International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 
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Autres Documents accessible to TC 91 depuis 2016-06-28

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Date de

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Commentaires

47A/996/CD

[IEC 63011-1 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions]

Titre français non disponible

2016-10-28 2017-01-20 Y Report of Comments
47A/997/CD

[IEC 63011-2 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via]

Titre français non disponible

2016-10-28 2017-01-20 Y Report of Comments
47A/1012/CC

[Compilation of Comments on 47A/996/CD - IEC 63011-1 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions]

Titre français non disponible

2017-04-14 Y
47A/1021/CD

[IEC 63011-2 ED1: Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect]

Titre français non disponible

2017-06-09 2017-09-01 Y
47/2314A/RVN

[Result of voting on 47/2293/NP: Future IEC XXXXX-1 Ed.1: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects]

Titre français non disponible

2016-09-23 Y
47/2315/RVC

[Result of voting on 47/2231/CDV: IEC 60749-43 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans ]

Titre français non disponible

2016-07-08 Y
47/2316/CDV

IEC 60749-43 Ed.1: Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 43: Directives concernant les plans de qualification de la fiabilité des CI

2016-09-09 2016-12-02 Y Voting Result
47/2325/CD

[IEC 60749-41 Ed.1:Semiconductor devices - mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices]

Titre français non disponible

2016-10-28 2016-12-23 Y Report of Comments
47/2331/RVC

[Result of voting on 47/2287/CDV: IEC 60749-4 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)]

Titre français non disponible

2016-11-04 Y
47/2334/CD

[IEC 63068-1 Ed.1: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxila wafer for power devices - Part 1: Classification of defects]

Titre français non disponible

2016-11-11 2017-02-03 Y Report of Comments
47/2340/RVC

[Result of Voting on 47/2281/CDV - IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level]

Titre français non disponible

2016-12-02 Y
47/2346/FDIS

[IEC 60749-4 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp Heat, steady state, highly accelerated stress test (HAST)]

Titre français non disponible

2016-12-23 2017-02-03 Y Voting Result
47/2362/FDIS

[IEC 60749-28 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level]

Titre français non disponible

2017-01-13 2017-02-24 Y Voting Result
47/2364/RVC

[Result of Voting on 47/2316/CDV - IEC 60749-43 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans ]

Titre français non disponible

2017-01-20 Y
47/2371/RVD

[Result of Voting on 47/2346/FDIS - IEC 60749-4 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp Heat, steady state, highly accelerated stress test (HAST)]

Titre français non disponible

2017-02-10 Y
47/2378/CC

[Compilation of Comments on 47/2334/CD - IEC 63068-1 Ed.1: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxila wafer for power devices - Part 1: Classification of defects]

Titre français non disponible

2017-03-03 Y
47/2379/RVD

[Result of Voting on 47/2362/FDIS - IEC 60749-28 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level]

Titre français non disponible

2017-03-10 Y
47/2389/FDIS

IEC 60749-43 ED1: Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 43: Lignes directrices concernant les plans de qualification de la fiabilité des CI

2017-04-14 2017-05-26 Y Voting Result
47/2402/CD

[IEC 63068-1 ED1: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects]

Titre français non disponible

2017-04-28 2017-07-21 Y
47/2403/RVC

[Result of Voting on 47/2296/CDV - IEC 62880-1 Ed.1: Semiconductor devices - Stress Migration Test Standard - Part 1 - Copper Stress Migration Test Standard]

Titre français non disponible

2017-04-28 Y
47/2406/RVD

[Result of Voting on 47/2389/FDIS - IEC 60749-43 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans]

Titre français non disponible

2017-06-02 Y
47/2407/FDIS

[IEC 62880-1 ED1: Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard]

Titre français non disponible

2017-06-16 2017-07-28 Y
86/499A/CC

[Revised compilation of comments on 86/494/CD: IEC 62496-2/Ed1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards ]

Titre français non disponible

2016-10-21 Y
86/509/CDV

[IEC 62496-2 ED1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards ]

Titre français non disponible

2017-01-20 2017-04-14 Y Voting Result
86/512/CD

[IEC 62496-4-1 ED1: Optical circuit boards - Interface standards - Part 4-1: Terminated waveguide OCB assembly using PMT connectors]

Titre français non disponible

2017-01-20 2017-04-14 Y Report of Comments
86/515/RVC

[Result of Voting on 86/509/CDV - IEC 62496-2 ED1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards ]

Titre français non disponible

2017-04-21 Y
109/146A/CC

[Revised compilation of comments on 109/134/CD: IEC/TS 62993 Ed.1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.]

Titre français non disponible

2016-07-15 N
109/151B/CD

[IEC/TS 62993 Ed.1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.]

Titre français non disponible

2016-08-12 2016-09-16 N
109/157A/CC

[Compilation of comments on 109/151B/CD: IEC/TS 62993 Ed.1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.]

Titre français non disponible

2016-12-02 N
109/158A/DTS

[IEC TS 62993 ED1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.]

Titre français non disponible

2017-02-24 2017-04-14 N Voting Result
109/159/RR

[Review report of IEC 60664-1 Ed.2: Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests ]

Titre français non disponible

2016-12-23 Y
109/160/CD

[IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests (Proposed horizontal standard)]

Titre français non disponible

2016-12-23 2017-03-17 Y Report of Comments
109/162/RVDTS

[Result of Voting on 109/158A/DTS - IEC TS 62993 ED1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.]

Titre français non disponible

2017-06-09 N
119/112/RVN

[Result of voting on 119/92/NP: Future IEC 62899-403-1: Printed Electronics - Part 403-1: Printability - Requirments for reproducibility - Basic patterns for evaluation of printing machine]

Titre français non disponible

2016-07-01 N
119/153/CD

[IEC 62899-403-1 ED1: Printed Electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine]

Titre français non disponible

2017-02-24 2017-04-21 N Report of Comments
119/165/CC

[Compilation of Comments on 119/153/CD - IEC 62899-403-1 ED1: Printed Electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine]

Titre français non disponible

2017-05-05 N
119/175/NP

[PNW 119-175: Printed electronics – Part 202-7 : Materials - Conductive ink – Measurement of peel strength for printed conductive layer on flexible substrate]

Titre français non disponible

2017-06-09 2017-09-01 E
121A/98/CDV

IEC 60715 Éd.2: Dimensions de l'appareillage à basse tension - Montage normalisé sur profilés-supports pour le support mécanique des appareillages et de leurs accessoires

2016-09-23 2016-12-16 Y Voting Result
121A/144A/RVC

[Revised Result of Voting on 121A/98/CDV - IEC 60715 Ed.2: Dimensions of low-voltage switchgear and controlgear - Standardized mounting on rails for mechanical support of switchgear, controlgear and accessories]

Titre français non disponible

2017-03-24 Y
121A/153/FDIS

IEC 60715 ED2: Dimensions de l'appareillage à basse tension - Montage normalisé sur profilés-supports pour le support mécanique des appareillages et de leurs accessoires

2017-05-26 2017-07-07 Y