International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
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TC 47 Working Documents since 2012-04-06

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47/2167/RVD

Report of Voting on 47/2160/FDIS: IEC 60749-26 Ed. 3: Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
2013-04-05no
47/2159/CDV

IEC 60749-42 Ed.1: Temperature humidity storage
2013-03-152013-06-21yes
47/2155/CDV

IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM)
2013-03-082013-06-14yes
TC 91
TC 104
47/2165/CC

Compilation of comments on 47/2152/CD: IEC 62779-1 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
2013-02-22yes
47/2166/CC

Compilation of comments on 47/2153/CD: IEC 62779-2 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
2013-02-22yes
47/2164/NP

Future IEC 62830-3 Ed.1: Semiconductor devices - semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
2013-02-082013-05-10?
47/2163/RVN

Result of voting on 47/2147/NP: Future IEC 62779-3 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
2013-02-01?
47/2161/RQ

Result of Questionnaire on 47/2154/Q: Extension of the term of office of the chairman of SC 47E: Discrete semiconductor devices
2013-01-25
47/2162/RM

Unconfirmed Minutes of TC 47 Plenary meeting held in Jeju, Korea on October 26, 2012
2013-01-25
47/2160/FDIS

IEC 60749-26 Ed. 3: Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
2013-01-182013-03-22noVoting Result
47/2158/RQ

Result of Questionnaire 47/2145/Q: Nomination of co-convenor in TC 47/WG6
2013-01-04
47/2150A/CC

Revised compilation of comments on 47/2131/CD: IEC 60749- 42 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage
2013-01-04yes
47/2156/RVC

Result of voting on 47/2122/CDV: IEC 62483 Ed. 1: Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes
2012-12-21yes
47/2157/NP

Copper stress migration test method
2012-12-212013-03-22?Voting Result
47/2149A/CC

Revised compilation of comments on 47/2123/CD: IEC 60749-28: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing - Direct contact charged device model (DC-CDM)
2012-12-21yes
47/2154/Q

Further extension of the term of office of the chairman of SC 47E: Discrete semiconductor devices
2012-12-072013-01-18Report of Comments
47/2148/PW

Programme of Work of TC 47 as recorded by the IEC Central Office in its database.
2012-09-28
47/2149/CC

Compilation of comments on 47/2123/CD: IEC 60749-28: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing - Direct contact charged device model (DC-CDM)
2012-09-28yes
47/2150/CC

Compilation of comments on 47/2131/CD: IEC 60749- 42 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage
2012-09-28yes
47/2151/RVN

Result of voting on 47/2130/NP: Future IEC 60749-43 Ed. 1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Neutron irradiated soft error test method for semiconductor devices with memory
2012-09-28?
47/2152/CD

IEC 62779-1 Ed.1: Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
2012-09-282013-01-04yesReport of Comments
47/2153/CD

EC 62779-2 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
2012-09-282013-01-04yesReport of Comments
47/2140A/DA

Revised draft agenda for the TC 47 meeting to be held in Jeju, Korea on 26 October 2012 (09.00h - 12.00h)
2012-09-28
47/2147/NP

Future IEC 62779-3 Ed. 1: Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
2012-09-072012-12-07?Voting Result
47/2138A/RVN

Revised result of voting on 47/2121/NP: Future IEC 62483 Ed. 1: Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes
2012-09-07yes
47/2144/RVD

Report of Voting on 47/2135/FDIS: Amendment 1 - IEC 60749-27 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
2012-08-31yes
47/2145/Q

Nomination of co-convenor in TC 47/WG6: Incubating Working Group
2012-08-312012-10-12Report of Comments
47/2146/DC

Review and Maintenance - call for comments/ proposals on publications coming up for review and a call for experts
2012-08-312012-10-12Report of Comments
47/2142/RVN

Result of voting on 47/2126A/NP: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
2012-08-17?
47/2143/RVN

Result of voting on 47/2128/NP: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
2012-08-17?
47/2141/AC

Next meeting of TC 47 and its Subcommittees 47A, 47D, 47E, 47F and associated working groups to be held in Jeju, Korea from 22 to 26 October, 2012 (online registration).
2012-08-03
47/2137/RVN

Result of voting on 47/2119A/NP: Copper Stress migration Test Method
2012-07-27?
47/2138/RVN

Result of voting on 47/2121/NP: Future IEC 62483 Ed. 1: Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes
2012-07-27yes
47/2139/RVN

Result of voting on 47/2115/NP: Guidelines for LSI reliability qualification plans
2012-07-27?
TC 91
TC 107
47/2140/DA

Draft agenda for the TC 47 meeting to be held in Jeju, Korea on 26 October 2012 (09.00h - 12.00h)
2012-07-27
47/2136/RQ

Result of Questionnaire on 47/2132/Q: Further extension of the term of office of the chairman of SC 47A: Integrated circuits
2012-07-06
47/2135/FDIS

Amendment 1 - IEC 60749-27 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
2012-06-152012-08-17yesVoting Result
47/2134/AC

Next meeting of TC 47 and its Subcommittees 47A, 47D, 47E, 47F and associated working groups to be held in Jeju, Korea from 22 to 26 October 2012
2012-06-01
47/2133/RQ

Result of Questionnaire 47/2120/Q: New title and revised scope of SC 47D
2012-05-25
47/2132/Q

Further extension of the term of office of the chairman of SC 47A: Integrated circuits
2012-05-182012-06-29Report of Comments
47/2131/CD

IEC 60749-42 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage
2012-05-042012-07-06yesReport of Comments
47/2128/NP

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
2012-04-202012-07-20?Voting Result
47/2129/RVN

Result of voting on 47/2117/NP: Future IEC 60749-42: Temperature humidity storage
2012-04-20yes
47/2130/NP

Future IEC 60749-43 Ed. 1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Neutron irradiated soft error test method for semiconductor devices with memory
2012-04-202012-07-20?Voting Result
TC 91
47/2126A/NP

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
2012-04-202012-07-13?Voting Result
47/2126/NP

This document has been replaced by 47/2126A/NP
2012-04-13?
47/2127/RVC

Result of voting on 47/2101A/CDV: IEC 60749-26 Ed.3: Electrostatic discharge sensitivity testing - Human body model (HBM) - Component Level
2012-04-13no