International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
TC 47 Working Documents since 2012-04-06
  Reference, Title | Downloads | Circulation Date | Closing Date | CENELEC | Voting / Comment | Authorized Committees |
|---|---|---|---|---|---|---|
47/2167/RVDReport of Voting on 47/2160/FDIS: IEC 60749-26 Ed. 3: Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) | 2013-04-05 | no | ||||
47/2159/CDVIEC 60749-42 Ed.1: Temperature humidity storage | 2013-03-15 | 2013-06-21 | yes | |||
47/2155/CDVIEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM) | 2013-03-08 | 2013-06-14 | yes | TC 91 TC 104 | ||
47/2165/CCCompilation of comments on 47/2152/CD: IEC 62779-1 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements | 2013-02-22 | yes | ||||
47/2166/CCCompilation of comments on 47/2153/CD: IEC 62779-2 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances | 2013-02-22 | yes | ||||
47/2164/NPFuture IEC 62830-3 Ed.1: Semiconductor devices - semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting | 2013-02-08 | 2013-05-10 | ? | |||
47/2163/RVNResult of voting on 47/2147/NP: Future IEC 62779-3 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions | 2013-02-01 | ? | ||||
47/2161/RQResult of Questionnaire on 47/2154/Q: Extension of the term of office of the chairman of SC 47E: Discrete semiconductor devices
| 2013-01-25 | |||||
47/2162/RMUnconfirmed Minutes of TC 47 Plenary meeting held in Jeju, Korea on October 26, 2012 | 2013-01-25 | |||||
47/2160/FDISIEC 60749-26 Ed. 3: Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) | 2013-01-18 | 2013-03-22 | no | Voting Result | ||
47/2158/RQResult of Questionnaire 47/2145/Q: Nomination of co-convenor in TC 47/WG6 | 2013-01-04 | |||||
47/2150A/CCRevised compilation of comments on 47/2131/CD: IEC 60749- 42 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage
| 2013-01-04 | yes | ||||
47/2156/RVCResult of voting on 47/2122/CDV: IEC 62483 Ed. 1: Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes | 2012-12-21 | yes | ||||
47/2157/NPCopper stress migration test method | 2012-12-21 | 2013-03-22 | ? | Voting Result | ||
47/2149A/CCRevised compilation of comments on 47/2123/CD: IEC 60749-28: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing - Direct contact charged device model (DC-CDM)
| 2012-12-21 | yes | ||||
47/2154/QFurther extension of the term of office of the chairman of SC 47E: Discrete semiconductor devices | 2012-12-07 | 2013-01-18 | Report of Comments | |||
47/2148/PWProgramme of Work of TC 47 as recorded by the IEC Central Office in its database. | 2012-09-28 | |||||
47/2149/CCCompilation of comments on 47/2123/CD: IEC 60749-28: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing - Direct contact charged device model (DC-CDM)
| 2012-09-28 | yes | ||||
47/2150/CCCompilation of comments on 47/2131/CD: IEC 60749- 42 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage
| 2012-09-28 | yes | ||||
47/2151/RVNResult of voting on 47/2130/NP: Future IEC 60749-43 Ed. 1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Neutron irradiated soft error test method for semiconductor devices with memory
| 2012-09-28 | ? | ||||
47/2152/CDIEC 62779-1 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements | 2012-09-28 | 2013-01-04 | yes | Report of Comments | ||
47/2153/CDEC 62779-2 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances | 2012-09-28 | 2013-01-04 | yes | Report of Comments | ||
47/2140A/DARevised draft agenda for the TC 47 meeting to be held in Jeju, Korea on 26 October 2012 (09.00h - 12.00h) | 2012-09-28 | |||||
47/2147/NPFuture IEC 62779-3 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions | 2012-09-07 | 2012-12-07 | ? | Voting Result | ||
47/2138A/RVNRevised result of voting on 47/2121/NP: Future IEC 62483 Ed. 1: Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes
| 2012-09-07 | yes | ||||
47/2144/RVDReport of Voting on 47/2135/FDIS: Amendment 1 - IEC 60749-27 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) | 2012-08-31 | yes | ||||
47/2145/QNomination of co-convenor in TC 47/WG6: Incubating Working Group | 2012-08-31 | 2012-10-12 | Report of Comments | |||
47/2146/DCReview and Maintenance - call for comments/ proposals on publications coming up for review and a call for experts | 2012-08-31 | 2012-10-12 | Report of Comments | |||
47/2142/RVNResult of voting on 47/2126A/NP: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
| 2012-08-17 | ? | ||||
47/2143/RVNResult of voting on 47/2128/NP: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
| 2012-08-17 | ? | ||||
47/2141/ACNext meeting of TC 47 and its Subcommittees 47A, 47D, 47E, 47F and associated working groups to be held in Jeju, Korea from 22 to 26 October, 2012 (online registration).
| 2012-08-03 | |||||
47/2137/RVNResult of voting on 47/2119A/NP: Copper Stress migration Test Method
| 2012-07-27 | ? | ||||
47/2138/RVNResult of voting on 47/2121/NP: Future IEC 62483 Ed. 1: Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes
| 2012-07-27 | yes | ||||
47/2139/RVNResult of voting on 47/2115/NP: Guidelines for LSI reliability qualification plans | 2012-07-27 | ? | TC 91 TC 107 | |||
47/2140/DADraft agenda for the TC 47 meeting to be held in Jeju, Korea on 26 October 2012 (09.00h - 12.00h) | 2012-07-27 | |||||
47/2136/RQResult of Questionnaire on 47/2132/Q: Further extension of the term of office of the chairman of SC 47A: Integrated circuits | 2012-07-06 | |||||
47/2135/FDISAmendment 1 - IEC 60749-27 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic
discharge (ESD) sensitivity testing - Machine model (MM)
| 2012-06-15 | 2012-08-17 | yes | Voting Result | ||
47/2134/ACNext meeting of TC 47 and its Subcommittees 47A, 47D, 47E, 47F and associated working groups to be held in Jeju, Korea from 22 to 26 October 2012 | 2012-06-01 | |||||
47/2133/RQResult of Questionnaire 47/2120/Q: New title and revised scope of SC 47D | 2012-05-25 | |||||
47/2132/QFurther extension of the term of office of the chairman of SC 47A: Integrated circuits | 2012-05-18 | 2012-06-29 | Report of Comments | |||
47/2131/CDIEC 60749-42 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage | 2012-05-04 | 2012-07-06 | yes | Report of Comments | ||
47/2128/NPSemiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting | 2012-04-20 | 2012-07-20 | ? | Voting Result | ||
47/2129/RVNResult of voting on 47/2117/NP: Future IEC 60749-42: Temperature humidity storage
| 2012-04-20 | yes | ||||
47/2130/NPFuture IEC 60749-43 Ed. 1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Neutron irradiated soft error test method for semiconductor devices with memory | 2012-04-20 | 2012-07-20 | ? | Voting Result | TC 91 | |
47/2126A/NPSemiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting | 2012-04-20 | 2012-07-13 | ? | Voting Result | ||
47/2126/NPThis document has been replaced by 47/2126A/NP
| 2012-04-13 | ? | ||||
47/2127/RVCResult of voting on 47/2101A/CDV: IEC 60749-26 Ed.3: Electrostatic discharge sensitivity testing - Human body model (HBM) - Component Level
| 2012-04-13 | no |
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