International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (7)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

IEC 62047-29 ED1

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

47F/295/FDIS 2015-11 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2017-09

PRVD
  • PRVD
  • Preparation of RVD document

2017-10

WG 2 J H Kim, H J Lee 2018-01
IEC 62047-31 ED1

Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

47F/288/CD 2016-09 PCC
  • PCC
  • Preparation of CC

2017-10

2018-01

WG 2 Jae-Hyun Kim 2019-12
IEC 62047-32 ED1

Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators

47F/287/CD 2016-12 ACDV
  • ACDV
  • Approved for CDV

2017-09

TCDV
  • TCDV
  • Translation of CDV

2017-11

WG 3 qingfeng Li 2020-02
IEC 62047-33 ED1

Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

47F/282/CD 2016-12 ACDV
  • ACDV
  • Approved for CDV

2017-09

TCDV
  • TCDV
  • Translation of CDV

2017-12

WG 3 wei zhang 2020-02
IEC 62047-34 ED1

Semiconductor devices - Micro-electromechanical devices - Part 34: Test method for MEMS piezoresistive pressure-sensitive device on wafer

47F/283/CD 2016-12 ACDV
  • ACDV
  • Approved for CDV

2017-09

TCDV
  • TCDV
  • Translation of CDV

2017-12

WG 3 wei zhang 2020-02
IEC 62047-35 ED1

Semiconductor devices – Micro-electromechanical devices – Part 35: Standard test procedure for the anti-failure robustness of flexible or foldable electro-mechanical devices against bending deformation

47F/276/NP 2017-07 ACD
  • ACD
  • Approved for CD

2017-07

CD
  • CD
  • Draft circulated as CD

2017-10

WG 2 Shoji Kamiya 2020-10
IEC 62047-36 ED1

Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

47F/281/CD 2017-04 ACDV
  • ACDV
  • Approved for CDV

2017-09

TCDV
  • TCDV
  • Translation of CDV

2017-12

WG 2 Isaku KANNO 2020-07