International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Working Documents since 2013-08-23

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91/1202/RVC

Result of voting on 91/1127/CDV: IEC 61760-4 Ed.1: Surface mounting technology - Part 4: Standard method for classification, packaging, labelling and handling of moisture sensitive devices
2014-08-22yes
91/1200/RVC

Result of voting on 91/1187/DTR: IEC/TR 62699-1 Ed.1: Mapping rules and exchanges methods for heterogeneous electronic parts libraries - Building an integrated search system
2014-08-01no
91/1201/INF

Demise of Mr Dieter W. Bergman, Chairman of IEC TC 91
2014-08-01
91/1104A/RVC

Compilation of comments on 91/1078/CDV: IEC 62699 Ed.1: Mapping rules and exchange methods for heterogeneous parts libraries
2014-07-18no
91/1193A/Q

Questionnaire on the relevance of IEC 60068-2-77:1999 and any necessity to develop a new test method to determine dynamic mechanical shock impact
2014-07-112014-09-26
TC 3
TC 40
TC 46
TC 47
TC 48
TC 49
TC 51
TC 104
TC 107
TC 109
TC 111
TC 119
91/1199/RVC

Result of voting on 91/1136/CDV: IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2014-07-11yes
91/1190/CD

IEC 60068-2-69 Ed. 3: Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
2014-07-042014-10-10yes
91/1191/CD

IEC 61189-5-1 Ed.1: Test methods for electrical materials, Interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
2014-07-042014-10-10yes
91/1192/RVD

Report of Voting on 91/1182/PAS: IEC/PAS 61182-12 Ed.1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
2014-07-04?
91/1193/Q

This document has been replaced by 91/1193A/Q
2014-07-04
TC 3
TC 40
TC 46
TC 47
TC 48
TC 49
TC 51
TC 104
TC 107
TC 109
TC 111
TC 119
91/1194/RQ

Result of Questionnaire on 91/1170/Q : IEEE 1685-2009 - IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating and Re-using IP within Tool-flows
2014-07-04
91/1195/RQ

Result of Questionnaire on 91/1171/Q : IEEE 1734-2011 - IEEE Standard for Quality of Electronic and Software Intellectual Property used in System and System on Chip (SoC) Designs
2014-07-04
91/1196/RQ

Result of Questionnaire on 91/1172/Q : IEEE 1801-2013 - IEEE Standard for Design and Verification of Low Power Integrated Circuits
2014-07-04
91/1197/INF

Comments received on 91/1153/DC: Maintenance - Call for comments / proposals for amendment / revision on Edition 1.0 of IEC 62137-1-1, IEC 62137-1-2, IEC 62137-1-3, IEC 62137-1-4 and IEC 62137-1-5
2014-07-04
91/1198/DA

Draft agenda for the TC 91 meeting to be held in Tokyo, Japan on 2014-11-14 from 9:00 am to 5.30 pm
2014-07-04
91/1188/FDIS

IEC 62137-4 Ed. 1: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
2014-06-202014-09-05yes
91/1163A/RVC

Result of voting on 91/1142/DTS: IEC/TS 62878-2-1 Ed.1: Device Embedded Substrate - Part 2-1: Guidelines - General description of technology
2014-06-13no
91/1164A/RVC

Result of voting on 91/1143/DTS: IEC/TS 62878-2-3 Ed.1: Device Embedded Substrate - Part 2-3: Guidelines - Design Guide
2014-06-13no
91/1165A/RVC

Result of voting on 91/1144/DTS: IEC/TS 62878-2-4 Ed.1: Device Embedded Substrate - Part 2-4: Guidelines - Test element groups (TEG)
2014-06-13no
91/1168A/RVC

Result of voting on 91/1124/CDV: IEC 62878-1-1 Ed.1: Device embedded substrate - Generic specification - Test method
2014-06-13yes
91/1175/CDV

IEC 61249-2-43 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2014-05-232014-09-05yes
91/1176/CDV

IEC 61249-2-44 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2014-05-232014-09-05yes
91/1187/DTR

IEC/TR 62699-1 Ed.1: Mapping rules and exchanges methods for heterogeneous electronic parts libraries - Building an integrated search system
2014-05-232014-07-25noVoting Result
91/1169/CDV

