International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47A

Integrated circuits

 
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SC 47A Work programme (8)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

IEC 62132-4 ED2

Integrated circuits - Measurement of electoromagnatic immuity - Part 4: Direct RF power injection method

47A/981/RR 2015-12 ACD
  • ACD
  • Approved for CD

2015-12

CD
  • CD
  • Draft circulated as CD

2016-12

WG 9 F. Klotz 2018-12
IEC 62228-1 ED1

Integrated Circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions

47A/995/CD 2015-10 CD
  • CD
  • Draft circulated as CD

2016-10

PCC
  • PCC
  • Preparation of CC document

2016-12

WG 9 F. Klotz 2018-10
IEC 62228-3 ED1

Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers

47A/980/RR 2015-12 ACD
  • ACD
  • Approved for CD

2015-12

CD
  • CD
  • Draft circulated as CD

2016-12

WG 9 F. Klotz 2018-12
IEC 62433-2 ED2

EMC IC Modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

47A/999/FDIS 2015-01 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2016-12

PRVD
  • PRVD
  • Preparation of RVD document

2017-01

WG 2 2017-03
IEC 62433-3 ED1

EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

47A/1000/FDIS 2014-06 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2016-12

PRVD
  • PRVD
  • Preparation of RVD document

2017-01

WG 2 2017-03
IEC 63011-1 ED1

Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions

47A/996/CD 2016-02 CD
  • CD
  • Draft circulated as CD

2016-10

PCC
  • PCC
  • Preparation of CC document

2017-01

WG 7 K. W. Kwon 2019-02
IEC 63011-2 ED1

Semiconductor devices - Advanced hybrid integrated circuits - Alignment of stacked dies having fine pitch interconnect

47A/961/NP 2015-06 ACD
  • ACD
  • Approved for CD

2015-06

CD
  • CD
  • Draft circulated as CD

2017-02

WG 7 K. W. Kwon 2018-06
IEC 63011-3 ED1

Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of Through Silicon Via

47A/997/CD 2016-05 CD
  • CD
  • Draft circulated as CD

2016-10

PCC
  • PCC
  • Preparation of CC document

2017-01

WG 7 M. Takahashi 2019-02