International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 
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Autres Documents accessible to TC 91 depuis 2015-12-04

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Date de

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47A/979/NP

[Future IEC 63011-3 Integrated circuits - Three dimensional integreated circuits - Part 3: A model and measurement conditions of Through Silicon Via]

Titre français non disponible

2015-12-18 2016-03-18 U Voting Result
47A/996/CD

[IEC 63011-1 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions]

Titre français non disponible

2016-10-28 2017-01-20 U
47A/997/CD

[IEC 63011-2 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via]

Titre français non disponible

2016-10-28 2017-01-20 U
47/2281/CDV

[IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level]

Titre français non disponible

2016-04-01 2016-06-24 Y Voting Result
47/2287/CDV

[IEC 60749-4 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)]

Titre français non disponible

2016-04-15 2016-07-08 Y Voting Result
47/2296/CDV

[IEC 62880-1 Ed.1: Semiconductor devices - Stress Migration Test Standard - Part 1 - Copper Stress Migration Test Standard]

Titre français non disponible

2016-06-10 2016-09-02 Y Voting Result
47/2316/CDV

IEC 60749-43 Ed.1: Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 43: Directives concernant les plans de qualification de la fiabilité des CI

2016-09-09 2016-12-02 Y Voting Result
47/2325/CD

[IEC 60749-41 Ed.1:Semiconductor devices - mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices]

Titre français non disponible

2016-10-28 2016-12-23 U
47/2334/CD

[IEC 63068-1 Ed.1: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxila wafer for power devices - Part 1: Classification of defects]

Titre français non disponible

2016-11-11 2017-02-03 U
86/493/CC

[Compilation of comments on 86/475/CD: IEC 62496-2/Ed1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards]

Titre français non disponible

2016-05-06 Y
86/494/CD

[IEC 62496-2/Ed1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards ]

Titre français non disponible

2016-05-06 2016-07-29 Y Report of Comments
86/499A/CC

[Revised compilation of comments on 86/494/CD: IEC 62496-2/Ed1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards ]

Titre français non disponible

2016-10-21 Y
109/146A/CC

[Revised compilation of comments on 109/134/CD: IEC/TS 62993 Ed.1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.]

Titre français non disponible

2016-07-15 N
109/151B/CD

[IEC/TS 62993 Ed.1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.]

Titre français non disponible

2016-08-12 2016-09-16 N
109/157A/CC

[Compilation of Comments on 109/151/CD - This document has been replaced by 109/151A/CD]

Titre français non disponible

2016-12-02 N
119/92/NP

[Future IEC 62899-403-1: Printed Electronics - Part 403-1: Printability - Requirments for reproducibility - Basic patterns for evaluation of printing machine]

Titre français non disponible

2016-01-29 2016-04-22 U Voting Result
119/104/DTR

[IEC/TR 62899-250 Ed.1: Material technologies required in Printed Electronics for Wearable Smart Devices]

Titre français non disponible

2016-02-26 2016-04-29 N Voting Result
119/106/NP

[Future IEC 62899-402-2: Printed Electronics - Part 402-2: Printability - Measurement of qualitities - Edge waviness]

Titre français non disponible

2016-04-01 2016-06-24 U Voting Result
121A/66/CD

[IEC 60715 Ed.2: Dimensions of low-voltage switchgear and controlgear. Standardized mounting on rails for mechanical support of electrical devices in switchgear and controlgear installations]

Titre français non disponible

2015-12-18 2016-04-22 Y Report of Comments
121A/98/CDV

IEC 60715 Éd.2: Dimensions de l'appareillage à basse tension - Montage normalisé sur profilés-supports pour le support mécanique des appareillages et de leurs accessoires

2016-09-23 2016-12-16 Y