International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Working Documents since 2014-07-31

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91/1288/AC

Next meeting of TC 91 to be held in Dongguan, China from 26 to 30 October 2015 (online registration)
2015-07-24
91/1287/RVC

Result of voting on 91/1241/CDV: IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering
2015-07-17yes
91/1277/DA

Draft agenda for the TC 91 meeting to be held in Dongguan, China on 2015-10-30 from 9:00 am to 5:00 pm
2015-07-03
91/1278/Q

IEEE 1671.2-2012 - IEEE Standard for Automatic Test Markup Language (ATML) Instrument Description
2015-07-032015-08-21
91/1279/Q

IEEE 1671.4-2014 - IEEE Standard for Automatic Test Markup Language (ATML) Test Configuration
2015-07-032015-08-21
91/1280/Q

IEEE 1671.5-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Adapter Description
2015-07-032015-08-21
91/1281/Q

IEEE 1671.6-2015 - IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description
2015-07-032015-08-21
91/1282/Q

Questionnaire: Proposal to withdraw IEC 61188-1-1 Ed.1.0 and IEC 61188-1-2 Ed.1.0
2015-07-032015-09-25
91/1283/DTR

IEC/TR 63017 Ed.1: Guideline for Impedance Compensation with Using Noise Suppression Materials for FPCB - Impedance measuring method and impedance compensation method for impedance variation of FPCBs using NSMs with prevailing TDR method
2015-07-032015-09-04?
91/1284/DTR

IEC/TR 63018 Ed.1: Guideline for Improvement of Signal Loss with Using Noise Suppression Materials for FPCB - Signal loss measuring method and signal loss improvement method for impedance variation of FPCBs using NSMs
2015-07-032015-09-04?
91/1285/CD

IEC 61191-2 Ed.3: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
2015-07-032015-09-04yes
91/1274/FDIS

IEC 63003 Ed.1: IEEE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505 (IEEE 1505.1-2008)
2015-06-262015-08-28
91/1275/FDIS

IEC 63004 Ed.1: IEEE Standard for Receiver Fixture Interface (IEEE 1505-2010)
2015-06-262015-08-28
91/1276/CD

IEC 61191-1 Ed.3: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2015-06-262015-08-28yes
91/1270/INF

Comments received on 91/1256/DC: Maintenance - Call for comments / proposals for amendment / revision on IEC 62090 Edition 1.0 and call for experts for maintenance team
2015-06-19
91/1271/RR

Review report on IEC 62090 Ed.1: Product package labels for electronic components using bar code and two-dimensional symbologies
2015-06-19yes
91/1272/CC

Compilation of comments on 91/1272/CC: IEC 61189-5-1 Ed.1: Test methods for electrical materials, Interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
2015-06-19yes
91/1264/RVD

Report of Voting on 91/1257/PAS: IEC/PAS 62878-2-5 Ed.1: Device embedded substrate - Guidelines - Data format
2015-06-12?
91/1266/NP

Future IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
2015-06-122015-09-18?
91/1267/RR

Review report on IEC 61191-1 Ed.2: Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2015-06-12yes
91/1268/RR

Review report on IEC 61191-2 Ed.2: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
2015-06-12yes
91/1269/NP

Future IEC 61189-5-503: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
2015-06-122015-09-18?
91/1255/CDV

IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
2015-05-292015-09-04yes
91/1262/RVC

Result of voting on 91/1214/CDV: IEC 61189-3-913 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies- Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs
2015-05-29yes
91/1263/RVC

Result of voting on 91/1219/CDV: IEC 62326-20 Ed.1: Printed boards - Part 20: Printed circuit board for high-brightness LEDs
2015-05-29yes
91/1252A/CC

Compilation of comments on 91/1221/CD: IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
2015-05-15yes
91/1261/AC

Next meeting of TC 91 to be held in Dongguan, China from 26 to 30 October 2015 (announcement)
2015-05-08
91/1260/RVD

Report of Voting on 91/1248/FDIS: IEC 62878-1-1 Ed.1: Device embedded substrate - Part 1-1: Generic specification - Test methods
2015-05-01yes
91/1258/RVD

Report of Voting on 91/1246/FDIS: IEC 61189-2-721: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
2015-04-17yes
91/1259/RVD

