International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (8)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47F-255 ED1

Future IEC 62047-32: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators

47F/255/NP PRVN
  • PRVN
  • Preparation of RVN

2016-11

2016-12

WG 3 Q. F. Li
PNW 47F-256 ED1

Future IEC 62047-33: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

47F/256/NP PRVN
  • PRVN
  • Preparation of RVN

2016-11

2016-12

WG 3 W. Zhang
PNW 47F-257 ED1

Future IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device

47F/257/NP PRVN
  • PRVN
  • Preparation of RVN

2016-11

2016-12

WG 3 W. Zhang
IEC 62047-27 ED1

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

47F/230A/CDV 2014-02 RPUB
  • RPUB
  • Publication received and registered

2016-12

RPUB
  • RPUB
  • Text for PUB received and registered

2017-02

WG 2 2017-03
IEC 62047-28 ED1

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

47F/266/FDIS

2014-08 PRVD
  • PRVD
  • Preparation of RVD

2016-12

2016-12

WG 3 Y. Suzuki 2017-02
IEC 62047-29 ED1

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

47F/263/CDV 2015-11 CCDV
  • CCDV
  • Draft circulated as CDV

2016-11

PRVC
  • PRVC
  • Preparation of RVC

2017-02

WG 2 J H Kim, H J Lee 2017-12
IEC 62047-30 ED1

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

47F/254/CDV 2015-11 CCDV
  • CCDV
  • Draft circulated as CDV

2016-10

PRVC
  • PRVC
  • Preparation of RVC

2017-01

WG 2 I. Kanno 2017-11
IEC 62047-31 ED1

Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

47F/246/NP 2016-09 ACD
  • ACD
  • Approved for CD

2016-09

CD
  • CD
  • Draft circulated as CD

2017-01

WG 2 J. H Kim, Dr. H. J. Lee 2019-12