International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Working Documents since 2015-02-07

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91/1343A/RM

Unconfirmed Minutes of the TC 91 Plenary meeting held in Dongguan, China on October 30 in 2015
2016-01-22
91/1342/CC

Compilation of comments on 91/1319/CD: IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
2016-01-15yes
91/1343/RM

This document has been replaced by 91/1343A/RM
2016-01-15
91/1333/CC

Compilation of comments on 91/1276/CD: IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2016-01-08yes
91/1334/CC

Compilation of comments on 91/1285/CD: IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
2016-01-08yes
91/1335/CC

Compilation of comments on 91/1290/CD: IEC 61191-4 Ed.2: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
2016-01-08yes
91/1337/Q

Questionnaire: Proposal to withdraw IEC 61182-1 Ed.1.0, IEC 61182-7 Ed. 1.0, IEC 61182-10 Ed. 1.0, IEC 60097 Ed. 4.0 and IEC 62014-1 Ed.1.0
2016-01-082016-02-19
91/1338/RVD

Report of Voting on 91/1314/FDIS: IEC 61671-2 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description (IEEE 1671.2 - 2012)
2016-01-08?
91/1339/RVD

Report of Voting on 91/1315/FDIS: IEC 61671-4 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration (IEEE 1671.4 - 2014)
2016-01-08?
91/1340/RVD

Report of Voting on 91/1316/FDIS: IEC 61671-5 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description (IEEE 1671.5 - 2015)
2016-01-08?
91/1341/RVD

Report of Voting on 91/1317/FDIS: IEC 61671-6 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description (IEEE 1671.6 - 2015)
2016-01-08?
91/1332/RVC

Result of voting on 91/1286/CDV: IEC 61189-2-719 Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
2016-01-01yes
91/1330/RVD

Report of Voting on 91/1311/FDIS: IEC 62326-20 Ed.1: Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
2015-12-25yes
91/1331/RVN

Result of voting on 91/1297/NP: Future IEC 62878-1: Device embedded substrate - Generic specification
2015-12-25?
91/1328/RVD

Report of Voting on 91/1304A/FDIS: IEC 61189-3-913 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs
2015-12-11yes
91/1329/CC

Compilation of comments on 91/1300/CD: IEC 61191-3 Ed.2: Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
2015-12-11yes
91/1324/CC

Compilation of comments on 91/1307/CD: IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
2015-12-04yes
91/1325/CC

Compilation of comments on 91/1190/CD: IEC 60068-2-69 Ed. 3: Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
2015-12-04yes
91/1327/RVD

Report of Voting on 91/1303/FDIS: IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
2015-12-04yes
91/1321/NP

Future IEC 62878-2-5: Device embedded substrate Part 2-5: Implementation of 3D data format requirements for device embedded substrate
2015-11-272016-03-04?
TC 40
TC 47
TC 86
91/1322/RR

Review report on IEC 61189-5 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
2015-11-27yes
91/1323/RVC

Result of voting on 91/1265/CDV: IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
2015-11-27yes
91/1104B/RVC

Result of voting on 91/1078/CDV: IEC 62699 Ed.1: Mapping rules and exchange methods for heterogeneous parts libraries
2015-11-20no
91/1312/RVC

Result of voting on 91/1175/CDV: IEC 61249-2-43 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2015-11-13yes
91/1320/RVC

Result of voting on 91/1176/CDV: IEC 61249-2-44 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2015-11-13yes
91/1318/CD

IEC 62090 Ed.2: Product package labels for electronic components using bar code and two-dimensional symbologies
2015-11-062016-01-08yesReport of Comments
TC 40
91/1319/CD

IEC 61188-7 Ed.2: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
2015-11-062016-01-08yesReport of Comments
91/1313/RVN

Result of voting on 91/1266/NP: Future IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
2015-10-23?
91/1314/FDIS

IEC 61671-2 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description (IEEE 1671.2 - 2012)
2015-10-232015-12-25?Voting Result
91/1315/FDIS

IEC 61671-4 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration (IEEE 1671.4 - 2014)
2015-10-232015-12-25?Voting Result
91/1316/FDIS

IEC 61671-5 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description (IEEE 1671.5 - 2015)
2015-10-232015-12-25?Voting Result
91/1317/FDIS

IEC 61671-6 Ed.1: IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description (IEEE 1671.6 - 2015)
2015-10-232015-12-25?Voting Result
91/1277B/DA

Revised draft agenda for the TC 91 meeting to be held in Dongguan, China on 2015-10-30 from 9:00 am to 5:00 pm
2015-10-09
91/1304A/FDIS

IEC 61189-3-913 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs
2015-10-092015-11-27yesVoting Result
91/1305A/PW

Programme of Work of TC 91 as recorded by the IEC Central Office in its database
2015-10-09
91/1311/FDIS

