International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47F |
Micro-electromechanical systems |
SC 47F Work programme
 Project Reference |  Stage | Document Reference | Init. Date | Current Stage | Next Stage | Mod | Fcst. Publ. Date |
|---|---|---|---|---|---|---|---|
IEC 62047-11 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials | ADIS
| 47F/143/RVC | 2009-10 | 2012-11 | 2013-01 | no | 2013-06 |
IEC 62047-15 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
| CDM
| 47F/135/CC | 2012-01 | 2012-10 | 2012-11 | no | 2014-08 |
IEC 62047-16 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods | A2CD
| 47F/134A/CC | 2012-01 | 2012-12 | 2013-02 | no | 2014-08 |
IEC 62047-17 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films | 3CD
| 47F/146/CD | 2010-07 | 2013-01 | 2013-05 | no | 2013-06 |
IEC 62047-18 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials | ADIS
| 47F/142/RVC | 2010-06 | 2012-11 | 2013-01 | no | 2013-06 |
IEC 62047-19 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses | ADIS
| 47F/144/RVC | 2011-07 | 2012-12 | 2013-02 | no | 2013-07 |
IEC 62047-20 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes | ACDV
| 47F/138A/CC | 2011-11 | 2012-12 | 2013-03 | no | 2014-07 |
IEC 62047-21 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials | ACDV
| 47F/136A/CC | 2011-12 | 2012-12 | 2013-02 | no | 2014-06 |
IEC 62047-22 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates | ACDV
| 47F/137A/CC | 2011-12 | 2012-12 | 2013-02 | no | 2014-06 |
PNW 47F-139 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 23: General rules for the assessment of micro-geometrical parameters | PNW
| 47F/139/NP | 2012-11 | 2013-03 | no | ||
PNW 47F-140 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 24: Silicon-based MEMS fabrication technology - Basic regulation for layout design | PNW
| 47F/140/NP | 2012-11 | 2013-03 | no | ||
PNW 47F-141 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area | PNW
| 47F/141/NP | 2012-11 | 2013-03 | no |
101 kB
130 kB