International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
export to xls file

TC 91 Working Documents since 2016-07-27

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Authorized

Committees

91/1385B/CC

Revised compilation of comments on 91/1367/CD - IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

2017-07-07 Y
91/1453/CD

IEC 61189-2-630 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards – Moisture Absorption after pressure vessel conditioning

2017-07-07 2017-09-01 Y
91/1451/RVD

Result of Voting on 91/1445/FDIS - IEC 60068-2-58/AMD1 ED4: Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2017-06-30 Y
SC 23J
TC 40
TC 47
SC 47D
SC 48B
TC 51
91/1452/CD

IEC 61188-6-4 ED1: Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design

2017-06-30 2017-08-25 Y
91/1381A/RVN

Result of Voting on 91/1357/NP - Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design

2017-06-23 Y
91/1391A/RVN

Result of Voting on 91/1301/NP - Future IEC 61189-2-XXX Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-XXX: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning

2017-06-23 Y
91/1450/DA

Draft agenda for the meeting to be held in London, United Kingdom, from 2017-10-20 (starting time: 9:00) to 2017-10-20 (approximate finishing time: 17:00)

2017-06-23 N/A
91/1446/AC

Next meeting of TC 91 to be held in London, Chiswick, United Kingdom from 16 to 20 October 2017 (online registration)

2017-06-09 N/A
91/1442/CDV

IEC 60194-2 ED1: Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

2017-06-02 2017-08-25 N
TC 40
TC 47
SC 47A
SC 47D
91/1445/FDIS

IEC 60068-2-58/AMD1 ED4: Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2017-05-12 2017-06-23 Y Voting Result
SC 23J
TC 40
TC 47
SC 47D
SC 48B
TC 51
91/1385A/CC

This document has been replaced by 91/1385B/CC

2017-04-21 Y
91/1443/RVD

Result of Voting on 91/1433/FDIS - IEC 61189-5-503 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

2017-04-21 Y
91/1444/RVC

Result of Voting on 91/1402/CDV - Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2017-04-21 Y
SC 23J
TC 40
TC 47
SC 47D
SC 48B
TC 51
91/1440/RR

Review report of IEC 61760-1 Ed.1: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

2017-04-14 Y
91/1441/DC

Maintenance – Call for comments / proposals for amendment / revision on IEC 60068-2-20, Edition 5.0 and call for experts for maintenance team

2017-04-14 2017-05-26 N/A Report of Comments
91/1436/RVN

Result of Voting on 91/1423/NP - PNW 91-1423: Future IEC 61249-2-45 Ed.1.0: Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly

2017-04-07 Y
91/1437/RVN

Result of Voting on 91/1424/NP - PNW 91-1424: Future IEC 61249-2-46 Ed.1.0: Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly

2017-04-07 Y
91/1438/RVN

Result of Voting on 91/1425/NP - PNW 91-1425: Future IEC 61249-2-47 Ed.1.0: Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly

2017-04-07 Y
91/1439/CC

Compilation of Comments on 91/1421/CD - IEC 60194-2 ED1: Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

2017-04-07 N
TC 40
TC 47
SC 47A
SC 47D
91/1434/RVC

Result of Voting on 91/1399/CDV - IEC 61191-4 Ed.2: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

2017-03-24 Y
91/1435/RVC

Result of Voting on 91/1375/CDV - IEC 61191-3 Ed.2: Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

2017-03-24 Y
91/1433/FDIS

IEC 61189-5-503 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

2017-02-24 2017-04-07 Y Voting Result
91/1431/INF

Next TC 91 Working Group meetings to be held in Sapporo, Japan from 12 to 16 June 2017 (registration)

2017-02-17 N/A
91/1432/RQ

Result of Questionnaire 91/1416/Q: Proposal for a new scope for TC 91

2017-02-17 N/A
91/1417A/INF

Next TC 91 Working Group meetings to be held in Sapporo, Japan from 12 to 16 June 2017 (announcement)

2017-02-10 N/A
91/1419/CDV

IEC 61760-4/AMD1 ED1: Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

2017-02-10 2017-05-05 Y Voting Result
91/1427/INF

Comments received on 91/1398/DC : Proposed new framework of IEC 61188-5

2017-02-03 N/A
91/1428/RVC

Result of Voting on 91/1382/CDV - IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

2017-02-03 Y
91/1429/RVC

Result of Voting on 91/1386/CDV - IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

2017-02-03 Y
91/1430/RVC

Result of Voting on 91/1394/CDV - IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies

2017-02-03 Y
91/1423/NP

PNW 91-1423: Future IEC 61249-2-45 Ed.1.0: Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly

2017-01-27 2017-03-24 Y Voting Result
91/1424/NP

PNW 91-1424: Future IEC 61249-2-46 Ed.1.0: Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly

2017-01-27 2017-03-24 Y Voting Result
91/1425/NP

PNW 91-1425: Future IEC 61249-2-47 Ed.1.0: Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly

2017-01-27 2017-03-24 Y Voting Result
91/1426/RVD

Result of Voting on 91/1405/FDIS - IEC 60068-2-69 ED3: Environmental testing: Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

2017-01-27 Y
91/1352A/RVN

Revised result of voting on 91/1321/NP - Future IEC 62878-2-5: Device embedded substrate - Part 2-5: Implementation of 3D data format requirements for device embedded substrate

