International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Dispositifs à semiconducteurs

 
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TC 47 Document de Travail depuis 2014-07-28

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47/2244/DA

[Draft agenda for the TC 47 meeting to be held in Minsk, Belarus on 09 October 2015 (09.00h - 12.00h)]

Titre français non disponible
2015-07-17
47/2217A/RVC

[Result of voting on 47/2196/CDV: IEC 62779-2 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances]

Titre français non disponible
2015-07-10yes
47/2215A/RVC

[Result of voting on 47/2195/CDV: IEC 62779-1 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements]

Titre français non disponible
2015-07-03yes
47/2241A/CC

[Compilation of comments on 47/2224/CD: IEC 62951-1 Ed.1 : Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates]

Titre français non disponible
2015-07-03?
47/2242A/CD

[IEC 62951-1 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates]

Titre français non disponible
2015-07-032015-08-07?
TC 113
TC 119
47/2243/NP

[Future IEC 62969-5 Ed.1: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 5: Test/diagnosis method via vehicular network for automotive semiconductors]

Titre français non disponible
2015-06-122015-09-18?
TC 69
47/2232/CDV

IEC 62830-3 Ed.1: Dispositifs à semiconducteurs - Dispositifs à semiconducteurs pour récupération et génération d'énergie - Partie 3: Récupération d'énergie électromagnétique basée sur des vibrations
2015-06-052015-09-11yes
47/2241/CC

[This document has been replaced by 47/2241A/CC]

Titre français non disponible
2015-06-05?
47/2242/CD

[This document has been replaced by 47/2242A/CD]

Titre français non disponible
2015-06-05?
TC 113
TC 119
47/2231/CDV

IEC 60749-43 Ed.1: Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 43: Directives concernant les plans de qualification de la fiabilité des CI
2015-05-292015-09-04yes
TC 91
TC 104
47/2240/NP

[Future IEC 62830-4 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices]

Titre français non disponible
2015-05-152015-08-21?
47/2233/RQ

[Result of Questionnaire 47/2230/Q: Change of convenor in TC 47/WG 3 (Electronic Components - Long duration storage of electronic components guide for implementation) ]

Titre français non disponible
2015-05-08
47/2234/NP

[Future IEC 62830-5 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices]

Titre français non disponible
2015-05-082015-08-14?
TC 119
47/2235/NP

[Future IEC 62951-2 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Acceleration test for electron mobility, sub-threshold swing, and threshold voltage of flexible devices]

Titre français non disponible
2015-05-082015-08-14?
TC 119
47/2236/NP

[Future IEC 62951-3 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics (?, SS, Vth) on flexible substrates under bulging]

Titre français non disponible
2015-05-082015-08-14?
TC 119
47/2237/NP

[Future IEC 62951-4 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for films and substrates for flexible semiconductor devices]

Titre français non disponible
2015-05-082015-08-14?
TC 119
47/2238/NP

[Future IEC 62951-5 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials and devices]

Titre français non disponible
2015-05-082015-08-14?
TC 119
47/2239/NP

[Future IEC 62951-6 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films]

Titre français non disponible
2015-05-082015-08-14?
TC 119
47/2229/CDV

[IEC 62830-2 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting]

Titre français non disponible
2015-04-242015-07-24yesVoting Result
47/2226/CDV

IEC 60749-44 Ed.1: Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 44: Méthode d'essai des effets d'un événement isolé (SEE) irradié par un faisceau de neutrons pour des dispositifs à semiconducteurs
2015-04-172015-07-17yesVoting Result
TC 104
TC 107
47/2227/CDV

IEC 62779-3 Éd. 1: Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 3: Type fonctionnel et ses conditions d'utilisation
2015-04-172015-07-17yesVoting Result
47/2182A/CC

[Compilation of comments on 47/2169/CD: IEC 60749-43 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plan]

Titre français non disponible
2015-03-20yes
47/2230/Q

[Change of convenor in TC 47/WG 3: Electronic Components - Long duration storage of electronic components guide for implementation]

Titre français non disponible
2015-03-062015-04-17Report of Comments
47/2203A/CC

[Compilation of comments on 47/2190/CD: IEC 62830-2 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting]

Titre français non disponible
2015-02-13yes
47/2225/NP

[Future IEC 60749-41 Ed.1: Semiconductor devices - mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices]

Titre français non disponible
2015-02-062015-05-08?Voting Result
TC 91
47/2228/RM

[Unconfirmed Minutes of TC 47 Plenary meeting held in Tokyo, Japan on November 15, 2014]

Titre français non disponible
2015-02-06
47/2224/CD

[IEC 62951-1 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates]

Titre français non disponible
2015-01-092015-04-10?Report of Comments
TC 113
TC 119
47/2214/CDV

IEC 62830-1 Ed.1: Dispositifs à semi-conducteurs - Dispositifs à semi-conducteurs pour récupération et génération d'énergie - Partie 1: Récupération d'énergie piézoélectrique basée sur des vibrations
2014-12-192015-03-20yesVoting Result
47/2219/AC

[Chair of TC 47: Semiconductor devices]

Titre français non disponible
2014-12-192015-03-20Report of Comments
47/2218A/CC

[Compilation of comments on 47/2198/CD: IEC 62830-3 Ed. 1.0 : Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting]

Titre français non disponible
2014-12-12yes
47/2220/RVN

[Result of voting on 47/2205/NP: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors]

Titre français non disponible
2014-12-12?
47/2221/RVN

[Result of voting on 47/2206/NP: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors]

Titre français non disponible
2014-12-12?
47/2222/RVN

[Result of voting on 47/2207/NP: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors]

Titre français non disponible
2014-12-12?
47/2223/RVN

[Result of voting on 47/2208/NP: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 4: Evaluation methods of data interface for automotive vehicle sensors]

Titre français non disponible
2014-12-12?
47/2218/CC

[This document has been replaced by 47/2218A/CC]

Titre français non disponible
2014-11-07yes
47/2216/CC

[Compilation of comments on 47/2193/CD: IEC 60749-44 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices ]

Titre français non disponible
2014-10-31yes
47/2217/RVC

[This document has been replaced by 47/2217A/RVC]

Titre français non disponible
2014-10-31yes
47/2215/RVC

[This document has been replaced by 47/2215A/RVC]

Titre français non disponible
2014-10-24yes
47/2209A/DA

[Revised draft agenda for the TC 47 meeting to be held in Tokyo, Japan on 15 November 2014 (09.00h - 12.00h)]

Titre français non disponible
2014-10-17
47/2213/PW

[Programme of Work of TC 47 as recorded by the IEC Central Office in its database]

Titre français non disponible
2014-10-17
47/2210/RVN

[Result of voting on 47/2199/NP: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates ]

Titre français non disponible
2014-09-05?
47/2211/DC

[Review and Maintenance - call for comments/ proposals on publications coming up for review and a call for experts]

Titre français non disponible
2014-09-052014-10-31Report of Comments
47/2212/CC

[Compilation of comments on 47/2197/CD: IEC 62779-3 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions]

Titre français non disponible
2014-09-05yes
47/2209/DA

[Draft agenda for the TC 47 meeting to be held in Tokyo, Japan on 15 November 2014 (09.00h - 12.00h)]

Titre français non disponible
2014-08-15