IEC 61189-2-721 Ed.1: Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
2014-05-092014-08-15yesVoting Result
91/1186/CD

IEC 61189-3-913 Ed.1: Test methods for printed boards - Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
2014-04-182014-06-20?Report of Comments
91/1183/CC

Compilation of comments on 91/1138A/CD: IEC/TR 62878-2-2 Ed.1: Device embedded substrate - Guidelines - Electrical testing
2014-04-11no
91/1184/CD

IEC 62326-20 Ed.1: Printed boards - Part 20: Electronic circuit board for high-brightness LEDs
2014-04-112014-06-13?Report of Comments
91/1185/NP

Future IEC 61189-2-719: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
2014-04-112014-07-11?Voting Result
91/1182/PAS

IEC/PAS 61182-12 Ed.1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
2014-04-042014-06-06?Voting Result
91/1181/RVN

Result of voting on 91/1149/NP: FinSimMath, as a model for HDLMath
2014-03-28?
91/1178/RVC

Result of voting on 91/1121/CDV: IEC 61189-5-2 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
2014-03-21yes
91/1179/RVC

Result of voting on 91/1122/CDV: IEC 61189-5-3 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
2014-03-21yes
91/1180/RVC

Result of voting on 91/1123/CDV: IEC 61189-5-4 Ed. 1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
2014-03-21yes
91/1173/RVD

Report of Voting on 91/1156/PAS: IEC/PAS 61249-8-1 Ed.1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
2014-03-14?
91/1174/RVD

Report of Voting on 91/1157/PAS: IEC/PAS 61249-8-5 Ed.1: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
2014-03-14?
91/1177/RVC

Result of voting on 91/1158/DTR: IEC/TR 60068-3-12 Ed.2: Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
2014-03-14no
91/1170/Q

IEEE 1685-2009 - IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating and Re-using IP within Tool-flows
2014-03-072014-04-18Report of Comments
91/1171/Q

IEEE 1734-2011 - IEEE Standard for Quality of Electronic and Software Intellectual Property used in System and System on Chip (SoC) Designs
2014-03-072014-04-18Report of Comments
91/1172/Q

IEEE 1801-2013 - IEEE Standard for Design and Verification of Low Power Integrated Circuits
2014-03-072014-04-18Report of Comments
91/1167/CC

Compilation of comments on 91/1152/CD: IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
2014-02-14yes
91/1168/RVC

This document has been replaced by 91/1168A/CDV
2014-02-14yes
91/1166/RVD

Report of Voting on 91/1154A/FDIS: IEC 61190-1-2 Ed.3: Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
2014-02-07yes
91/1163/RVC

This document has been replaced by 91/1163A/DTS
2014-01-31no
91/1164/RVC

This document has been replaced by 91/1164A/DTS
2014-01-31no
91/1165/RVC

This document has been replaced by 91/1165A/DTS
2014-01-31no
91/1162/RVN

Result of voting on 91/1139/NP: Future IEC 62739-2: Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
2014-01-17?
91/1160/CC

Compilation of comments on 91/1130/CD: IEC 62326-20 Ed.1: Electronic circuit board for high brightness LED
2014-01-10?
91/1161/CC

Compilation of comments on 91/1132/CD: IEC 61189-3-913 Ed.1: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
2014-01-10?
91/1158/DTR

IEC/TR 60068-3-12 Ed.2: Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
2013-12-202014-02-21noVoting Result
91/1159/RM

Unconfirmed Minutes of the TC 91 Plenary meeting held in Richardson, Texas, USA on October 11 in 2013
2013-12-20
91/1154A/FDIS

IEC 61190-1-2 Ed.3: Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
2013-12-132014-01-31yesVoting Result
91/1156/PAS

IEC/PAS 61249-8-1 Ed.1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
2013-12-132014-02-14?Voting Result
91/1157/PAS

IEC/PAS 61249-8-5 Ed.1: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
2013-12-132014-02-14?Voting Result
91/1154/FDIS

This document has been replaced by 91/1154A/FDIS
2013-11-29yes
91/1155/CC

Compilation of comments on 91/1110/CD: IEC 61189-2-721 Ed. 1: Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator
2013-11-29yes
91/1140A/CC

