International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
TC 91 Working Documents since 2012-04-06
  Reference, Title | Downloads | Circulation Date | Closing Date | CENELEC | Voting / Comment | Authorized Committees |
|---|---|---|---|---|---|---|
91/1093/RVNResult of voting on 91/1073/NP: Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator
| 2013-04-05 | ? | ||||
91/1094/ACNext meeting of TC 91 to be held in Richardson, Texas, USA from 7 to 11 October 2013 (announcement) | 2013-04-05 | |||||
91/1095/RVNResult of voting on 91/1054/NP: Future IEC 61249-2-43: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
| 2013-04-05 | ? | ||||
91/1096/RVNResult of voting on 91/1055/NP: IEC 61249-44 Ed. 1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
| 2013-04-05 | ? | ||||
91/1092/FDISIEC 62739-1 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing | 2013-03-22 | 2013-05-24 | yes | |||
91/1089A/FDISIEC 61191-1 Ed.2: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies | 2013-03-22 | 2013-04-26 | yes | |||
91/1091/FDISIEC 61191-2 Ed.2: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies | 2013-03-15 | 2013-05-17 | yes | |||
91/1089/FDISThis document has been replaced by 91/1089A/CDV
| 2013-02-22 | yes | ||||
91/1088/RRReview report on IEC 62016 Ed.1: Core model of the electronics domain | 2013-02-15 | |||||
91/1078/CDVIEC 62699 Ed.1: Mapping rules and exchange methods for heterogeneous parts libraries | 2013-02-08 | 2013-05-10 | yes | |||
91/1086/FDISIEC 61189-11 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys | 2013-02-08 | 2013-04-12 | yes | |||
91/1087/CCCompilation of comments on 91/1056/CD: IEC 62137-4 Ed.1: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices | 2013-02-08 | yes | ||||
91/1085/DTRIEC 62856 Ed.1: Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL) | 2013-02-01 | 2013-04-05 | no | |||
91/1081/CDIEC/TS 62326-16 Ed.1: Printed boards - Part 16: Device Embedded Substrate Technology - Generics | 2013-01-25 | 2013-03-29 | ? | Report of Comments | ||
91/1082/CDIEC/TS 62326-17 Ed.1: Printed boards - Part 17: Device embedded substrates - TEG (test element group) | 2013-01-25 | 2013-03-29 | ? | Report of Comments | ||
91/1083/CDIEC 62326-18 Ed.1: Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods | 2013-01-25 | 2013-03-29 | ? | Report of Comments | ||
91/1084/CDIEC/TS 62326-19 Ed.1: Printed boards - Part 19: Device Embedded Substrate - Design Guide | 2013-01-25 | 2013-03-29 | ? | Report of Comments | ||
91/1062/CDVIEC 62588 Ed. 1: Marking and labeling of components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-Free) and other attributes | 2013-01-18 | 2013-04-19 | yes | TC 3 TC 111 | ||
91/1080/RVDReport of Voting on 91/1061/FDIS: IEC 61193-3 Ed.1: Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing | 2013-01-11 | yes | ||||
91/1079/RVCResult of voting on 91/1029/CDV: IEC 62739-1 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
| 2012-12-07 | yes | ||||
91/1076/RVNResult of voting on 91/1028/NP: Future IEC 61189-3-719: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
| 2012-11-30 | ? | ||||
91/1077/RMUnconfirmed Minutes of the TC 91 Plenary meeting held in Fukuoka, Japan on October 19th in 2012 | 2012-11-30 | |||||
91/1059A/CCRevised compilation of comments on 91/994/CD: IEC 60068-3-13: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering | 2012-11-30 | yes | ||||
91/1074/RRReview report on IEC 61191-3 Ed. 1: Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
| 2012-11-16 | yes | ||||
91/1075/RRReview report on IEC 61191-4 Ed. 1: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies | 2012-11-16 | yes | ||||
91/1063/RVDReport of Voting on 91/1050/FDIS: IEC 61249-2-27 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-27 Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad | 2012-11-09 | yes | ||||
91/1064/RVDReport of Voting on 91/1051/FDIS: IEC 61249-2-30 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad | 2012-11-09 | yes | ||||
91/1065/RVDReport of Voting on 91/1052/FDIS: IEC 61249-2-39 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | 2012-11-09 | yes | ||||
91/1066/RVDReport of Voting on 91/1053/FDIS: IEC 61249-2-40 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High Performance, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | 2012-11-09 | yes | ||||
91/1067/ACAppointment of a secretary | 2012-11-09 | |||||
91/1068/RVCResult of voting on 91/1014/CDV: IEC 61191-1 Ed. 2: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
| 2012-11-09 | yes | ||||
91/1069/RVCResult of voting on 91/1015/CDV: IEC 61191-2 Ed. 2: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
| 2012-11-09 | yes | ||||
91/1070/CDIEC 61189-5-2 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux | 2012-11-09 | 2013-02-15 | yes | Report of Comments | ||
91/1071/CDIEC 61189-5-3 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste | 2012-11-09 | 2013-02-15 | yes | Report of Comments | ||
91/1072/CDIEC 61189-5-4 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire | 2012-11-09 | 2013-02-15 | yes | Report of Comments | ||
91/1073/NPMeasurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator | 2012-11-09 | 2013-02-15 | ? | Voting Result | ||