IEC 62326-20 Ed.1: Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
2015-10-092015-12-11yesVoting Result
91/1308/RVC

Result of voting on 91/1283/DTR: IEC/TR 63017 Ed.1: Guideline for Impedance Compensation with Using Noise Suppression Materials for FPCB - Impedance measuring method and impedance compensation method for impedance variation of FPCBs using NSMs with prevailing TDR method
2015-10-02no
91/1309/RVC

Result of voting on 91/1284/DTR: IEC/TR 63018 Ed.1: Guideline for Improvement of Signal Loss with Using Noise Suppression Materials for FPCB - Signal loss measuring method and signal loss improvement method for impedance variation of FPCBs using NSMs
2015-10-02no
91/1310/RQ

Result of Questionnaire on 91/1282/Q : Proposal to withdraw IEC 61188-1-1 Ed.1.0 and IEC 61188-1-2 Ed.1.0
2015-10-02
91/1277A/DA

This document has been replaced by 91/1277B/DA
2015-09-25
91/1303/FDIS

IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
2015-09-252015-11-27yesVoting Result
91/1304/FDIS

This document has been replaced by 91/1304A/FDIS
2015-09-25yes
91/1305/PW

This document has been replaced by 91/1305A/PW
2015-09-25
91/1306/RVN

Result of voting on 91/1269/NP: Future IEC 61189-5-503: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
2015-09-25yes
91/1307/CD

IEC 61189-5-503 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
2015-09-252015-11-27yesReport of Comments
91/1301/NP

Future IEC 61189-2-XXX Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-XXX: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning
2015-09-182015-12-18?Voting Result
91/1302/RVN

Result of voting on 91/1247/NP: Future IEC 61188-8-2: Component shape data specification for CAD library Part 2: 3D shape data specifications
2015-09-18?
91/1286/CDV

IEC 61189-2-719 Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
2015-09-112015-12-11yesVoting Result
91/1298/RVD

Report of Voting on 91/1274/FDIS: IEC 63003 Ed.1: IEEE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505 (IEEE 1505.1-2008)
2015-09-04?
91/1299/RVD

Report of Voting on 91/1275/FDIS: IEC 63004 Ed.1: IEEE Standard for Receiver Fixture Interface (IEEE 1505-2010)
2015-09-04?
91/1300/CD

IEC 61191-3 Ed.2: Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
2015-09-042015-11-06yesReport of Comments
91/1273/CDV

IEC 61189-5-1 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
2015-08-282015-12-04yesVoting Result
91/1293/RQ

Result of Questionnaire on 91/1278/Q: IEEE 1671.2-2012 - IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description
2015-08-28
91/1294/RQ

Result of Questionnaire on 91/1279/Q: IEEE 1671.4-2014 - IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration
2015-08-28
91/1295/RQ

Result of Questionnaire on 91/1280/Q: IEEE 1671.5-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description
2015-08-28
91/1296/RQ

Result of Questionnaire on 91/1281/Q: IEEE 1671.6-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description
2015-08-28
91/1297/NP

Future IEC 62878-1: Device embedded substrate - Generic specification
2015-08-282015-12-04?Voting Result
TC 40
TC 47
91/1249A/INF

Revised comments received on 91/1233/DC: Proposed new framework of IEC 61189-5
2015-08-21
91/1292/DC

Proposed withdrawal of IEC 61189-5-601, 5-602, 5-603
2015-08-212015-10-09Report of Comments
91/1265/CDV

IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
2015-08-142015-11-20yesVoting Result
91/1291/NP

Future IEC/TS 61189-3-XXX: Appearance Inspection Method for Plated Surfaces on PWB
2015-08-142015-11-20?Voting Result
91/1289/RR

Review report on IEC 61188-7 Ed.1: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
2015-08-07yes
91/1290/CD

IEC 61191-4 Ed.2: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
2015-08-072015-10-09yesReport of Comments
91/1288/AC

Next meeting of TC 91 to be held in Dongguan, China from 26 to 30 October 2015 (online registration)
2015-07-24
91/1287/RVC

Result of voting on 91/1241/CDV: IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering
2015-07-17yes
91/1277/DA

Draft agenda for the TC 91 meeting to be held in Dongguan, China on 2015-10-30 from 9:00 am to 5:00 pm
2015-07-03
91/1278/Q

IEEE 1671.2-2012 - IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description
2015-07-032015-08-21Report of Comments
91/1279/Q

IEEE 1671.4-2014 - IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration
2015-07-032015-08-21Report of Comments
91/1280/Q

IEEE 1671.5-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description
2015-07-032015-08-21Report of Comments
91/1281/Q

IEEE 1671.6-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description
2015-07-032015-08-21Report of Comments
91/1282/Q

