International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47F |
Micro-electromechanical systems |

Project Reference | Stage | Document Reference | Init. Date | Current Stage | Next Stage | Mod | Fcst. Publ. Date |
|---|---|---|---|---|---|---|---|
IEC 62047-11 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials | RDIS
| 47F/143A/RVC | 2009-10 | 2013-02 | 2013-05 | no | 2013-09 |
IEC 62047-15 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
| 2CD
| 47F/149/CD | 2012-01 | 2013-02 | 2013-06 | no | 2014-08 |
IEC 62047-16 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods | 2CD
| 47F/151/CD | 2012-01 | 2013-03 | 2013-06 | no | 2014-08 |
IEC 62047-17 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films | 3CD
| 47F/146/CD | 2010-07 | 2013-01 | 2013-05 | no | 2013-06 |
IEC 62047-18 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials | RDIS
| 47F/142/RVC | 2010-06 | 2013-02 | 2013-05 | no | 2013-09 |
IEC 62047-19 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses | RDIS
| 47F/144/RVC | 2011-07 | 2013-03 | 2013-05 | no | 2013-09 |
IEC 62047-20 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes | ACDV
| 47F/138A/CC | 2011-11 | 2012-12 | 2013-03 | no | 2014-07 |
IEC 62047-21 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials | CCDV
| 47F/147A/CDV | 2011-12 | 2013-04 | 2013-10 | no | 2014-05 |
IEC 62047-22 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates | CCDV
| 47F/148/CDV | 2011-12 | 2013-03 | 2013-09 | no | 2014-05 |
IEC 62047-25 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area | ANW
| 47F/152/RVN | 2013-03 | 2013-03 | 2013-11 | no | 2015-12 |
PNW 47F-139 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 23: General rules for the assessment of micro-geometrical parameters | PNW
| 47F/139/NP | 2012-11 | 2013-03 | no | ||
PNW 47F-140 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 24: Silicon-based MEMS fabrication technology - Basic regulation for layout design | PNW
| 47F/140/NP | 2012-11 | 2013-03 | no | ||
PNW 47F-153 Ed. 1.0 Future IEC 62047-26: Semiconductor devices Micro-electromechanical devices Part 26: Description and measurement methods for micro trench and needle structures | PNW
| 47F/153/NP | 2013-04 | 2013-08 | no |