2017-01-13 U
91/1417/INF

Replaced by 91/1417A/INF

2017-01-13 N/A
91/1421/CD

IEC 60194-2 ED1: Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

2017-01-06 2017-03-31 N Report of Comments
TC 40
TC 47
SC 47A
SC 47D
91/1422/CD

IEC 60068-2-82 ED2: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

2017-01-06 2017-03-31 Y Report of Comments
TC 47
91/1402/CDV

Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2016-12-30 2017-03-24 Y Voting Result
TC 23
SC 23J
TC 40
TC 47
SC 47D
TC 48
SC 48B
TC 51
91/1420/RR

Review report of IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions

2016-12-30 N
TC 40
TC 47
SC 47A
SC 47D
91/1375/CDV

IEC 61191-3 Ed.2: Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

2016-12-23 2017-03-17 Y Voting Result
91/1399/CDV

IEC 61191-4 Ed.2: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

2016-12-23 2017-03-17 Y Voting Result
91/1418/RR

Review report of IEC 60068-2-21 Ed.6: Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

2016-12-23 Y
91/1406/INF

Comments received on 91/1393/DC: Maintenance – Call for comments / proposals for amendment / revisions on IEC 61760-1 Ed.2.0 and call for experts for maintenance team

2016-12-16 N/A
91/1407/RR

Review report of IEC 61182-1 Ed.1: Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form

2016-12-16 U
91/1408/RR

Review report of IEC 61182-7 Ed.1: Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

2016-12-16 Y
91/1409/RR

Review report of IEC 61182-10 Ed.1: Printed boards - Electronic data description and transfer - Part 10: Electronic data hierarchy

2016-12-16 U
91/1410/RM

Unconfirmed Minutes of the TC 91 Plenary meeting held in Frankfurt, Germany on October 14, in 2016

2016-12-16 N/A
91/1411/RR

Review report of IE 61182-2 Ed.1: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements

2016-12-16 N
91/1412/RR

Review report of IE 61182-2-2 Ed.1: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

2016-12-16 Y
91/1413/RR

Review report of IEC 60097 Ed.4: Grid systems for printed circuits

2016-12-16 U
91/1414/RR

Review report of IEC 62014-1 Ed.1: Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2)

2016-12-16 Y
91/1415/RR

Review report of IEC 61760-4 Ed.1: Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

2016-12-16 Y
91/1416/Q

Questionnaire: Proposal for a new scope for TC 91

2016-12-16 2017-01-27 N/A Report of Comments
91/1405/FDIS

IEC 60068-2-69 ED3: Environmental testing: Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

2016-12-02 2017-01-13 Y Voting Result
91/1404/RVC

Result of voting on 91/1336/CDV: IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards

2016-11-18 Y
91/1394/CDV

IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies

2016-10-28 2017-01-20 Y Voting Result
TC 40
91/1400/RVC

Result of voting on 91/1368/CDV: IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method

2016-10-28 Y
91/1401/CC

Compilation of comments on 91/1389/CD: Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2016-10-28 Y
SC 23J
TC 40
TC 47
SC 47D
SC 48B
TC 51
91/1403/RVC

Result of voting on 91/1378/DTR: IEC/TR 61189-3-914 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

2016-10-28 N
91/1387A/CC

Compilation of comments on 91/1318/CD: IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies

2016-10-21 Y
91/1398/DC

Proposed new framework of IEC 61188-5

2016-10-21 2016-12-02 N/A Report of Comments
91/1386/CDV

IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

2016-10-07 2016-12-30 Y Voting Result
91/1374A/DA

Revised draft agenda for the TC 91 meeting to be held in Frankfurt, Germany on 2016-10-14 from 9:00 am to 5:00 pm

2016-09-16 N/A
91/1382/CDV

IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

2016-09-16 2016-12-09 Y Voting Result
91/1395/INF

Review of Active Participation of P-members in the Work of TC 91

2016-09-16 N/A
91/1396/RVC

Result of voting on 91/1349/DTR: IEC/TR 63051 Ed.1: Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)

2016-09-16 N
91/1397/PW

Programme of Work of TC 91 as recorded by the IEC Central Office in its database

2016-09-16 N/A
91/1391/RVN

This document has been replaced by 91/1391A/RVN

2016-08-26 Y
91/1392/RR

Review report on IEC 60068-2-82 Ed.1: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

2016-08-26 Y
TC 47
91/1393/DC

Maintenance - Call for comments / proposals for amendment / revisions on IEC 61760-1 Ed. 2.0 and call for experts for maintenance team

2016-08-26 2016-10-07 N/A Report of Comments
91/1390/AC

Next meeting of TC 91 to be held in London, Chiswick, United Kingdom from 16 to 20 October 2017

2016-08-19 N/A
91/1387/CC

This document has been replaced by 91/1387A/CC

2016-08-12 Y
91/1388/RR

Review report on IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2016-08-12 Y
SC 23J
TC 40
TC 47
SC 47D
SC 48B
TC 51
91/1389/CD

Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2016-08-12 2016-10-07 Y Report of Comments
TC 23
SC 23J
TC 40
TC 47
SC 47D
TC 48
SC 48B
TC 51
91/1384/INF

Comments received on 91/1377/DC: Maintenance Call for comments / proposals for amendment / Revision on IEC 60068-2-21, Edition 6.0 and call for experts for maintenance team

2016-08-05 N/A
91/1385/CC

Compilation of comments on 91/1367/CD: IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

2016-08-05 Y
91/1368/CDV

IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method

2016-07-29 2016-10-21 Y Voting Result
91/1383/RVC

Result of voting on 91/1326/CDV: IEC 60068-2-69 Ed.3: Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method

2016-07-29 Y