Report of Voting on 91/1244/FDIS: IEC 61760-4 Ed.1: Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
2015-04-17yes
91/1241/CDV

IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering
2015-03-272015-07-03yesVoting Result
91/1257/PAS

IEC/PAS 62878-2-5 Ed.1: Device embedded substrate - Guidelines - Data format
2015-03-272015-05-29?Voting Result
TC 40
TC 47
91/1253/RVD

Report of Voting on 91/1236/FDIS: IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions
2015-03-20no
91/1254/CC

Compilation of comments on 91/1231/CD: IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
2015-03-20yes
91/1256/DC

Maintenance - Call for comments / proposals for amendment / revision on IEC 62090 Edition 1.0 and call for experts for maintenance team
2015-03-202015-05-08Report of Comments
91/1252/CC

This document has been replaced by 91/1252A/CC
2015-03-13yes
91/1250/RVD

Report of Voting on 91/1222/FDIS: IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2015-03-06yes
91/1251/RQ

Result of Questionnaire on 91/1232/Q: Request from the Global Network for B2B Integration in High Tech Industries (EDIFICE) for a Category D Liaison with WG 1 of TC 91
2015-03-06
91/1249/INF

Comments received on 91/1233/DC: Proposed new framework of IEC 61189-5
2015-02-27
91/1248/FDIS

IEC 62878-1-1 Ed.1: Device embedded substrate - Part 1-1: Generic specification - Test methods
2015-02-202015-04-24yesVoting Result
91/1246/FDIS

IEC 61189-2-721: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
2015-02-062015-04-10yesVoting Result
91/1247/NP

Future IEC 61188-8-2: Component shape data specification for CAD library Part 2: 3D shape data specifications
2015-02-062015-05-08?Voting Result
91/1243/AC

AG 16: Advisory Group on Standardization Strategy - Call for experts
2015-01-30
91/1244/FDIS

IEC 61760-4 Ed.1: Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
2015-01-302015-04-03yesVoting Result
91/1245/RVC

Result of voting on 91/1220/DTR: IEC/TR 62878-2-2 Ed.1: Device embedded substrate - Part 2-2: Guidelines - Electrical testing
2015-01-30no
91/1242/CC

Compilation of comments on 91/1215/CD: IEC 61189-2-719 Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
2015-01-23yes
91/1234/RVC

Result of voting on 91/1189/CDV: IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
2015-01-09yes
91/1235/RM

Unconfirmed Minutes of the TC 91 Plenary meeting held in Tokyo, Japan on November 14 in 2014
2015-01-09
91/1236/FDIS

IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions
2015-01-092015-03-13noVoting Result
91/1237/RR

Review report on IEC/PAS 61249-3-1 Ed.1: Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (withdrawal)
2015-01-09?
91/1238/RR

Review report on IEC/PAS 62326-7-1 Ed.1: Performance guide for single- and double-sided flexible printed wiring boards (withdrawal)
2015-01-09?
91/1239/RR

Review report on IEC/PAS 62326-14 Ed.1: Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide (withdrawal)
2015-01-09?
91/1240/RR

Review report on IEC/PAS 62588 Ed.1: Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes (withdrawal)
2015-01-09?
91/1233/DC

Proposed new framework of IEC 61189-5
2015-01-022015-02-13Report of Comments
91/1232/Q

Request from the Global Network for B2B Integration in High Tech Industries (EDIFICE) for a Category D Liaison with WG 1 of TC 91
2014-12-262015-02-13Report of Comments
91/1219/CDV

IEC 62326-20 Ed.1: Printed boards - Part 20: Printed circuit board for high-brightness LEDs
2014-12-192015-03-20yesVoting Result
91/1223/RVD

Report of Voting on 91/1210/FDIS: IEC 61189-5-2 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
2014-12-12yes
91/1224/RVD

Report of Voting on 91/1211/FDIS: IEC 61189-5-3 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
2014-12-12yes
91/1225/RVD

Report of Voting on 91/1212/FDIS: IEC 61189-5-4 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
2014-12-12yes
91/1226/RVD

Report of Voting on 91/1207/FDIS: IEC 62014-4 Ed.1: IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating and Reusing IP within Tool flows (IEEE 1685-2009)
2014-12-12no
91/1227/RVD

