International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
export to xls file

TC 91 Work programme (18)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 91-1353-A ED1

Future IEC 61189-5-504 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

91/1353A/NP PRVN
  • PRVN
  • Preparation of RVN

2016-05

2017-01

WG 3 C. Hunt
IEC 60068-2-21 ED7

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

91/1418/RR 2016-12 ACD
  • ACD
  • Approved for CD

2016-12

CD
  • CD
  • Draft circulated as CD

2017-07

WG 3 Walter Huck 2019-05
IEC 60068-2-58/AMD1 ED4

Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

91/1445/FDIS

2016-08 PRVD
  • PRVD
  • Preparation of RVD

2017-06

APUB
  • APUB
  • Approved for publication

2017-07

WG 3 H. Oshima 2017-08
IEC 60068-2-82 ED2

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

91/1422/CD 2016-08 PCC
  • PCC
  • Preparation of CC

2017-03

2017-04

WG 3 Udo Welzel 2018-12
IEC 60194-2 ED1

Printed boards design, manufacture and assembly - Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

91/1442/CDV 2016-12 CCDV
  • CCDV
  • Draft circulated as CDV

2017-06

PRVC
  • PRVC
  • Preparation of RVC

2017-08

WG 5 Min-su Lee 2018-06
IEC 61188-6-4 ED1

Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design

91/1357/NP 2016-07 ACD
  • ACD
  • Approved for CD

2016-07

CD
  • CD
  • Draft circulated as CD

2017-06

WG 12 Hiroyuki ISHIBASHI 2019-03
IEC 61189-2-630 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning

91/1301/NP 2016-08 ACD
  • ACD
  • Approved for CD

2016-08

CD
  • CD
  • Draft circulated as CD

2017-07

WG 10 Douglas Sober 2019-05
IEC 61189-5-601 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

91/1322/RR 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2017-07

WG 3 Shigeru SUGINO 2018-11
IEC 61190-1-3 ED3

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

91/1255/CDV 2014-12 AFDIS
  • AFDIS
  • Approved for FDIS

2016-03

TFDIS
  • TFDIS
  • Translation of FDIS

2017-07

WG 2 K. Tsuruta 2017-06
IEC 61191-1 ED3

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

91/1367/CD 2015-06 ACD
  • ACD
  • Approved for CD

2017-04

3CD
  • 3CD

2017-08

WG 2 R. Taube 2017-06
IEC 61191-4 ED2

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

91/1399/CDV 2012-11 APUB
  • APUB
  • Approved for publication

2017-03

2017-11

WG 2 R. Taube 2018-03
IEC 61249-2-45 ED1

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly

91/1423/NP 2017-04 TCDV
  • TCDV
  • Translation of CDV

2017-06

CCDV
  • CCDV
  • Draft circulated as CDV

2017-08

WG 4 ai Rong Wang 2018-09
IEC 61249-2-46 ED1

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly

91/1424/NP 2017-04 TCDV
  • TCDV
  • Translation of CDV

2017-06

CCDV
  • CCDV
  • Draft circulated as CDV

2017-08

WG 4 ai Rong Wang 2018-09
IEC 61249-2-47 ED1

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m•K)and defined flammability (vertical burning test), copper-clad for lead-free assembly

91/1425/NP 2017-04 TCDV
  • TCDV
  • Translation of CDV

2017-06

CCDV
  • CCDV
  • Draft circulated as CDV

2017-08

WG 4 ai Rong Wang 2018-09
IEC 61760-1 ED3

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

91/1440/RR 2017-04 ACD
  • ACD
  • Approved for CD

2017-04

CD
  • CD
  • Draft circulated as CD

2018-02

WG 1 Udo Welzel 2020-02
IEC 61760-4/AMD1 ED1

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

91/1419/CDV 2016-12 PRVC
  • PRVC
  • Preparation of RVC

2017-05

2017-07

WG 1 Walter Huck 2018-02
IEC 62878-1 ED1

Device embedded substrate - Generic specification

91/1297/NP 2015-12 ACD
  • ACD
  • Approved for CD

2015-12

CD
  • CD
  • Draft circulated as CD

2017-08

WG 6 W. Huck 2018-08
IEC 62878-2-5 ED1

Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate

91/1321/NP 2016-03 ACD
  • ACD
  • Approved for CD

2016-03

CD
  • CD
  • Draft circulated as CD

2017-07

WG 6 Yoshihisa KATOH 2019-07