IEC 60068-2-58 Ed. 4.0  

ENVIRONMENTAL TESTING - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD))

IEC 60068-2-69 Ed. 3.0  

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronics components for surface mounting devices (SMD) by the wetting balance method

IEC 60068-3-13 Ed. 1.0  

IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering.

IEC 60194 Ed. 6.0  

Printed board design, manufacture and assembly - Terms and definitions

IEC 61188-8-1 Ed. 1.0  

Component shape data specification for CAD library - Part 8-1 Generic Descriptions of the 2D and 3D description

IEC 61189-11 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

IEC 61189-2-629 Ed. 1.0  

Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application

IEC 61189-3-719 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling

IEC 61189-3-913 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) -Test methods for electronic circuit board for high-brightness LEDs

IEC 61189-5-1 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies - Guidance

IEC 61189-5-2 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies - Soldering Flux

IEC 61189-5-3 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies - Soldering paste

IEC 61189-5-4 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies - Solder alloys and fluxed and non-fluxed solid wire

IEC 61189-5-5 Ed. 1.0  

General test method for measuring residues inducing Electrochemical Degradation Mechanism

IEC 61190-1-2 am1 Ed. 2.0  

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high - quality interconnects in electronics assembly

IEC 61191-1 Ed. 2.0  

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC 61191-2 Ed. 2.0  

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

IEC 61249-4-18 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61249-4-19 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61249-6-3 Ed. 1.0  

Materials for printed boards and other interconnection structures - Part 6-3: Reinforcements - Woven fiberglass fabrics

IEC 61760-4 Ed. 1.0  

Classification, packaging, labelling and handling of moisture sensitive devices

IEC 62137-4 Ed. 1.0  

Review report on IEC 62137-4 Ed.1: Electronics assembly technology - Part 4: Environmental and endurance test methods for solder joint of area array type package surface mount devices

IEC 62326-15 Ed. 1.0  

Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices,passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages.

IEC 62326-18 Ed. 1.0  

Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods

IEC 62326-20 Ed. 1.0  

IEC 62326-20 Ed.1: Electronic circuit board for high-brightness LEDs

IEC 62588 Ed. 1.0  

Marking and labeling of components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes

IEC 62699 Ed. 1.0  

Mapping rules and exchange methods for hetrogeneous parts libraries

IEC 62739-1 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

IEC/TR 62856 Ed. 1.0  

Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL)

IEC/TS 61249-3-1 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Copper-Clad Laminates for Flexible Boards (Adhesive and Non-adhesive types)

IEC/TS 62326-16 Ed. 1.0  

Printed boards - Part 16: Device Embedded Substrate Technology - Generics

IEC/TS 62326-17 Ed. 1.0  

Printed boards - Part 17: Device embedded substrates - TEG (test element group)

IEC/TS 62326-19 Ed. 1.0  

Printed boards - Part 19: Device Embedded Substrate - Design Guide

IEC/TS 62326-7-1 Ed. 1.0  

Printed boards - Part 7-1: Performance guide for single-and double-sided flexible printed boards

PNW 91-1035 Ed. 1.0  

Future IEC 61189-3-720: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Electrochemical migration test method

PNW 91-1054 Ed. 1.0  

Future IEC 61249-2-43: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PNW 91-1055 Ed. 1.0  

IEC 61249-44 Ed. 1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PNW 91-1073 Ed. 1.0  

Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator