International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Systèmes microélectromécaniques

 
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SC 47F Programme de Travail

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IEC 62047-11 Ed. 1.0  

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 11: Méthode d'essai des coefficients de dilatation thermique pour les matériaux de MEMS autonomes
ADIS
  • ADIS
  • Approved for FDIS circulation
47F/143/RVC2009-102012-112013-01no2013-06
IEC 62047-15 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
CDM
  • CDM
  • Committee Draft to be discussed at Meeting
47F/135/CC2012-012012-102012-11no2014-08
IEC 62047-16 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
A2CD
  • A2CD
  • Approved for 2nd Committee Draft
47F/134A/CC2012-012012-122013-02no2014-08
IEC 62047-17 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
3CD
  • 3CD
  • 3rd Committee Draft
47F/146/CD2010-072013-012013-05no2013-06
IEC 62047-18 Ed. 1.0  

Dispositifs à semiconducteurs - Dispositif microélectromécaniques - Partie 18: Méthodes d'essai de flexion des matériaux en couche mince
ADIS
  • ADIS
  • Approved for FDIS circulation
47F/142/RVC2010-062012-112013-01no2013-06
IEC 62047-19 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
ADIS
  • ADIS
  • Approved for FDIS circulation
47F/144/RVC2011-072012-122013-02no2013-07
IEC 62047-20 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote
47F/138A/CC2011-112012-122013-03no2014-07
IEC 62047-21 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote
47F/136A/CC2011-122012-122013-02no2014-06
IEC 62047-22 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote
47F/137A/CC2011-122012-122013-02no2014-06
PNW 47F-139 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 23: General rules for the assessment of micro-geometrical parameters
PNW
  • PNW
  • Proposed New Work
47F/139/NP 2012-112013-03no 
PNW 47F-140 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 24: Silicon-based MEMS fabrication technology - Basic regulation for layout design
PNW
  • PNW
  • Proposed New Work
47F/140/NP 2012-112013-03no 
PNW 47F-141 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area
PNW
  • PNW
  • Proposed New Work
47F/141/NP 2012-112013-03no