Questionnaire: Proposal to withdraw IEC 61188-1-1 Ed.1.0 and IEC 61188-1-2 Ed.1.0
2015-07-032015-09-25Report of Comments
91/1283/DTR

IEC/TR 63017 Ed.1: Guideline for Impedance Compensation with Using Noise Suppression Materials for FPCB - Impedance measuring method and impedance compensation method for impedance variation of FPCBs using NSMs with prevailing TDR method
2015-07-032015-09-04noVoting Result
91/1284/DTR

IEC/TR 63018 Ed.1: Guideline for Improvement of Signal Loss with Using Noise Suppression Materials for FPCB - Signal loss measuring method and signal loss improvement method for impedance variation of FPCBs using NSMs
2015-07-032015-09-04noVoting Result
91/1285/CD

IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
2015-07-032015-09-04yesReport of Comments
91/1274/FDIS

IEC 63003 Ed.1: IEEE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505 (IEEE 1505.1-2008)
2015-06-262015-08-28?Voting Result
91/1275/FDIS

IEC 63004 Ed.1: IEEE Standard for Receiver Fixture Interface (IEEE 1505-2010)
2015-06-262015-08-28?Voting Result
91/1276/CD

IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2015-06-262015-08-28yesReport of Comments
91/1270/INF

Comments received on 91/1256/DC: Maintenance - Call for comments / proposals for amendment / revision on IEC 62090 Edition 1.0 and call for experts for maintenance team
2015-06-19
91/1271/RR

Review report on IEC 62090 Ed.1: Product package labels for electronic components using bar code and two-dimensional symbologies
2015-06-19yes
91/1272/CC

Compilation of comments on 91/1272/CC: IEC 61189-5-1 Ed.1: Test methods for electrical materials, Interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
2015-06-19yes
91/1264/RVD

Report of Voting on 91/1257/PAS: IEC/PAS 62878-2-5 Ed.1: Device embedded substrate - Guidelines - Data format
2015-06-12?
91/1266/NP

Future IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
2015-06-122015-09-18?Voting Result
91/1267/RR

Review report on IEC 61191-1 Ed.2: Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2015-06-12yes
91/1268/RR

Review report on IEC 61191-2 Ed.2: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
2015-06-12yes
91/1269/NP

Future IEC 61189-5-503: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
2015-06-122015-09-18yesVoting Result
91/1255/CDV

IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
2015-05-292015-09-04yesVoting Result
91/1262/RVC

Result of voting on 91/1214/CDV: IEC 61189-3-913 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies- Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs
2015-05-29yes
91/1263/RVC

Result of voting on 91/1219/CDV: IEC 62326-20 Ed.1: Printed boards - Part 20: Printed circuit board for high-brightness LEDs
2015-05-29yes
91/1252A/CC

Compilation of comments on 91/1221/CD: IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
2015-05-15yes
91/1261/AC

Next meeting of TC 91 to be held in Dongguan, China from 26 to 30 October 2015 (announcement)
2015-05-08
91/1260/RVD

Report of Voting on 91/1248/FDIS: IEC 62878-1-1 Ed.1: Device embedded substrate - Part 1-1: Generic specification - Test methods
2015-05-01yes
91/1258/RVD

Report of Voting on 91/1246/FDIS: IEC 61189-2-721: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
2015-04-17yes
91/1259/RVD

Report of Voting on 91/1244/FDIS: IEC 61760-4 Ed.1: Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
2015-04-17yes
91/1241/CDV

IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering
2015-03-272015-07-03yesVoting Result
91/1257/PAS

IEC/PAS 62878-2-5 Ed.1: Device embedded substrate - Guidelines - Data format
2015-03-272015-05-29?Voting Result
TC 40
TC 47
91/1253/RVD

Report of Voting on 91/1236/FDIS: IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions
2015-03-20no
91/1254/CC

Compilation of comments on 91/1231/CD: IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
2015-03-20yes
91/1256/DC

Maintenance - Call for comments / proposals for amendment / revision on IEC 62090 Edition 1.0 and call for experts for maintenance team
2015-03-202015-05-08Report of Comments
91/1252/CC

This document has been replaced by 91/1252A/CC
2015-03-13yes
91/1250/RVD

Report of Voting on 91/1222/FDIS: IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2015-03-06yes
91/1251/RQ

Result of Questionnaire on 91/1232/Q: Request from the Global Network for B2B Integration in High Tech Industries (EDIFICE) for a Category D Liaison with WG 1 of TC 91
2015-03-06
91/1249/INF

Comments received on 91/1233/DC: Proposed new framework of IEC 61189-5
2015-02-27
91/1248/FDIS

IEC 62878-1-1 Ed.1: Device embedded substrate - Part 1-1: Generic specification - Test methods
2015-02-202015-04-24yesVoting Result