International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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Other Documents accessible to TC 91 since 2016-03-27

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CENELEC

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Comment

47A/996/CD

IEC 63011-1 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions

2016-10-28 2017-01-20 Y Report of Comments
47A/997/CD

IEC 63011-2 Ed.1: Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via

2016-10-28 2017-01-20 Y Report of Comments
47/2281/CDV

IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

2016-04-01 2016-06-24 Y Voting Result
47/2287/CDV

IEC 60749-4 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

2016-04-15 2016-07-08 Y Voting Result
47/2296/CDV

IEC 62880-1 Ed.1: Semiconductor devices - Stress Migration Test Standard - Part 1 - Copper Stress Migration Test Standard

2016-06-10 2016-09-02 Y Voting Result
47/2316/CDV

IEC 60749-43 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

2016-09-09 2016-12-02 Y Voting Result
47/2325/CD

IEC 60749-41 Ed.1:Semiconductor devices - mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices

2016-10-28 2016-12-23 Y Report of Comments
47/2331/RVC

Result of voting on 47/2287/CDV: IEC 60749-4 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

2016-11-04 Y
47/2334/CD

IEC 63068-1 Ed.1: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxila wafer for power devices - Part 1: Classification of defects

2016-11-11 2017-02-03 Y Report of Comments
47/2340/RVC

Result of Voting on 47/2281/CDV - IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

2016-12-02 Y
47/2346/FDIS

IEC 60749-4 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp Heat, steady state, highly accelerated stress test (HAST)

2016-12-23 2017-02-03 Y Voting Result
47/2362/FDIS

IEC 60749-28 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

2017-01-13 2017-02-24 Y Voting Result
47/2371/RVD

Result of Voting on 47/2346/FDIS - IEC 60749-4 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp Heat, steady state, highly accelerated stress test (HAST)

2017-02-10 Y
47/2379/RVD

Result of Voting on 47/2362/FDIS - IEC 60749-28 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

2017-03-10 Y
86/493/CC

Compilation of comments on 86/475/CD: IEC 62496-2/Ed1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards

2016-05-06 Y
86/494/CD

IEC 62496-2/Ed1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards

2016-05-06 2016-07-29 Y Report of Comments
86/499A/CC

Revised compilation of comments on 86/494/CD: IEC 62496-2/Ed1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards

2016-10-21 Y
86/509/CDV

IEC 62496-2 ED1: Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards

2017-01-20 2017-04-14 Y
86/512/CD

IEC 62496-4-1 ED1: Optical circuit boards - Interface standards - Part 4-1: Terminated waveguide OCB assembly using PMT connectors

2017-01-20 2017-04-14 Y
109/146A/CC

Revised compilation of comments on 109/134/CD: IEC/TS 62993 Ed.1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.

2016-07-15 N
109/151B/CD

IEC/TS 62993 Ed.1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.

2016-08-12 2016-09-16 N
109/157A/CC

Compilation of comments on 109/151B/CD: IEC/TS 62993 Ed.1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.

2016-12-02 N
109/158A/DTS

IEC TS 62993 ED1: Guidance for determination of clearances; creepage distances and requirements for solid insulation for equipment with a rated voltage above 1 000 V a.c. and 1 500 V d.c. up to 2 000 V a.c. and 3 000 V d.c.

2017-02-24 2017-04-14 N
109/159/RR

Review report of IEC 60664-1 Ed.2: Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests

2016-12-23 Y
109/160/CD

IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests (Proposed horizontal standard)

2016-12-23 2017-03-17 Y Report of Comments
119/106/NP

Future IEC 62899-402-2: Printed Electronics - Part 402-2: Printability - Measurement of qualitities - Edge waviness

2016-04-01 2016-06-24 U Voting Result
119/112/RVN

Result of voting on 119/92/NP: Future IEC 62899-403-1: Printed Electronics - Part 403-1: Printability - Requirments for reproducibility - Basic patterns for evaluation of printing machine

2016-07-01 E
119/153/CD

IEC 62899-403-1 ED1: Printed Electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine

2017-02-24 2017-04-21 E
121A/98/CDV

IEC 60715 Ed.2: Dimensions of low-voltage switchgear and controlgear - Standardized mounting on rails for mechanical support of switchgear, controlgear and accessories

2016-09-23 2016-12-16 Y Voting Result