International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Dispositifs à semiconducteurs

 
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TC 47 Document de Travail depuis 2013-12-21

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47/2214/CDV

IEC 62830-1 Ed.1: Dispositifs à semi-conducteurs - Dispositifs à semi-conducteurs pour récupération et génération d'énergie - Partie 1: Récupération d'énergie piézoélectrique basée sur des vibrations
2014-12-192015-03-20yes
47/2219/AC

[Chair of TC 47: Semiconductor devices]

Titre français non disponible
2014-12-192015-03-20
47/2218A/CC

[Compilation of comments on 47/2198/CD: IEC 62830-3 Ed. 1.0 : Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting]

Titre français non disponible
2014-12-12yes
47/2220/RVN

[Result of voting on 47/2205/NP: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors]

Titre français non disponible
2014-12-12?
47/2221/RVN

[Result of voting on 47/2206/NP: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors]

Titre français non disponible
2014-12-12?
47/2222/RVN

[Result of voting on 47/2207/NP: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors]

Titre français non disponible
2014-12-12?
47/2223/RVN

[Result of voting on 47/2208/NP: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 4: Evaluation methods of data interface for automotive vehicle sensors]

Titre français non disponible
2014-12-12?
47/2218/CC

[This document has been replaced by 47/2218A/CC]

Titre français non disponible
2014-11-07yes
47/2216/CC

[Compilation of comments on 47/2193/CD: IEC 60749-44 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices ]

Titre français non disponible
2014-10-31yes
47/2217/RVC

[Result of voting on 47/2196/CDV: IEC 62779-2 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances]

Titre français non disponible
2014-10-31yes
47/2215/RVC

[Result of voting on 47/2195/CDV: IEC 62779-1 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements]

Titre français non disponible
2014-10-24yes
47/2209A/DA

[Revised draft agenda for the TC 47 meeting to be held in Tokyo, Japan on 15 November 2014 (09.00h - 12.00h)]

Titre français non disponible
2014-10-17
47/2213/PW

[Programme of Work of TC 47 as recorded by the IEC Central Office in its database]

Titre français non disponible
2014-10-17
47/2210/RVN

[Result of voting on 47/2199/NP: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates ]

Titre français non disponible
2014-09-05?
47/2211/DC

[Review and Maintenance - call for comments/ proposals on publications coming up for review and a call for experts]

Titre français non disponible
2014-09-052014-10-31Report of Comments
47/2212/CC

[Compilation of comments on 47/2197/CD: IEC 62779-3 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions]

Titre français non disponible
2014-09-05yes
47/2209/DA

[Draft agenda for the TC 47 meeting to be held in Tokyo, Japan on 15 November 2014 (09.00h - 12.00h)]

Titre français non disponible
2014-08-15
47/2205/NP

[Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors]

Titre français non disponible
2014-07-252014-10-31?Voting Result
TC 69
47/2206/NP

[Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors]

Titre français non disponible
2014-07-252014-10-31?Voting Result
TC 69
47/2207/NP

[Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors]

Titre français non disponible
2014-07-252014-10-31?Voting Result
TC 69
47/2208/NP

[Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 4: Evaluation methods of data interface for automotive vehicle sensors]

Titre français non disponible
2014-07-252014-10-31?Voting Result
TC 69
47/2204/RVD

Rapport de vote sur le 47/2200/FDIS: CEI 60749-42 Ed.1: Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 42: Stockage de température et d'humidité
2014-07-18yes
47/2202/CC

[Compilation of comments on 47/2189/CD: IEC 62830-1 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting]

Titre français non disponible
2014-05-30yes
47/2203/CC

[Compilation of comments on 47/2190/CD: IEC 62830-2 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting]

Titre français non disponible
2014-05-30yes
47/2201/CC

[Compilation of comments on 47/2191/CD: IEC 62880-1 Ed.1: Semiconductor devices - Wafer Level Reliability for Semiconductor Devices - Part 1: Copper Stress Migration Test Method]

Titre français non disponible
2014-05-23yes
47/2195/CDV

IEC 62779-1 Éd.1: Dispositifs à semi-conducteurs - Interface à semi-conducteurs pour les communications via le corps humain - Partie 1: Exigences générales
2014-05-092014-08-15yesVoting Result
47/2196/CDV

IEC 62779-2 Ed.1: Dispositifs à semiconducteurs - Interface à semi-conducteurs pour les communications via le corps humain - Partie 2: Caractérisation des performances d'interfaçage
2014-05-092014-08-15yesVoting Result
47/2200/FDIS

CEI 60749-42 Ed.1: Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 42: Stockage de température et d'humidité
2014-05-092014-07-11yesVoting Result
47/2198/CD

[IEC 62830-3 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting]

Titre français non disponible
2014-04-252014-07-25yesReport of Comments
47/2199/NP

[Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates]

Titre français non disponible
2014-04-252014-07-25?Voting Result
TC 119
47/2165B/CC

[Compilation of comments on 47/2152/CD: IEC 62779-1 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements]

Titre français non disponible
2014-04-04yes
47/2166B/CC

[Compilation of comments on 47/2153/CD: IEC 62779-2 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances]

Titre français non disponible
2014-04-04yes
47/2181A/RVC

[Result of voting on 47/2159/CDV: IEC 60749-42 Ed.1: Temperature humidity storage ]

Titre français non disponible
2014-04-04yes
47/2197/CD

[IEC 62779-3 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions]

Titre français non disponible
2014-04-042014-07-04yesReport of Comments
47/2151A/RVN

[Result of voting on 47/2130/NP: Future IEC 60749-43 Ed. 1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Neutron irradiated soft error test method for semiconductor devices with memory ]

Titre français non disponible
2014-02-28yes
47/2165A/CC

[This document has been replaced by 47/2165B/CC]

Titre français non disponible
2014-02-28yes
47/2166A/CC

[This document has been replaced by 47/2166B/CC]

Titre français non disponible
2014-02-28yes
47/2193/CD

[IEC 60749-44 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices]

Titre français non disponible
2014-02-282014-05-30yesReport of Comments
TC 104
TC 107
47/2194/RQ

[Result of Questionnaire 47/2187/Q: Establishing new working group and nomination of convenor in TC 47/WG7]

Titre français non disponible
2014-02-28
47/2192A/RQ

[Result of Questionnaire on 47/2185/Q: Nomination of a chairman for SC 47D: Semiconductor devices packaging ]

Titre français non disponible
2014-02-07
47/2192/RQ

[This document has been replaced by 47/2192A/RQ]

Titre français non disponible
2014-01-31
47/2191/CD

[IEC 62880-1 Ed.1: Semiconductor devices - Wafer Level Reliability for Semiconductor Devices - Part 1: Copper Stress Migration Test Method]

Titre français non disponible
2014-01-242014-04-25yesReport of Comments
TC 91
TC 104
47/2189/CD

[IEC 62830-1 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting]

Titre français non disponible
2014-01-172014-04-18yesReport of Comments
47/2190/CD

[IEC 62830-2 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting]

Titre français non disponible
2014-01-172014-04-18yesReport of Comments
47/2187/Q

[Establishing new working group and nomination of convenor in TC 47/WG7 ]

Titre français non disponible
2014-01-102014-02-21Report of Comments
47/2188/RM

[Unconfirmed Minutes of TC 47 Plenary meeting held in London, United Kingdom on 11 October, 2013]

Titre français non disponible
2014-01-10