International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (5)

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IEC 62047-1 Ed. 2.0  

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
47F/195/CDV2013-10ADIS
  • ADIS
  • Approved for FDIS circulation

2015-03

DEC
  • DEC
  • Draft at Editing Check

2015-05

01N. Moronuki2015-10
IEC 62047-25 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
47F/194/CD2013-03ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-03

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-06

01Z. Dacheng2016-07
IEC 62047-26 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
47F/200/CDV2013-07CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-10

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-04

01Y. Isono2015-12
IEC 62047-27 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
47F/216/CD2014-021CD
  • 1CD
  • 1st Committee Draft

2015-02

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-06

02L. Stühler2016-12
IEC 62047-28 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
47F/220/CD2014-081CD
  • 1CD
  • 1st Committee Draft

2015-04

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-07

03Y. Suzuki2016-10