International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
TC 91 Subcommittee(s) and/or Working Group(s)
Label |
Title |
|---|---|
| Working Groups | |
| WG 1 | Requirements for electronic components |
| WG 2 | Requirements for electronics assemblies |
| WG 3 | Measuring and test methods for electronics assemblies |
| WG 4 | Printed boards and materials |
| WG 5 | (TC 91/TC 93) - Terms and definitions |
| WG 6 | Printed boards - Device Embedded Substrate - Terminology / Reliability /Design Guide |
| WG 10 | Measuring and test methods for printed boards and printed board materials |
| WG 12 | Design of printed boards and board assemblies |
| WG 13 | Design Automation: Component, Circuit and System Description Language |
| WG 14 | Design Automation: Library of reusable Parts for Electrotechnical Products |
| WG 15 | Design Automation: Testing of Electrotechnical Products |
| Joint Working Groups | |
| JWG 11 | (TC 91/TC 93) - Printed board electronic data description and transfer |
TC 91 Membership
 Country | Country Code  | P/O Status | IEC Membership |
|---|---|---|---|
AT | O-Member | Full Member | |
BE | P-Member | Full Member | |
BR | P-Member | Full Member | |
BG | O-Member | Full Member | |
CN | P-Member | Full Member | |
CZ | O-Member | Full Member | |
DK | O-Member | Full Member | |
FI | P-Member | Full Member | |
FR | O-Member | Full Member | |
DE | P-Member | Full Member | |
HU | O-Member | Full Member | |
IN | P-Member | Full Member | |
IL | O-Member | Full Member | |
IT | P-Member | Full Member | |
JP | P-Member | Full Member | |
KR | P-Member | Full Member | |
NL | P-Member | Full Member | |
NO | O-Member | Full Member | |
PL | O-Member | Full Member | |
PT | O-Member | Full Member | |
RO | O-Member | Full Member | |
RU | P-Member | Full Member | |
RS | O-Member | Full Member | |
SG | O-Member | Full Member | |
SI | O-Member | Full Member | |
ES | O-Member | Full Member | |
SE | O-Member | Full Member | |
CH | O-Member | Full Member | |
TR | O-Member | Full Member | |
UA | O-Member | Full Member | |
GB | P-Member | Full Member | |
US | P-Member | Full Member |
Facts and figures
Secretariat | Japan |
|---|---|
Participating countries | 13 |
Observer Countries | 19 |
TC 91 Officers
Chairman | Mr Dieter W. Bergman (US) Term of office : 2016-05 | |
|---|---|---|
Secretary | Mr Masahide Okamoto (JP) | |
Technical Officer | Ms Suzanne Yap Geok Sim |
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TC 91 Liaisons
Committee |
Description |
|---|---|
| Internal IEC Liaison | |
| SC 3C | Graphical symbols for use on equipment |
| TC 40 | Capacitors and resistors for electronic equipment |
| TC 47 | Semiconductor devices |
| SC 47D | Semiconductor devices packaging |
| SC 47E | Discrete semiconductor devices |
| TC 48 | Electromechanical components and mechanical structures for electronic equipment |
| SC 48B | Connectors |
| TC 49 | Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection |
| TC 51 | Magnetic components and ferrite materials |
| TC 104 | Environmental conditions, classification and methods of test |
| TC 109 | Insulation co-ordination for low-voltage equipment |
| TC 111 | Environmental standardization for electrical and electronic products and systems |
| Liaison ISO | |
| ISO/TC 44/SC 12 | Soldering materials |
| ISO/TC 69/SC 5 | Acceptance sampling |
| ISO/TC 184/SC 4 | Industrial data |
TC 91 Working Groups Liaisons
Working Groups | Description | Organization |
|---|---|---|
| Liaison D | ||
| JWG 11 | (TC 91/TC 93) - Printed board electronic data description and transfer | IPC |
| JWG 11 | (TC 91/TC 93) - Printed board electronic data description and transfer | JEITA |
| JWG 11 | (TC 91/TC 93) - Printed board electronic data description and transfer | JPCA |
| WG 1 | Requirements for electronic components | JPCA |
| WG 1 | Requirements for electronic components | IPC |
| WG 1 | Requirements for electronic components | JEITA |
| WG 2 | Requirements for electronics assemblies | JEITA |
| WG 2 | Requirements for electronics assemblies | IPC |
| WG 2 | Requirements for electronics assemblies | JPCA |
| WG 3 | Measuring and test methods for electronics assemblies | IPC |
| WG 3 | Measuring and test methods for electronics assemblies | JEITA |
| WG 3 | Measuring and test methods for electronics assemblies | JPCA |
| WG 4 | Printed boards and materials | JEITA |
| WG 4 | Printed boards and materials | IPC |
| WG 4 | Printed boards and materials | JPCA |
| WG 5 | (TC 91/TC 93) - Terms and definitions | IPC |
| WG 5 | (TC 91/TC 93) - Terms and definitions | JPCA |
| WG 5 | (TC 91/TC 93) - Terms and definitions | JEITA |
| WG 10 | Measuring and test methods for printed boards and printed board materials | JPCA |
| WG 10 | Measuring and test methods for printed boards and printed board materials | JEITA |
| WG 10 | Measuring and test methods for printed boards and printed board materials | IPC |
| WG 12 | Design of printed boards and board assemblies | JPCA |
| WG 12 | Design of printed boards and board assemblies | JEITA |
| WG 12 | Design of printed boards and board assemblies | IPC |