International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
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TC 47 Working Documents since 2013-07-24

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47/2204/RVD

Report of Voting on 47/2200/FDIS: IEC 60749-42 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
2014-07-18yes
47/2202/CC

Compilation of comments on 47/2189/CD: IEC 62830-1 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
2014-05-30yes
47/2203/CC

Compilation of comments on 47/2190/CD: IEC 62830-2 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
2014-05-30yes
47/2201/CC

Compilation of comments on 47/2191/CD: IEC 62880-1 Ed.1: Semiconductor devices - Wafer Level Reliability for Semiconductor Devices - Part 1: Copper Stress Migration Test Method
2014-05-23yes
47/2195/CDV

IEC 62779-1 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
2014-05-092014-08-15yes
47/2196/CDV

IEC 62779-2 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
2014-05-092014-08-15yes
47/2200/FDIS

IEC 60749-42 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storageIEC 60749-42 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
2014-05-092014-07-11yesVoting Result
47/2198/CD

IEC 62830-3 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
2014-04-252014-07-25?
47/2199/NP

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
2014-04-252014-07-25?
TC 119
47/2165B/CC

Compilation of comments on 47/2152/CD: IEC 62779-1 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
2014-04-04yes
47/2166B/CC

Compilation of comments on 47/2153/CD: IEC 62779-2 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
2014-04-04yes
47/2181A/RVC

Result of voting on 47/2159/CDV: IEC 60749-42 Ed.1: Temperature humidity storage
2014-04-04yes
47/2197/CD

IEC 62779-3 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
2014-04-042014-07-04?Report of Comments
47/2151A/RVN

Result of voting on 47/2130/NP: Future IEC 60749-43 Ed. 1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Neutron irradiated soft error test method for semiconductor devices with memory
2014-02-28?
47/2165A/CC

This document has been replaced by 47/2165B/CC
2014-02-28yes
47/2166A/CC

This document has been replaced by 47/2166B/CC
2014-02-28yes
47/2193/CD

IEC 60749-44 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
2014-02-282014-05-30?Report of Comments
TC 104
TC 107
47/2194/RQ

Result of Questionnaire 47/2187/Q: Establishing new working group and nomination of convenor in TC 47/WG7
2014-02-28
47/2192A/RQ

Result of Questionnaire on 47/2185/Q: Nomination of a chairman for SC 47D: Semiconductor devices packaging
2014-02-07
47/2192/RQ

This document has been replaced by 47/2192A/RQ
2014-01-31
47/2191/CD

IEC 62880-1 Ed.1: Semiconductor devices - Wafer Level Reliability for Semiconductor Devices - Part 1: Copper Stress Migration Test Method
2014-01-242014-04-25yesReport of Comments
TC 91
TC 104
47/2189/CD

IEC 62830-1 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
2014-01-172014-04-18yesReport of Comments
47/2190/CD

IEC 62830-2 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
2014-01-172014-04-18yesReport of Comments
47/2187/Q

Establishing new working group and nomination of convenor in TC 47/WG7
2014-01-102014-02-21Report of Comments
47/2188/RM

Unconfirmed Minutes of TC 47 Plenary meeting held in London, United Kingdom on 11 October, 2013
2014-01-10
47/2185/Q

Nomination of a chairman for SC 47D: Semiconductor devices packaging
2013-12-132014-01-24Report of Comments
47/2186/RQ

Result of Questionnaire on 47/2184/Q: Extension of the term of office of the chairman of SC 47F: Micro-electromechanical systems
2013-12-13
47/2184/Q

Extension of the term of office of the chairman of SC 47F: Micro-electromechanical systems
2013-10-252013-12-06Report of Comments
47/2176A/RVN

Result of voting on on 47/2157/NP: Copper stress migration test method
2013-09-06yes
47/2177A/DA

Revised draft agenda for the TC 47 meeting to be held in London, United Kingdom on 11 October 2013 (09.00h - 12.30h)
2013-09-06
47/2180/RVD

Report of Voting on 47/2171/FDIS: IEC 62483 Ed.1: Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
2013-09-06no
47/2181/RVC

This document has been replaced by 47/2181A/RVC
2013-09-06yes
47/2182/CC

Compilation of comments on 47/2169/CD: IEC 60749-43 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plan
2013-09-06?
47/2183/PW

Programme of Work of TC 47 as recorded by the IEC Central Office in its database
2013-09-06
47/2179/DC

Review and Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2013-07-262013-09-06Report of Comments