International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
export to xls file

SC 47F Work programme (8)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47F-276

Semiconductor devices - Micro-electromechanical devices - Part 35: Standard test procedure for the anti-failure robustness of flexible or foldable electro-mechanical devices against bending deformation

47F/276/NP PNW
  • PNW
  • New Work Item Proposal

2017-04

PRVN
  • PRVN
  • Preparation of RVN document

2017-07

WG 2 Shoji Kamiya 2020-05
IEC 62047-29 ED1

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

47F/263/CDV 2015-11 AFDIS
  • AFDIS
  • Approved for FDIS

2017-02

TFDIS
  • TFDIS
  • Translation of FDIS

2017-04

WG 2 J H Kim, H J Lee 2017-11
IEC 62047-30 ED1

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

47F/254/CDV 2015-11 PRVC
  • PRVC
  • Preparation of RVC

2017-01

2017-03

WG 2 I. Kanno 2017-10
IEC 62047-31 ED1

Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

47F/246/NP 2016-09 ACD
  • ACD
  • Approved for CD

2016-09

CD
  • CD
  • Draft circulated as CD

2017-01

WG 2 J. H Kim, Dr. H. J. Lee 2019-12
IEC 62047-32 ED1

IEC 62047-32 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators

47F/255/NP 2016-12 ACD
  • ACD
  • Approved for CD

2016-12

CD
  • CD
  • Draft circulated as CD

2017-03

WG 3 qingfeng Li 2020-02
IEC 62047-33 ED1

IEC 62047-33 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

47F/256/NP 2016-12 ACD
  • ACD
  • Approved for CD

2016-12

CD
  • CD
  • Draft circulated as CD

2017-03

WG 3 wei zhang 2020-02
IEC 62047-34 ED1

IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device

47F/257/NP 2016-12 ACD
  • ACD
  • Approved for CD

2016-12

CD
  • CD
  • Draft circulated as CD

2017-03

WG 3 wei zhang 2020-02
IEC 62047-36 ED1

Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

47F/272/NP 2017-04 ACD
  • ACD
  • Approved for CD

2017-04

CD
  • CD
  • Draft circulated as CD

2017-07

WG 2 Isaku KANNO 2020-07