International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
TC 47 Subcommittee(s) and/or Working Group(s)
Label |
Title |
|---|---|
| Subcommittees | |
| SC 47A | Integrated circuits |
| SC 47D | Semiconductor devices packaging |
| SC 47E | Discrete semiconductor devices |
| SC 47F | Micro-electromechanical systems |
| Working Groups | |
| WG 1 | Terminology |
| WG 2 | Climatic and mechanical tests |
| WG 3 | Electronic Components - Long duration storage of electronic components guide for implementation |
| WG 5 | Wafer Level Reliability for semiconductor devices |
| WG 6 | Incubating Working Group |
TC 47 Membership
 Country | Country Code  | P/O Status | IEC Membership |
|---|---|---|---|
AT | P-Member | Full Member | |
BY | O-Member | Full Member | |
BE | P-Member | Full Member | |
BR | P-Member | Full Member | |
BG | O-Member | Full Member | |
CN | P-Member | Full Member | |
CZ | O-Member | Full Member | |
DK | O-Member | Full Member | |
FI | P-Member | Full Member | |
FR | P-Member | Full Member | |
DE | P-Member | Full Member | |
HU | O-Member | Full Member | |
IN | P-Member | Full Member | |
IE | O-Member | Full Member | |
IT | P-Member | Full Member | |
JP | P-Member | Full Member | |
KR | P-Member | Full Member | |
NL | P-Member | Full Member | |
NO | O-Member | Full Member | |
PK | P-Member | Full Member | |
PL | O-Member | Full Member | |
RO | O-Member | Full Member | |
RU | P-Member | Full Member | |
RS | O-Member | Full Member | |
ES | O-Member | Full Member | |
SE | O-Member | Full Member | |
TH | O-Member | Full Member | |
TR | O-Member | Full Member | |
UA | O-Member | Full Member | |
GB | P-Member | Full Member | |
US | P-Member | Full Member |
Facts and figures
Secretariat | Korea, Republic of |
|---|---|
Participating countries | 16 |
Observer Countries | 15 |
TC 47 Officers
Chairman | Mr Nicholas E.F. Lycoudes (US) Term of office : 2015-08 | |
|---|---|---|
Secretary | Mr Cheolung Cha (KR) | |
Assistant Secretary | Mr Namsu Kim (KR) | |
Technical Officer | Ms Suzanne Yap Geok Sim |
Log in for contact details
Full contact details are available to authorized users after log in.
TC 47 Liaisons
Committee |
Description |
|---|---|
| Internal IEC Liaison | |
| TC 56 | Dependability |
| TC 91 | Electronics assembly technology |
| TC 101 | Electrostatics |
| TC 107 | Process management for avionics |
| TC 110 | Electronic display devices |
| TC 111 | Environmental standardization for electrical and electronic products and systems |
| TC 113 | Nanotechnology standardization for electrical and electronic products and systems |
TC 47 Working Groups Liaisons
Working Groups | Description | Organization |
|---|---|---|
| Liaison D | ||
| WG 1 | Terminology | EIA |
| WG 2 | Climatic and mechanical tests | EIA |
| WG 3 | Electronic Components - Long duration storage of electronic components guide for implementation | EIA |
| WG 5 | Wafer Level Reliability for semiconductor devices | EIA |