International

Electrotechnical

Commission

International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

SC 47F Work programme

Project Reference	Stage	Document Reference	Init. Date	Current Stage	Next Stage	Mod	Fcst. Publ. Date
IEC 62047-11 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials	RDIS RDIS Text for FDIS received and registered	47F/143A/RVC 131 kB	2009-10	2013-02	2013-05	no	2013-09
IEC 62047-15 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass	2CD 2CD 2nd Committee Draft	47F/149/CD 328 kB	2012-01	2013-02	2013-06	no	2014-08
IEC 62047-16 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods	2CD 2CD 2nd Committee Draft	47F/151/CD 474 kB	2012-01	2013-03	2013-06	no	2014-08
IEC 62047-17 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films	3CD 3CD 3rd Committee Draft	47F/146/CD 563 kB	2010-07	2013-01	2013-05	no	2013-06
IEC 62047-18 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials	RDIS RDIS Text for FDIS received and registered	47F/142/RVC 101 kB 122 kB	2010-06	2013-02	2013-05	no	2013-09
IEC 62047-19 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses	RDIS RDIS Text for FDIS received and registered	47F/144/RVC 120 kB 130 kB	2011-07	2013-03	2013-05	no	2013-09
IEC 62047-20 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes	ACDV ACDV Draft approved for Committee Draft with Vote	47F/138A/CC 98 kB 125 kB	2011-11	2012-12	2013-03	no	2014-07
IEC 62047-21 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials	CCDV CCDV Draft circulated as Committee Draft with Vote	47F/147A/CDV 1504 kB 300 kB	2011-12	2013-04	2013-10	no	2014-05
IEC 62047-22 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates	CCDV CCDV Draft circulated as Committee Draft with Vote	47F/148/CDV 610 kB 268 kB	2011-12	2013-03	2013-09	no	2014-05
IEC 62047-25 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area	ANW ANW Approved New Work	47F/152/RVN	2013-03	2013-03	2013-11	no	2015-12
PNW 47F-139 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 23: General rules for the assessment of micro-geometrical parameters	PNW PNW Proposed New Work	47F/139/NP 257 kB		2012-11	2013-03	no
PNW 47F-140 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 24: Silicon-based MEMS fabrication technology - Basic regulation for layout design	PNW PNW Proposed New Work	47F/140/NP 324 kB		2012-11	2013-03	no
PNW 47F-153 Ed. 1.0 Future IEC 62047-26: Semiconductor devices Micro-electromechanical devices Part 26: Description and measurement methods for micro trench and needle structures	PNW PNW Proposed New Work	47F/153/NP		2013-04	2013-08	no