International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Subcommittee(s) and/or Working Group(s)

Label
Title
Working Groups
WG 1Requirements for electronic components
WG 2Requirements for electronics assemblies
WG 3Measuring and test methods for electronics assemblies
WG 4Printed boards and materials
WG 5Terms and definitions
WG 6Printed boards - Device Embedded Substrate - Terminology / Reliability /Design Guide
WG 10Measuring and test methods for printed boards and printed board materials
WG 11Printed board electronic data description and transfer
WG 12Design of printed boards and board assemblies
WG 13Design Automation: Component, Circuit and System Description Language
WG 14Design Automation: Library of reusable Parts for Electrotechnical Products
WG 15Design Automation: Testing of Electrotechnical Products
Joint Working Groups
JWG 9Optical functionality for electronic assemblies Managed by TC 86
Advisory Groups
AG 16Standardization Strategy
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TC 91 Membership

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AT
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Full Member
BE
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BR
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BG
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CN
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CZ
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DK
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FI
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FR
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DE
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HU
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IN
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IL
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Full Member
IT
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JP
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KR
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NL
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NO
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PL
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PT
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RO
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RU
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RS
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SI
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ES
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SE
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CH
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TR
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UA
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GB
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US
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Facts and figures

Secretariat
Japan
Participating countries
12
Observer Countries
19
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TC 91 Officers

Chair
Mr Chris Hunt (GB)
Term of office : 2021-02

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Secretary
Mr Masahide Okamoto (JP)

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IEC Central Office Contacts

Technical Officer
Ms Geok Sim Yap

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Administrative Assistant
Ms Poh Luan Teo

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Editor
Mr Leon Morsley

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TC 91 Liaisons

Committee
Description
Liaison Member
Internal IEC Liaison
SC 3CGraphical symbols for use on equipmentMr Arto Sirviö
TC 40Capacitors and resistors for electronic equipmentMr Masahiro Tambo
TC 47Semiconductor devices 
SC 47AIntegrated circuitsMr Yoshinori FUKUBA
Mr Bernd Römer
SC 47DSemiconductor devices packaging 
SC 47EDiscrete semiconductor devices 
SC 48BElectrical connectors 
TC 49Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection 
TC 51Magnetic components, ferrite and magnetic powder materials 
TC 86Fibre opticsMr Hideo ITOH
TC 104Environmental conditions, classification and methods of test 
TC 107Process management for avionics 
TC 111Environmental standardization for electrical and electronic products and systems 
TC 119Printed Electronics 
ISO/IEC JTC 1/SC 41Internet of Things and related technologies 
Liaison ISO
ISO/TC 44/SC 12Soldering materials 
ISO/TC 69/SC 5Acceptance sampling 
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TC 91 Working Groups Liaisons

Working Groups
Description
Organization
Liaison Member
Liaison D
WG 1
Requirements for electronic components
JPCA
WG 1
Requirements for electronic components
IPC
WG 1
Requirements for electronic components
EDIFICE
Mr Erich Günter
Mr Rainer Schrundner
WG 1
Requirements for electronic components
JEITA
WG 2
Requirements for electronics assemblies
IPC
WG 2
Requirements for electronics assemblies
JPCA
WG 2
Requirements for electronics assemblies
JEITA
WG 3
Measuring and test methods for electronics assemblies
JPCA
WG 3
Measuring and test methods for electronics assemblies
IPC
WG 3
Measuring and test methods for electronics assemblies
JEITA
WG 4
Printed boards and materials
JPCA
WG 4
Printed boards and materials
IPC
WG 4
Printed boards and materials
JEITA
WG 5
Terms and definitions
JPCA
WG 5
Terms and definitions
IPC
WG 5
Terms and definitions
JEITA
WG 10
Measuring and test methods for printed boards and printed board materials
JPCA
WG 10
Measuring and test methods for printed boards and printed board materials
IPC
WG 10
Measuring and test methods for printed boards and printed board materials
JEITA
WG 11
Printed board electronic data description and transfer
JEITA
WG 11
Printed board electronic data description and transfer
IPC
WG 11
Printed board electronic data description and transfer
JPCA
WG 12
Design of printed boards and board assemblies
IPC
WG 12
Design of printed boards and board assemblies
JEITA
WG 12
Design of printed boards and board assemblies
JPCA