91/1057A/CCRevised compilation of comments on 91/1030/CD: IEC 61760-4: Classification, packaging, labelling and handling of moisture sensitive devices
| 2012-11-09 | yes | ||||
91/1058A/CCRevised compilation of comments on 91/1036/CD: IEC 62588 Ed.1: Marking and labeling of components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes | 2012-11-02 | yes | ||||
91/1061/FDISIEC 61193-3 Ed.1: Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing | 2012-10-19 | 2013-01-04 | yes | Voting Result | ||
91/1060/PWProgramme of Work of the Technical Committee 91 as recorded by the IEC Central Office in its database. | 2012-09-14 | |||||
91/1045A/DARevised draft agenda for the TC 91 meeting to be held in Fukuoka, Japan, on 2012-10-19 from 9:00am to 5:00pm | 2012-09-14 | |||||
91/1054/NPFuture IEC 61249-2-43: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | 2012-09-07 | 2012-12-07 | ? | Voting Result | ||
91/1055/NPIEC 61249-44 Ed. 1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | 2012-09-07 | 2012-12-07 | ? | Voting Result | ||
91/1056/CDIEC 62137-4 Ed.1: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
| 2012-09-07 | 2012-11-09 | yes | Report of Comments | ||
91/1057/CCCompilation of comments on 91/1030/CD: IEC 61760-4: Classification, packaging, labelling and handling of moisture sensitive devices
| 2012-09-07 | yes | ||||
91/1058/CCCompilation of comments on 91/1036/CD: IEC 62588 Ed.1: Marking and labeling of components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes | 2012-09-07 | yes | ||||
91/1059/CCCompilation of comments on 91/994/CD: IEC 60068-3-13: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering | 2012-09-07 | yes | ||||
91/1050/FDISIEC 61249-2-27 Ed.1: Materials for printed boards and other Interconnecting structures - Part 2-27 Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad | 2012-08-31 | 2012-11-02 | yes | Voting Result | ||
91/1051/FDISIEC 61249-2-30 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad | 2012-08-31 | 2012-11-02 | yes | Voting Result | ||
91/1052/FDISIEC 61249-2-39 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | 2012-08-31 | 2012-11-02 | yes | Voting Result | ||
91/1053/FDISIEC 61249-2-40 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | 2012-08-31 | 2012-11-02 | yes | Voting Result | ||
91/1041A/RQResult of 91/1037/Q: Questionnaire on the transferring of work from TC93 to TC91 | 2012-08-31 | |||||
91/1046/CCCompilation of comments on 91/1016/CD: IEC 60068-2-58 Ed.4: Environmental Testing-Part 2-58: Tests Td -Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | 2012-08-24 | yes | ||||
91/1047/CDIEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | 2012-08-24 | 2012-10-26 | yes | Report of Comments | ||
91/1048/CCCompilation of comments on 91/995/CD: IEC 62326-15 E.1: Printed boads-Device Embedded Substrate-General electrical test guide for device embedded substrate with active devices, passive components(Capacitor, Resistor, Inductor, etc), integrated passeve device (IPD), and descrete packages | 2012-08-24 | ? | ||||
91/1049/CDIEC 62326-15: Printed boards - Part 15: Device Embedded Substrate General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages | 2012-08-24 | 2012-10-26 | ? | Report of Comments | ||
91/1043F/CDVIEC 61190-1-2 Am.1 Ed.2: Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly | 2012-06-29 | yes | ||||
91/1044/ACNext meeting of TC 91 to be held in Fukuoka, Japan from 15 to 19 October 2012 (online registration) | 2012-06-22 | |||||
91/1045/DADraft agenda for the TC 91 meeting to be held in Fukuoka, Japan, on 2012-10-19 from 9:00am to 5:00pm | 2012-06-22 | |||||
91/1031B/RVNResult of voting on 91/996/NP: Future IEC/TS 62326-16: Printed boards-Device Embedded Substrate-Scope and Definition | 2012-06-22 | ? | ||||
91/1031A/RVNThis document has been replaced by 91/1031B/RVN
| 2012-06-08 | ? | ||||
91/1032A/RVNResult of voting on 91/997/NP: Future IEC/TS 62326-17: Printed boards-Device Embedded Substrate-TEG(test element group)
| 2012-06-08 | ? | ||||
91/1033A/RVNResult of voting on 91/998/NP: Future IEC 62326-18: Printed boards-Device Embedded Substrate-Test Method | 2012-06-08 | ? | ||||
91/1034A/RVNResult of voting on 91/999/NP: Future IEC 62326-19: Printed boards-Device Embedded Substrate-Design Guide | 2012-06-08 | ? | ||||
91/1043/CDVIEC 61190-1-2 Am.1 Ed.2: Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly | 2012-06-01 | 2012-11-02 | yes | Voting Result | ||
91/1042/CCCompilation of comments on 91/1023/CD: IEC 61190-1-2 Am.1 Ed.2: Attachment materials for electronic assembly - Part 1-2: Requirement for soldering pastes for high-quality interconnects in electronics assembly | 2012-05-25 | yes | ||||
91/1041/RQThis document has been replaced by 91/1041A/RQ
| 2012-05-18 | |||||
91/1039/ACNext meeting of TC 91 to be held in Fukuoka, Japan from 15 to 19 October 2012 (announcement) | 2012-04-27 | |||||
91/1040/RVCResult of voting on 91/1001/CDV: IEC 61189-11 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
| 2012-04-20 | yes | ||||
91/1038/RVDReport of Voting on 91/1025/FDIS: IEC 61182-2-2 Ed.1: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description | 2012-04-06 | yes |
28 kB
101 kB
32200 kB
32138 kB