International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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Other Documents accessible to SC 47D since 2016-04-27

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

47A/1012/CC

Compilation of Comments on 47A/996/CD - IEC 63011-1 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions

2017-04-14 Y
86C/1383/NP

Future IEC 62148-19/Ed1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

2016-06-10 2016-09-02 Y Voting Result
86C/1391/RR

Review report on IEC 62148-1/Ed1: Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance (revise)

2016-07-01 Y
86C/1392/CD

IEC 62148-1/Ed2: Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance

2016-07-01 2016-09-23 Y Report of Comments
86C/1401/CD

IEC 63072-1/TR/Ed1: Photonic integrated circuits - Part 1: Introduction and roadmap for standardization

2016-07-29 2016-09-23 U Report of Comments
86C/1405/CC

Compilation of comments on 86C/1392/CD: IEC 62148-1 Ed. 2: Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance

2016-10-14 Y
86C/1406A/CDV

IEC 62148-1/Ed2: Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance

2016-12-23 2017-03-10 Y Voting Result
86C/1416/RVN

Result of voting on 86C/1383/NP: Future IEC 62148-19/Ed1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

2016-11-11 Y
86C/1423/CC

Compilation of comments on 86C/1423/CC: IEC 63072-1/TR/Ed1: Photonic integrated circuits - Part 1: Introduction and roadmap for standardization

2016-11-11 U
86C/1428/DTR

IEC TR 63072-1 ED1: Photonic integrated circuits Part 1: Introduction and roadmap for standardization

2016-11-25 2017-01-20 U Voting Result
86C/1433/CD

IEC 62148-19 ED1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

2016-12-09 2017-03-03 Y Report of Comments
86C/1434/NP

PNW 86C-1434 ED1: Future 62149-11: FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES – PERFORMANCE STANDARDS – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

2016-12-09 2017-03-03 U Voting Result
86C/1437/NP

PNW 86C-1437 ED1: Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FBGA)

2016-12-16 2017-03-10 U Voting Result
86C/1441/RVDTR

Result of Voting on 86C/1428/DTR - IEC TR 63072-1 ED1: Photonic integrated circuits Part 1: Introduction and roadmap for standardization

2017-02-17 U
86C/1447/RVN

Result of Voting on 86C/1434/NP - PNW 86C-1434 ED1: Future 62149-11: FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES – PERFORMANCE STANDARDS – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

2017-04-07 U
86C/1448/RVN

Result of Voting on 86C/1437/NP - PNW 86C-1437 ED1: Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FBGA)

2017-04-07 U
91/1389/CD

Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2016-08-12 2016-10-07 Y Report of Comments
91/1402/CDV

Amendment 1 to IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

2016-12-30 2017-03-24 Y Voting Result
91/1420/RR

Review report of IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions

2016-12-30 N
91/1421/CD

IEC 60194-2 ED1: Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

2017-01-06 2017-03-31 N Report of Comments
91/1439/CC

Compilation of Comments on 91/1421/CD - IEC 60194-2 ED1: Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

2017-04-07 N
110/748/CDV

IEC 62908-13-10 Ed.1: Touch and interactive displays - Part 13-10: Reliability test methods of touch displays - Environmental durability test methods

2016-05-13 2016-08-05 N Voting Result
110/775/CDV

IEC 62908-1-2 Ed.1: Touch and interactive displays - Part 1-2: Generic - Terminology and letter symbols

2016-09-09 2016-12-02 E Voting Result
110/776/CDV

IEC 62908-12-10 Ed.1: Touch and interactive displays - Part 12-10: Measurement methods of touch displays - Touch and electrical performance

2016-09-09 2016-12-02 E Voting Result
110/803/CDV

IEC 62341-6-3 Ed.2: Organic light emitting diode (OLED) displays - Part 6-3: Measuring methods of image quality

2016-12-09 2017-03-03 E Voting Result
110/816/FDIS

IEC 62341-6-1 Ed.2: Organic light emitting diode (OLED) displays - Part 6-1: Measuring methods of optical and electro-optical parameters

2016-11-18 2016-12-30 E Voting Result
119/105/CDV

IEC 62899-502-1 Ed.1: Printed Electronics - Part 502-1 Quality assessment - OLED elements - Mechanical stress testing of OLED elements formed on flexible substrates

2016-05-20 2016-08-12 N Voting Result
121A/98/CDV

IEC 60715 Ed.2: Dimensions of low-voltage switchgear and controlgear - Standardized mounting on rails for mechanical support of switchgear, controlgear and accessories

2016-09-23 2016-12-16 Y Voting Result