International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (7)

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IEC 62047-1 Ed. 2.0  

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
47F/195/CDV2013-10RDIS
  • RDIS
  • Text for FDIS received and registered

2015-08

CDIS
  • CDIS
  • Draft circulated as FDIS

2015-11

WG 1N. Moronuki2016-02
IEC 62047-25 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
47F/219/CDV2013-03CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-06

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-12

WG 1Z. Dacheng2016-07
IEC 62047-26 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
47F/200/CDV2013-07RDIS
  • RDIS
  • Text for FDIS received and registered

2015-08

CDIS
  • CDIS
  • Draft circulated as FDIS

2015-10

WG 1Y. Isono2016-02
IEC 62047-27 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
47F/216/CD2014-02ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-06

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-08

WG 2L. Stühler2016-12
IEC 62047-28 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
47F/220/CD2014-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-08

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-11

WG 3Y. Suzuki2017-03
PNW 47F-224 Ed. 1.0  

Future IEC 62047-29: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding MEMS materials under room temperature
47F/224/NP PNW
  • PNW
  • Proposed New Work

2015-06

ANW
  • ANW
  • Approved New Work

2015-10

WG 2J H Kim, H J Lee 
PNW 47F-225 Ed. 1.0  

Future IEC 62047-30: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film and reporting schema
47F/225/NP PNW
  • PNW
  • Proposed New Work

2015-06

ANW
  • ANW
  • Approved New Work

2015-11

WG 2I. Kanno