International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47E

Discrete semiconductor devices

 
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SC 47E Work programme (12)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47E-569

Semiconductor devices – Part 5-61: Optoelectronic devices – Light emitting diodes – Test method of optoelectronic efficiencies of light emitting diodes

47E/569/NP PRVN
  • PRVN
  • Preparation of RVN

2017-08

2017-09

Jong-In Shim 2020-08
PNW 47E-570

Semiconductor devices – Part 5-62: Optoelectronic devices – Light emitting diodes – Test method of the internal quantum efficiency based on the temperature-dependent electroluminescence

47E/570/NP PRVN
  • PRVN
  • Preparation of RVN

2017-08

2017-09

Dong-Soo Shin 2020-08
PNW 47E-571

Semiconductor devices – Part 5-63: Optoelectronic devices – Light emitting diodes – Test method of the internal quantum efficiency based on the room-temperature reference point

47E/571/NP PRVN
  • PRVN
  • Preparation of RVN

2017-08

2017-09

Jong-In Shim 2020-08
IEC 60747-5-5 ED2

Semiconductor devices - Part 5-5: Discrete devices - Optoelectronic devices - Photocouplers

47E/559/CD 2015-08 PCC
  • PCC
  • Preparation of CC

2017-01

2017-02

WG 4 P. Sullivan 2017-12
IEC 60747-9 ED3

Semiconductor devices - Part 9: Discrete devices - Insulated-gate bipolar transistors (IGBTs)

47E/572/CD 2016-05 PCC
  • PCC
  • Preparation of CC

2017-08

2017-09

WG 3 S. Miyashita 2018-12
IEC 60747-14-10 ED1

Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors

47E/565/CD 2016-09 PCC
  • PCC
  • Preparation of CC

2017-05

2017-06

WG 1 J. Y. Park 2018-12
IEC 60747-14-11 ED1

Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature

47E/550/NP 2017-06 ACD
  • ACD
  • Approved for CD

2017-06

CD
  • CD
  • Draft circulated as CD

2017-11

PT 60747-14-11 Kunnyun Kim 2020-02
IEC 60747-16-6 ED1

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers

47E/568/CD 2016-03 ACDV
  • ACDV
  • Approved for CDV

2017-07

TCDV
  • TCDV
  • Translation of CDV

2017-10

WG 2 K. Oshiba 2018-06
IEC 60747-17 ED1

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation

47E/578A/CD 2015-01 CD
  • CD
  • Draft circulated as CD

2017-08

PCC
  • PCC
  • Preparation of CC document

2017-09

WG 8 A. Jaus 2017-06
IEC 60747-18-1 ED1

Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensor

47E/554/CD 2016-03 PCC
  • PCC
  • Preparation of CC

2016-10

2017-05

WG 1 J. M. Lee, S. G. Lee 2018-12
IEC 60747-18-2 ED1

Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package module

47E/555/NP 2016-12 ACD
  • ACD
  • Approved for CD

2016-12

CD
  • CD
  • Draft circulated as CD

2017-08

WG 1 JongMuk LEE 2019-12
IEC 60747-18-3 ED1

Semiconductor devices - Part 18-3: Semiconductor bio sensors - Fluid flow characteristics of lens-free CMOS photonic array sensor package module with fluidic system

47E/560/NP 2017-03 ACD
  • ACD
  • Approved for CD

2017-03

CD
  • CD
  • Draft circulated as CD

2017-08

WG 1 JongMuk LEE 2019-12