International

Electrotechnical

Commission

International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Systèmes microélectromécaniques

SC 47F Programme de Travail

Référence Projet	Stage	Référence Document	Init. Date	Stage Courant	Prochain Stage	Mod	Fcst. Publ. Date
IEC 62047-11 Ed. 1.0 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 11: Méthode d'essai des coefficients de dilatation thermique pour les matériaux de MEMS autonomes	RDIS RDIS Text for FDIS received and registered	47F/143A/RVC 131 kB	2009-10	2013-02	2013-05	no	2013-09
IEC 62047-15 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass	2CD 2CD 2nd Committee Draft	47F/149/CD 328 kB	2012-01	2013-02	2013-06	no	2014-08
IEC 62047-16 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods	2CD 2CD 2nd Committee Draft	47F/151/CD 474 kB	2012-01	2013-03	2013-06	no	2014-08
IEC 62047-17 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films	3CD 3CD 3rd Committee Draft	47F/146/CD 563 kB	2010-07	2013-01	2013-05	no	2013-06
IEC 62047-18 Ed. 1.0 Dispositifs à semiconducteurs - Dispositif microélectromécaniques - Partie 18: Méthodes d'essai de flexion des matériaux en couche mince	RDIS RDIS Text for FDIS received and registered	47F/142/RVC 101 kB 122 kB	2010-06	2013-02	2013-05	no	2013-09
IEC 62047-19 Ed. 1.0 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 19: Compas électroniques	RDIS RDIS Text for FDIS received and registered	47F/144/RVC 120 kB 130 kB	2011-07	2013-03	2013-05	no	2013-09
IEC 62047-20 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes	ACDV ACDV Draft approved for Committee Draft with Vote	47F/138A/CC 98 kB 125 kB	2011-11	2012-12	2013-03	no	2014-07
IEC 62047-21 Ed. 1.0 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 21: Méthode d'essai relative au coefficient de Poisson des matériaux MEMS en couche mince	CCDV CCDV Draft circulated as Committee Draft with Vote	47F/147A/CDV 1504 kB 300 kB	2011-12	2013-04	2013-10	no	2014-05
IEC 62047-22 Ed. 1.0 Dispositifs a semiconducteurs - Dispositifs microélectromécaniques - Partie 22: Méthode d'essai de traction électromécanique pour les couches minces conductrices sur des substrats souples	CCDV CCDV Draft circulated as Committee Draft with Vote	47F/148/CDV 610 kB 268 kB	2011-12	2013-03	2013-09	no	2014-05
IEC 62047-25 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area	ANW ANW Approved New Work	47F/152/RVN	2013-03	2013-03	2013-11	no	2015-12
PNW 47F-139 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 23: General rules for the assessment of micro-geometrical parameters	PNW PNW Proposed New Work	47F/139/NP 257 kB		2012-11	2013-03	no
PNW 47F-140 Ed. 1.0 Semiconductor devices - Micro-electromechanical devices - Part 24: Silicon-based MEMS fabrication technology - Basic regulation for layout design	PNW PNW Proposed New Work	47F/140/NP 324 kB		2012-11	2013-03	no
PNW 47F-153 Ed. 1.0 Future IEC 62047-26: Semiconductor devices Micro-electromechanical devices Part 26: Description and measurement methods for micro trench and needle structures	PNW PNW Proposed New Work	47F/153/NP		2013-04	2013-08	no