International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 104

Environmental conditions, classification and methods of test

 
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47/2191/CD

IEC 62880-1 Ed.1: Semiconductor devices - Wafer Level Reliability for Semiconductor Devices - Part 1: Copper Stress Migration Test Method
2014-01-242014-04-25yesReport of Comments
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47/2193/CD

IEC 60749-44 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
2014-02-282014-05-30?Report of Comments
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91/1193/Q

This document has been replaced by 91/1193A/Q
2014-07-04
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91/1193A/Q

Questionnaire on the relevance of IEC 60068-2-77:1999 and any necessity to develop a new test method to determine dynamic mechanical shock impact
2014-07-112014-09-26
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