International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47A

Integrated circuits

 
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SC 47A Work programme (9)

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IEC 62132-4 Ed. 2.0  

Integrated circuits - Measurement of electoromagnatic immuity - Part 4: Direct RF power injection method
47A/981/RR2015-12AMW
  • AMW
  • Approved Maintenance Work

2015-12

1CD
  • 1CD
  • 1st Committee Draft

2016-12

WG 9F. Klotz2018-12
IEC 62228-1 Ed. 1.0  

Integrated Circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions
47A/970/NP2015-10ANW
  • ANW
  • Approved New Work

2015-10

1CD
  • 1CD
  • 1st Committee Draft

2016-04

WG 9F. Klotz2018-10
IEC 62228-2 Ed. 1.0  

Integrated circuits - EMC Evaluation of transceivers - Part 2: LIN transceivers
47A/969/CDV2014-06RDIS
  • RDIS
  • Text for FDIS received and registered

2016-08

CDIS
  • CDIS
  • Draft circulated as FDIS

2016-10

WG 9F. Klotz2017-02
IEC 62228-3 Ed. 1.0  

Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers
47A/980/RR2015-12AMW
  • AMW
  • Approved Maintenance Work

2015-12

1CD
  • 1CD
  • 1st Committee Draft

2016-12

WG 9F. Klotz2018-12
IEC 62433-2 Ed. 2.0  

EMC IC Modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
47A/967/CDV2015-01ADIS
  • ADIS
  • Approved for FDIS circulation

2016-02

DEC
  • DEC
  • Draft at Editing Check

2016-07

WG 2A. Ramanujan2016-12
IEC 62433-3 Ed. 1.0  

EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
47A/968/CDV2014-06ADIS
  • ADIS
  • Approved for FDIS circulation

2016-02

DEC
  • DEC
  • Draft at Editing Check

2016-07

WG 2A.Ramanujan2016-12
IEC 63011-1 Ed. 1.0  

Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions
47A/978/NP2016-02ANW
  • ANW
  • Approved New Work

2016-02

1CD
  • 1CD
  • 1st Committee Draft

2016-06

WG 7K. W. Kwon2019-02
IEC 63011-2 Ed. 1.0  

Semiconductor devices - Advanced hybrid integrated circuits - Alignment of stacked dies having fine pitch interconnect
47A/961/NP2015-06ANW
  • ANW
  • Approved New Work

2015-06

1CD
  • 1CD
  • 1st Committee Draft

2016-01

WG 7K. W. Kwon2018-06
IEC 63011-3 Ed. 1.0  

Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of Through Silicon Via
47A/979/NP2016-05ANW
  • ANW
  • Approved New Work

2016-05

1CD
  • 1CD
  • 1st Committee Draft

2016-06

WG 7M. Takahashi2019-02