International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
export to xls file

TC 91 Work programme (20)

sort up

Project

Reference

Document

Reference

Init.

Date

sort upsort down

Current

Stage

sort upsort down

Next

Stage

Working

Group

sort upsort down

Project

Leader

sort upsort down

Fcst. Publ.

Date

IEC 60068-2-58 am1 Ed. 4.0  

Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
91/1389/CD2016-081CD
  • 1CD
  • 1st Committee Draft

2016-08

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-11

MT 60068-2-58, WG 3H. Oshima2017-12
IEC 60068-2-69 Ed. 3.0  

Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
91/1326/CDV2012-02ADIS
  • ADIS
  • Approved for FDIS circulation

2016-07

DEC
  • DEC
  • Draft at Editing Check

2016-10

WG 3Graham Naisbitt2017-03
IEC 60068-2-82 Ed. 2.0  

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
91/1392/RR2016-08AMW
  • AMW
  • Approved Maintenance Work

2016-08

1CD
  • 1CD
  • 1st Committee Draft

2016-11

WG 3I. Sakamoto2018-12
IEC 61188-6-4 Ed. 1.0  

Printed boards and printed board assemblies Design and use Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design
91/1357/NP2016-07ANW
  • ANW
  • Approved New Work

2016-07

1CD
  • 1CD
  • 1st Committee Draft

2017-03

12H. Ishibashi2019-03
IEC 61188-7 Ed. 2.0  

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
91/1382/CDV2015-08CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-12

DEC
  • DEC
  • Draft at Editing Check

2017-04

WG 12R. Taube2017-10
IEC 61189-2-630 Ed. 1.0  

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning
91/1301/NP2016-08ANW
  • ANW
  • Approved New Work

2016-08

1CD
  • 1CD
  • 1st Committee Draft

2017-03

WG 10D. J. Sober2019-03
IEC 61189-5-503 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
91/1336/CDV2015-09CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-03

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-09

WG 3H. Okamoto2017-05
IEC 61189-5-601 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow solderability test and heat resistance test for test board and solder joint
91/1322/RR2015-11AMW
  • AMW
  • Approved Maintenance Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-09

WG 3T. Yamamoto2018-11
IEC 61190-1-3 Ed. 3.0  

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
91/1255/CDV2014-12ADIS
  • ADIS
  • Approved for FDIS circulation

2016-03

DEC
  • DEC
  • Draft at Editing Check

2016-09

WG 2K. Tsuruta2017-02
IEC 61191-1 Ed. 3.0  

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
91/1367/CD2015-06CDM
  • CDM
  • Committee Draft to be discussed at Meeting

2016-08

A3CD
  • A3CD
  • Approved for 3rd Committee Draft

2016-11

WG 2R. Taube2017-06
IEC 61191-2 Ed. 3.0  

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
91/1285/CD2015-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-05

WG 2R. Taube2017-11
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1300/CD2012-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-12

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-09

WG 2R. Taube2018-01
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1290/CD2012-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-09

WG 2R. Taube2018-01
IEC 62090 Ed. 2.0  

Product package labels for electronic components using bar code and two-dimensional symbologies
91/1318/CD2015-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-08

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-10

WG 1H. Takai2017-12
IEC 62739-3 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
91/1368/CDV2015-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-07

ADIS
  • ADIS
  • Approved for FDIS circulation

2017-01

WG 3H. Nishikawa2017-09
IEC 62878-1 Ed. 1.0  

Device embedded substrate - Generic specification
91/1297/NP2015-12ANW
  • ANW
  • Approved New Work

2015-12

1CD
  • 1CD
  • 1st Committee Draft

2016-08

WG 6W. Huck2018-08
IEC 62878-2-5 Ed. 1.0  

Device embedded substrate - Part 2-5: Guidelines - Implementation of 3D data format requirements for device embedded substrate
91/1321/NP2016-03ANW
  • ANW
  • Approved New Work

2016-03

1CD
  • 1CD
  • 1st Committee Draft

2017-07

WG 6H. Tomokage2019-07
IEC/TR 61189-3-914 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
91/1378/DTR CDTR
  • CDTR
  • Circulated Draft Technical Report

2016-06

APUB
  • APUB
  • Draft approved for publication

2016-11

2017-05
IEC/TR 63051 Ed. 1.0  

Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)
91/1349/DTR APUB
  • APUB
  • Draft approved for publication

2016-09

DEC
  • DEC
  • Draft at Editing Check

2017-02

2017-07
PNW 91-1353-A Ed. 1.0  

Future IEC 61189-5-504 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
91/1353A/NP PNW
  • PNW
  • Proposed New Work

2016-03

ANW
  • ANW
  • Approved New Work

2016-08

WG 10C. Hunt