International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Boîtiers des dispositifs semi-conducteurs

 
export to xls file

Autres Documents accessible to SC 47D depuis 2016-09-25

Référence, Titre
Downloads

Date de

Circulation

Date de

Fermeture

CENELEC

Votes /

Commentaires

1/2337A/DC

[Maintenance of IEC 60050-195 International Electrotechnical Vocabulary – Part 195 Earthing and protection against electric shock]

Titre français non disponible

2017-08-11 2017-11-24 N/A
18/1589/RR

Installations électriques à bord des navires - Partie 304: Matériel - Convertisseurs à semiconducteurs

2017-07-28 E
18/1591/CD

IEC 60092-304 ED4: Installations électriques à bord des navires - Partie 304: Matériel - Convertisseurs à semiconducteurs

2017-08-04 2017-10-27 E
47A/997/CD

[IEC 63011-2 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via]

Titre français non disponible

2016-10-28 2017-01-20 Y Report of Comments
47A/1012/CC

[Compilation of Comments on 47A/996/CD - IEC 63011-1 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions]

Titre français non disponible

2017-04-14 Y
47A/1016A/CC

[Revised compilation of comments on 47A/997/CD - IEC 63011-3 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via]

Titre français non disponible

2017-07-07 Y
47A/1021/CD

[IEC 63011-2 ED1: Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect]

Titre français non disponible

2017-06-09 2017-09-01 Y Report of Comments
47A/1025/CDV

IEC 63011-3 ED1: Circuits intégrés – Circuits intégrés tridimensionnels – Partie 3: Modèle et conditions de mesure des trous de liaison à travers le silicium (TSV)

2017-08-25 2017-11-17 Y
86C/1405/CC

[Compilation of comments on 86C/1392/CD: IEC 62148-1 Ed. 2: Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance]

Titre français non disponible

2016-10-14 Y
86C/1406A/CDV

[IEC 62148-1/Ed2: Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance ]

Titre français non disponible

2016-12-23 2017-03-10 Y Voting Result
86C/1416/RVN

[Result of voting on 86C/1383/NP: Future IEC 62148-19/Ed1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package]

Titre français non disponible

2016-11-11 Y
86C/1423/CC

[Compilation of comments on 86C/1423/CC: IEC 63072-1/TR/Ed1: Photonic integrated circuits - Part 1: Introduction and roadmap for standardization]

Titre français non disponible

2016-11-11 U
86C/1428/DTR

IEC TR 63072-1 ED1:

2016-11-25 2017-01-20 U Voting Result
86C/1433/CD

[IEC 62148-19 ED1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package]

Titre français non disponible

2016-12-09 2017-03-03 Y Report of Comments
86C/1434/NP

[PNW 86C-1434 ED1: Future 62149-11: FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES – PERFORMANCE STANDARDS – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface ]

Titre français non disponible

2016-12-09 2017-03-03 Y Voting Result
86C/1437/NP

[PNW 86C-1437 ED1: Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FBGA)]

Titre français non disponible

2016-12-16 2017-03-10 Y Voting Result
86C/1441/RVDTR

[Result of Voting on 86C/1428/DTR - IEC TR 63072-1 ED1: Photonic integrated circuits Part 1: Introduction and roadmap for standardization]

Titre français non disponible

2017-02-17 U
86C/1447/RVN

[Result of Voting on 86C/1434/NP - PNW 86C-1434 ED1: Future 62149-11: FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES – PERFORMANCE STANDARDS – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface ]

Titre français non disponible

2017-04-07 Y
86C/1448/RVN

[Result of Voting on 86C/1437/NP - PNW 86C-1437 ED1: Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FBGA)]

Titre français non disponible

2017-04-07 Y
86C/1453/CC

[Compilation of Comments on 86C/1433/CD - IEC 62148-19 ED1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package]

Titre français non disponible

2017-04-28 Y
86C/1466/RVC

[Result of Voting on 86C/1406A/CDV - IEC 62148-1/Ed2: Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance ]

Titre français non disponible

2017-06-02 Y
86C/1469/CD

[IEC 62148-21 ED1: Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FLGA)]

Titre français non disponible

2017-06-30 2017-09-22 Y Report of Comments
86C/1471/CD

[IEC 62149-11: Fibre optic active components and devices – Performance standards – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface ]

Titre français non disponible

2017-06-30 2017-09-22 Y Report of Comments
86C/1474/CD

[IEC 62148-19 ED1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package]

Titre français non disponible

2017-07-28 2017-09-22 Y Report of Comments
91/1401/CC

[Compilation of comments on 91/1389/CD: Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)]

Titre français non disponible

2016-10-28 Y
91/1402/CDV

[Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)]

Titre français non disponible

2016-12-30 2017-03-24 Y Voting Result
91/1420/RR

[Review report of IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions]

Titre français non disponible

2016-12-30 N
91/1421/CD

[IEC 60194-2 ED1: Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies]

Titre français non disponible

2017-01-06 2017-03-31 N Report of Comments
91/1439/CC

[Compilation of Comments on 91/1421/CD - IEC 60194-2 ED1: Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies]

Titre français non disponible

2017-04-07 N
91/1442/CDV

[IEC 60194-2 ED1: Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies]

Titre français non disponible

2017-06-02 2017-08-25 N Voting Result
91/1444/RVC

[Result of Voting on 91/1402/CDV - Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)]

Titre français non disponible

2017-04-21 Y
91/1445/FDIS

[IEC 60068-2-58/AMD1 ED4: Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)]

Titre français non disponible

2017-05-12 2017-06-23 Y Voting Result
91/1451/RVD

[Result of Voting on 91/1445/FDIS - IEC 60068-2-58/AMD1 ED4: Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)]

Titre français non disponible

2017-06-30 Y
91/1459/RR

[Review report of IEC 60194 Ed.1: Printed board design, manufacture and assembly - Terms and definitions]

Titre français non disponible

2017-08-11 N
91/1460/CD

[IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies]

Titre français non disponible

2017-08-18 2017-10-13 N
110/803/CDV

[IEC 62341-6-3 Ed.2: Organic light emitting diode (OLED) displays - Part 6-3: Measuring methods of image quality]

Titre français non disponible

2016-12-09 2017-03-03 E Voting Result
110/816/FDIS

[IEC 62341-6-1 Ed.2: Organic light emitting diode (OLED) displays - Part 6-1: Measuring methods of optical and electro-optical parameters]

Titre français non disponible

2016-11-18 2016-12-30 E Voting Result
124/8/DC

[Review of TC 124 Strategic Business Plan (SBP)]

Titre français non disponible

2017-07-07 2017-08-18 N/A Report of Comments
124/10/INF

[Report of Comments received on 124/8/DC: Review of TC 124 Strategic Business Plan (SBP)]

Titre français non disponible

2017-09-01 N/A