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
2014-07-042014-10-10yesReport of Comments
91/1191/CD

IEC 61189-5-1 Ed.1: Test methods for electrical materials, Interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
2014-07-042014-10-10yesReport of Comments
91/1192/RVD

Report of Voting on 91/1182/PAS: IEC/PAS 61182-12 Ed.1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
2014-07-04?
91/1193/Q

This document has been replaced by 91/1193A/Q
2014-07-04
TC 3
TC 40
TC 46
TC 47
TC 48
TC 49
TC 51
TC 104
TC 107
TC 109
TC 111
TC 119
91/1194/RQ

Result of Questionnaire on 91/1170/Q : IEEE 1685-2009 - IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating and Re-using IP within Tool-flows
2014-07-04
91/1195/RQ

Result of Questionnaire on 91/1171/Q : IEEE 1734-2011 - IEEE Standard for Quality of Electronic and Software Intellectual Property used in System and System on Chip (SoC) Designs
2014-07-04
91/1196/RQ

Result of Questionnaire on 91/1172/Q : IEEE 1801-2013 - IEEE Standard for Design and Verification of Low Power Integrated Circuits
2014-07-04
91/1197/INF

Comments received on 91/1153/DC: Maintenance - Call for comments / proposals for amendment / revision on Edition 1.0 of IEC 62137-1-1, IEC 62137-1-2, IEC 62137-1-3, IEC 62137-1-4 and IEC 62137-1-5
2014-07-04
91/1198/DA

Draft agenda for the TC 91 meeting to be held in Tokyo, Japan on 2014-11-14 from 9:00 am to 5.30 pm
2014-07-04
91/1188/FDIS

IEC 62137-4 Ed. 1: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
2014-06-202014-09-05yesVoting Result
91/1163A/RVC

Result of voting on 91/1142/DTS: IEC/TS 62878-2-1 Ed.1: Device Embedded Substrate - Part 2-1: Guidelines - General description of technology
2014-06-13no
91/1164A/RVC

Result of voting on 91/1143/DTS: IEC/TS 62878-2-3 Ed.1: Device Embedded Substrate - Part 2-3: Guidelines - Design Guide
2014-06-13no
91/1165A/RVC

Result of voting on 91/1144/DTS: IEC/TS 62878-2-4 Ed.1: Device Embedded Substrate - Part 2-4: Guidelines - Test element groups (TEG)
2014-06-13no
91/1168A/RVC

Result of voting on 91/1124/CDV: IEC 62878-1-1 Ed.1: Device embedded substrate - Generic specification - Test method
2014-06-13yes
91/1175/CDV

IEC 61249-2-43 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2014-05-232014-09-05yesVoting Result
91/1176/CDV

IEC 61249-2-44 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2014-05-232014-09-05yesVoting Result
91/1187/DTR

IEC/TR 62699-1 Ed.1: Mapping rules and exchanges methods for heterogeneous electronic parts libraries - Building an integrated search system
2014-05-232014-07-25noVoting Result
91/1169/CDV

IEC 61189-2-721 Ed.1: Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
2014-05-092014-08-15yesVoting Result
91/1186/CD

IEC 61189-3-913 Ed.1: Test methods for printed boards - Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
2014-04-182014-06-20yesReport of Comments
91/1183/CC

Compilation of comments on 91/1138A/CD: IEC/TR 62878-2-2 Ed.1: Device embedded substrate - Guidelines - Electrical testing
2014-04-11no
91/1184/CD

IEC 62326-20 Ed.1: Printed boards - Part 20: Electronic circuit board for high-brightness LEDs
2014-04-112014-06-13yesReport of Comments
91/1185/NP

Future IEC 61189-2-719: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
2014-04-112014-07-11?Voting Result
91/1182/PAS

IEC/PAS 61182-12 Ed.1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
2014-04-042014-06-06?Voting Result
91/1181/RVN

Result of voting on 91/1149/NP: FinSimMath, as a model for HDLMath
2014-03-28?
91/1178/RVC

Result of voting on 91/1121/CDV: IEC 61189-5-2 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
2014-03-21yes
91/1179/RVC

Result of voting on 91/1122/CDV: IEC 61189-5-3 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
2014-03-21yes
91/1180/RVC

Result of voting on 91/1123/CDV: IEC 61189-5-4 Ed. 1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
2014-03-21yes
91/1173/RVD

Report of Voting on 91/1156/PAS: IEC/PAS 61249-8-1 Ed.1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
2014-03-14?
91/1174/RVD

Report of Voting on 91/1157/PAS: IEC/PAS 61249-8-5 Ed.1: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
2014-03-14?
91/1177/RVC

Result of voting on 91/1158/DTR: IEC/TR 60068-3-12 Ed.2: Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
2014-03-14no
91/1170/Q

IEEE 1685-2009 - IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating and Re-using IP within Tool-flows
2014-03-072014-04-18Report of Comments
91/1171/Q

IEEE 1734-2011 - IEEE Standard for Quality of Electronic and Software Intellectual Property used in System and System on Chip (SoC) Designs
2014-03-072014-04-18Report of Comments
91/1172/Q

IEEE 1801-2013 - IEEE Standard for Design and Verification of Low Power Integrated Circuits
2014-03-072014-04-18Report of Comments
91/1167/CC

Compilation of comments on 91/1152/CD: IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
2014-02-14yes
91/1168/RVC

This document has been replaced by 91/1168A/CDV
2014-02-14yes
91/1166/RVD

Report of Voting on 91/1154A/FDIS: IEC 61190-1-2 Ed.3: Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
2014-02-07yes
91/1163/RVC

This document has been replaced by 91/1163A/DTS
2014-01-31no
91/1164/RVC

This document has been replaced by 91/1164A/DTS
2014-01-31no
91/1165/RVC

This document has been replaced by 91/1165A/DTS
2014-01-31no
91/1162/RVN

Result of voting on 91/1139/NP: Future IEC 62739-2: Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
2014-01-17?
91/1160/CC

Compilation of comments on 91/1130/CD: IEC 62326-20 Ed.1: Electronic circuit board for high brightness LED
2014-01-10yes
91/1161/CC

Compilation of comments on 91/1132/CD: IEC 61189-3-913 Ed.1: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
2014-01-10yes
91/1158/DTR

IEC/TR 60068-3-12 Ed.2: Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
2013-12-202014-02-21noVoting Result
91/1159/RM

Unconfirmed Minutes of the TC 91 Plenary meeting held in Richardson, Texas, USA on October 11 in 2013
2013-12-20