Revised compilation of comments on 91/1099/CD: IEC 61249-2-43 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2013-11-15yes
91/1141A/CC

Revised compilation of comments on 91/1100A/CD: IEC 61249-2-44 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2013-11-15yes
91/1152/CD

IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
2013-11-152014-01-17yesReport of Comments
91/1153/DC

Maintenance Call for comments / proposals for amendment / revision on Edition 1.0 of IEC 62137-1-1, IEC 62137-1-2, IEC 62137-1-3, IEC 62137-1-4 and IEC 62137-1-5
2013-11-152014-01-10Report of Comments
91/1150/RVC

Result of voting on 91/1090/CDV: IEC 62137-4 Ed. 1: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
2013-11-08yes
91/1151/RR

Review report on IEC/TR 60068-3-12 Ed.1: Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
2013-11-08no
91/1136/CDV

IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2013-11-012014-02-07yesVoting Result
91/1138A/CD

IEC/TR 62878-2-2 Ed.1: Device embedded substrate - Guidelines - Electrical testing
2013-11-012014-01-10noReport of Comments
91/1149/NP

FinSimMath, as a model for HDLMath
2013-11-012014-02-07?Voting Result
91/1127/CDV

IEC 61760-4 Ed.1: Surface mounting technology - Part 4: Standard method for classification, packaging, labelling and handling of moisture sensitive devices
2013-10-112014-01-17yesVoting Result
91/1147/RVD

Report of Voting on 91/1125/FDIS: IEC 61249-4-18 Ed.1: Materials for printed boards and other interconnecting structures Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2013-10-11yes
91/1148/RVD

Report of Voting on 91/1126/FDIS: IEC 61249-4-19 Ed.1: Materials for printed boards and other interconnecting structures Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2013-10-11yes
91/1121/CDV

IEC 61189-5-2 Ed. 1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
2013-10-042014-01-10yesVoting Result
91/1122/CDV

IEC 61189-5-3 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
2013-10-042014-01-10yesVoting Result
91/1123/CDV

IEC 61189-5-4 Ed. 1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
2013-10-042014-01-10yesVoting Result
91/1124/CDV

IEC 62878-1-1 Ed.1: Device embedded substrate - Generic specification - Test method
2013-10-042014-01-10yesVoting Result
91/1146/RQ

Result of Questionnaire on 91/1111/Q: Proposed creation of the role of vice chairman in IEC/TC 91
2013-09-20
91/1105A/DA

Revised draft agenda for the TC 91 meeting to be held in Richardson, TX, USA on 2013-10-11 from 9:00 am to 5.30 pm
2013-09-06
91/1140/CC

Compilation of comments on 91/1099/CD: IEC 61249-2-43 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2013-09-06yes
91/1141/CC

Compilation of comments on 91/1100A/CD: IEC 61249-2-44 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2013-09-06yes
91/1142/DTS

IEC/TS 62878-2-1 Ed.1: Device Embedded Substrate - Part 2-1: Guidelines - General description of technology
2013-09-062013-12-06noVoting Result
91/1143/DTS

IEC/TS 62878-2-3 Ed.1: Device Embedded Substrate - Part 2-3: Guidelines - Design Guide
2013-09-062013-12-06noVoting Result
91/1144/DTS

IEC/TS 62878-2-4 Ed.1: Device Embedded Substrate - Part 2-4: Guidelines - Test element groups (TEG)
2013-09-062013-12-06noVoting Result
91/1145/PW

Programme of Work of TC 91 as recorded by the IEC Central Office in its database
2013-09-06
91/1134A/CC

Compilation of comments on 91/1049/CD: IEC 62326-15: Printed boards - Part 15: Device Embedded Substrate General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages
2013-08-30no
91/1137/RVC

Result of voting on 91/1004/CDV: IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions
2013-08-30no
91/1138/CD

This document has been replaced by 91/1138A/CD
2013-08-302013-12-06no
91/1139/NP

Future IEC 62739-2: Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
2013-08-302013-12-06?Voting Result
91/1134/CC

This document has been replaced by 91/1134A/CC
2013-08-23no
91/1135/CC

Compilation of comments on 91/1047/CD: IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2013-08-23yes