International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Systèmes microélectromécaniques

 
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SC 47F Programme de Travail

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IEC 62047-11 Ed. 1.0  

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 11: Méthode d'essai des coefficients de dilatation thermique pour les matériaux de MEMS autonomes
RDIS
  • RDIS
  • Text for FDIS received and registered
47F/143A/RVC2009-102013-022013-05no2013-09
IEC 62047-15 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
2CD
  • 2CD
  • 2nd Committee Draft
47F/149/CD2012-012013-022013-06no2014-08
IEC 62047-16 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods
2CD
  • 2CD
  • 2nd Committee Draft
47F/151/CD2012-012013-032013-06no2014-08
IEC 62047-17 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
3CD
  • 3CD
  • 3rd Committee Draft
47F/146/CD2010-072013-012013-05no2013-06
IEC 62047-18 Ed. 1.0  

Dispositifs à semiconducteurs - Dispositif microélectromécaniques - Partie 18: Méthodes d'essai de flexion des matériaux en couche mince
RDIS
  • RDIS
  • Text for FDIS received and registered
47F/142/RVC2010-062013-022013-05no2013-09
IEC 62047-19 Ed. 1.0  

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 19: Compas électroniques
RDIS
  • RDIS
  • Text for FDIS received and registered
47F/144/RVC2011-072013-032013-05no2013-09
IEC 62047-20 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote
47F/138A/CC2011-112012-122013-03no2014-07
IEC 62047-21 Ed. 1.0  

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 21: Méthode d'essai relative au coefficient de Poisson des matériaux MEMS en couche mince
CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote
47F/147A/CDV2011-122013-042013-10no2014-05
IEC 62047-22 Ed. 1.0  

Dispositifs a semiconducteurs - Dispositifs microélectromécaniques - Partie 22: Méthode d'essai de traction électromécanique pour les couches minces conductrices sur des substrats souples
CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote
47F/148/CDV2011-122013-032013-09no2014-05
IEC 62047-25 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area
ANW
  • ANW
  • Approved New Work
47F/152/RVN2013-032013-032013-11no2015-12
PNW 47F-139 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 23: General rules for the assessment of micro-geometrical parameters
PNW
  • PNW
  • Proposed New Work
47F/139/NP 2012-112013-03no 
PNW 47F-140 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 24: Silicon-based MEMS fabrication technology - Basic regulation for layout design
PNW
  • PNW
  • Proposed New Work
47F/140/NP 2012-112013-03no 
PNW 47F-153 Ed. 1.0  

Future IEC 62047-26: Semiconductor devices Micro-electromechanical devices Part 26: Description and measurement methods for micro trench and needle structures
PNW
  • PNW
  • Proposed New Work
47F/153/NP 2013-042013-08no