International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 107 |
Process management for avionics |

Project Reference | Stage | Document Reference | Init. Date | Current Stage | Next Stage | Mod | Fcst. Publ. Date |
|---|---|---|---|---|---|---|---|
IEC 62396-3 Ed. 1.0 Process management for avionics - Atmospheric radiation effects - Part 3: Optimising system design to accommodate the single event effects (SEE) of atmospheric radiation
| CCDV
| 107/197/CDV | 2011-04 | 2012-11 | 2013-05 | no | 2014-01 |
IEC 62396-4 Ed. 1.0 Process management for avionics - Atmospheric radiation effects - Part 4: Guidelines for designing with high voltage aircraft electronics and potential single event effects
| CCDV
| 107/198/CDV | 2012-01 | 2012-11 | 2013-05 | no | 2014-01 |
IEC 62396-5 Ed. 1.0 Process management for avionics - Atmospheric radiation effects - Part 5: Guidelines for assessing thermal neutron fluxes and effects in avionics systems
| AMW
| 107/172/RR | 2012-01 | 2012-01 | 2013-03 | yes | 2013-12 |
IEC 62668-1 Ed. 2.0 Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
| AMW
| 107/200/RR | 2012-11 | 2012-11 | 2013-09 | no | 2014-04 |
IEC/TR 62240-1 Ed. 1.0 Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
| CDTR
| 107/199/DTR | 2012-11 | 2013-04 | no | 2013-09 | |
IEC/TS 62239-1 Ed. 2.0 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
| AMW
| 107/195/RR | 2012-09 | 2012-09 | 2013-10 | no | 2014-12 |
IEC/TS 62239-2 Ed. 1.0 Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic assemblies management plan
| ANW
| 107/194/RVN | 2012-09 | 2012-09 | 2013-10 | yes | 2014-06 |
IEC/TS 62647-21 Ed. 1.0 Process management for avionics - Aerospace and defence electronic systems containing lead free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics | ANW
| 107/187/RVN | 2012-07 | 2012-07 | 2013-03 | yes | 2013-07 |
IEC/TS 62647-22 Ed. 1.0 Process management for avionics - Aerospace and defence electronic systems containing lead free solder - Part 22: Technical guidelines | ANW
| 107/188/RVN | 2012-07 | 2012-07 | 2013-03 | yes | 2013-07 |
IEC/TS 62647-23 Ed. 1.0 Process management for avionics - Aerospace and defence electronic systems containing lead free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies | ANW
| 107/189/RVN | 2012-07 | 2012-07 | 2013-03 | yes | 2013-07 |
IEC/TS 62647-3 Ed. 1.0 Aerospace and defence electronic systems containing lead free solder - Part 3: Performance testing for systems containing lead free solder and finishes | ANW
| 107/141/RVN | 2011-01 | 2011-01 | 2013-03 | yes | 2013-08 |
IEC/TS 62647-4 Ed. 1.0 Ball grid array (BGA) package reballing | PWI
| 2012-11 | no | ||||
IEC/TS 62668-2 Ed. 1.0 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
| ANW
| 107/190/RVN | 2012-07 | 2012-07 | 2013-03 | yes | 2013-12 |
IEC/TS 62686-2 Ed. 1.0 STACK international specification for capacitors and resistors | PWI
| 2012-11 | no |



