International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |

Project Reference | Stage | Document Reference | Init. Date | Current Stage | Next Stage | Mod | Fcst. Publ. Date |
|---|---|---|---|---|---|---|---|
IEC 60749-28 Ed. 1.0 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM) | CCDV
| 47/2155/CDV | 2011-09 | 2013-03 | 2013-09 | no | 2014-04 |
IEC 60749-42 Ed. 1.0 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage | CCDV
| 47/2159/CDV | 2012-04 | 2013-03 | 2013-09 | no | 2014-04 |
IEC 60749-43 Ed. 1.0 Semiconductor devices - mechanical and climatic test methods - Part 43: Guidelines for LSI reliability qualification plans | ANW
| 47/2139/RVN | 2012-07 | 2012-07 | 2013-05 | no | 2015-07 |
IEC 60749-44 Ed. 1.0 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron irradiated soft error test method for semiconductor devices with memory | ANW
| 47/2151/RVN | 2012-10 | 2012-10 | 2013-08 | no | 2015-09 |
IEC 62435 Ed. 1.0 Long-term storage of electronic semiconductor devices | ANW
| 47/2088/RVN | 2011-03 | 2011-03 | 2013-06 | no | 2014-06 |
IEC 62483 Ed. 1.0 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes | ADIS
| 47/2156/RVC | 2012-07 | 2012-12 | 2013-03 | no | 2013-08 |
IEC 62779-1 Ed. 1.0 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements | ACDV
| 47/2165/CC | 2012-01 | 2013-02 | 2013-08 | no | 2014-12 |
IEC 62779-2 Ed. 1.0 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances | ACDV
| 47/2166/CC | 2012-03 | 2013-02 | 2013-08 | no | 2014-12 |
IEC 62779-3 Ed. 1.0 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions | ANW
| 47/2163/RVN | 2013-01 | 2013-01 | 2013-12 | no | 2015-12 |
IEC 62830-1 Ed. 1.0 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting | ANW
| 47/2142/RVN | 2012-08 | 2012-08 | 2013-08 | no | 2015-09 |
IEC 62830-2 Ed. 1.0 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting | ANW
| 47/2143/RVN | 2012-08 | 2012-08 | 2013-08 | no | 2015-09 |
PNW 47-2157 Ed. 1.0 Copper stress migration test method | PNW
| 47/2157/NP | 2012-12 | 2013-05 | no | ||
PNW 47-2164 Ed. 1.0 Semiconductor devices - semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting | PNW
| 47/2164/NP | 2013-02 | 2013-06 | no |