Report of Voting on 91/1208/FDIS: IEC 62014-5 Ed.1: IEEE Standard for Quality of Electronic and Software Intellectual Property used in System and System on Chip (SoC) Designs (IEEE 1734-2011)
2014-12-12no
91/1228/RVD

Report of Voting on 91/1209/FDIS: IEC 61523-4 Ed.1: IEEE Standard for Design and Verification of Low-Power Integrated Circuits (IEEE 1801-2013)
2014-12-12no
91/1229/RR

Review report on IEC 61190-1-3 Ed.2: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
2014-12-12yes
91/1230/RQ

Result of 91/1193A/Q: Questionnaire on the relevance of IEC 60068-2-77 : 1999 and any necessity to develop a new test method to determine dynamic mechanical shock impact
2014-12-12
91/1231/CD

IEC 61190-1-3 Ed.3: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
2014-12-122015-03-13yesReport of Comments
91/1214/CDV

IEC 61189-3-913 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies- Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs
2014-12-052015-03-06yesVoting Result
91/1222/FDIS

IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2014-12-052015-02-06yesVoting Result
91/1221/CD

IEC 62739-2 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials with surface processing
2014-11-212015-02-27yesReport of Comments
91/1220/DTR

IEC/TR 62878-2-2 Ed. 1: Device embedded substrate - Part 2-2: Guidelines - Electrical testing
2014-10-312015-01-02noVoting Result
91/1198A/DA

Revised draft agenda for the TC 91 meeting to be held in Tokyo, Japan on 2014-11-14 from 9:00 am to 5.30 pm
2014-10-17
91/1218/PW

Programme of Work of TC 91 as recorded by the IEC Central Office in its database
2014-10-17
91/1203A/RVC

Result of voting on 91/1169/CDV: IEC 61189-2-721 Ed.1: Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
2014-10-10yes
91/1216/INF

Review of publication plan
2014-10-10
91/1217/CC

Compilation of comments on 91/1184/CD: IEC 62326-20 Ed.1: Printed boards - Part 20: Electronic circuit board for high-brightness LEDs
2014-10-10yes
91/1215/CD

IEC 61189-2-719 Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
2014-10-032015-01-09yesReport of Comments
91/1207/FDIS

IEC 62014-4 Ed.1: IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating and Reusing IP within Tool flows (IEEE 1685-2009)
2014-09-262014-11-28noVoting Result
91/1208/FDIS

IEC 62014-5 Ed.1: IEEE Standard for Quality of Electronic and Software Intellectual Property used in System and System on Chip (SoC) Designs (IEEE 1734-2011)
2014-09-262014-11-28noVoting Result
91/1209/FDIS

IEC 61523-4 Ed.1: IEEE Standard for Design and Verification of Low-Power Integrated Circuits (IEEE 1801-2013)
2014-09-262014-11-28noVoting Result
91/1210/FDIS

IEC 61189-5-2 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
2014-09-262014-11-28yesVoting Result
91/1211/FDIS

IEC 61189-5-3 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
2014-09-262014-11-28yesVoting Result
91/1212/FDIS

IEC 61189-5-4 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
2014-09-262014-11-28yesVoting Result
91/1213/CC

Compilation of comments on 91/1186/CD: IEC 61189-3-913 Ed.1: Test methods for printed boards - Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
2014-09-26yes
91/1205/RVD

Report of Voting on 91/1188/FDIS: IEC 62137-4 Ed.1: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
2014-09-19yes
91/1206/AC

Chair of TC 91 : Electronics assembly technology
2014-09-192014-12-19Report of Comments
91/1189/CDV

IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
2014-09-122014-12-12yesVoting Result
91/1203/RVC

This document has been replaced by 91/1203A/RVC
2014-09-05yes
91/1204/RVN

Result of voting on 91/1185/NP: Future IEC 61189-2-719: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
2014-09-05yes
91/1202/RVC

Result of voting on 91/1127/CDV: IEC 61760-4 Ed.1: Surface mounting technology - Part 4: Standard method for classification, packaging, labelling and handling of moisture sensitive devices
2014-08-22yes
91/1200/RVC

Result of voting on 91/1187/DTR: IEC/TR 62699-1 Ed.1: Mapping rules and exchanges methods for heterogeneous electronic parts libraries - Building an integrated search system
2014-08-01no
91/1201/INF

Demise of Mr Dieter W. Bergman, Chairman of IEC TC 91
2014-08-01