SC 47D

Semiconductor devices packaging

Label	Title
Working Groups
WG 1	Package outlines
WG 2	Terms, definitions, practices and procedures and measuring methods for mechanical standardization

Country	Country Code	P/O Status	IEC Membership
Austria	AT	P-Member	Full Member
Belarus	BY	O-Member	Full Member
Belgium	BE	P-Member	Full Member
China	CN	P-Member	Full Member
Czech Republic	CZ	O-Member	Full Member
Denmark	DK	O-Member	Full Member
Finland	FI	P-Member	Full Member
France	FR	P-Member	Full Member
Germany	DE	P-Member	Full Member
Italy	IT	O-Member	Full Member
Japan	JP	P-Member	Full Member
Korea, Republic of	KR	P-Member	Full Member
Netherlands	NL	O-Member	Full Member
Pakistan	PK	P-Member	Full Member
Poland	PL	O-Member	Full Member
Portugal	PT	O-Member	Full Member
Romania	RO	O-Member	Full Member
Russian Federation	RU	O-Member	Full Member
Spain	ES	O-Member	Full Member
Sweden	SE	O-Member	Full Member
Thailand	TH	O-Member	Full Member
Ukraine	UA	O-Member	Full Member
United Kingdom	GB	P-Member	Full Member
United States of America	US	P-Member	Full Member

Chairman	Mr Shinichi Nakamura (JP) Term of office : 2014-04	Send Email
Secretary	Mr Hiroyoshi Yoshida (JP)	Send Email
Technical Officer	Ms Suzanne Yap Geok Sim	Send Email

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Committee	Description
Internal IEC Liaison
SC 3D	Product properties and classes and their identification
TC 40	Capacitors and resistors for electronic equipment
SC 65E	Devices and integration in enterprise systems
TC 91	Electronics assembly technology

Working Groups	Description	Organization
Liaison D
WG 1	Package outlines	JEITA
WG 2	Terms, definitions, practices and procedures and measuring methods for mechanical standardization	JEITA