International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (11)

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IEC 62047-1 Ed. 2.0  

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
47F/177/CD2013-101CD
  • 1CD
  • 1st Committee Draft

2013-10

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-03

01N. Moronuki2015-12
IEC 62047-15 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
47F/180/CDV2012-01CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-02

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-08

01S. Park2015-03
IEC 62047-16 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods
47F/181/CDV2012-01CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-02

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-08

01S. Park and J-S. Park2015-03
IEC 62047-17 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
47F/166/CDV2010-07CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2013-10

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-04

01Seungmin Hyun,Yong-Hak Huh2014-12
IEC 62047-20 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
47F/188/FDIS2011-11CDIS
  • CDIS
  • Draft circulated as FDIS

2014-04

APUB
  • APUB
  • Draft approved for publication

2014-06

01K. Ohwada2014-07
IEC 62047-21 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
47F/185/FDIS2011-12CDIS
  • CDIS
  • Draft circulated as FDIS

2014-03

APUB
  • APUB
  • Draft approved for publication

2014-05

01J-H. Kim and H-J. Lee2014-06
IEC 62047-22 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
47F/186/FDIS2011-12CDIS
  • CDIS
  • Draft circulated as FDIS

2014-03

APUB
  • APUB
  • Draft approved for publication

2014-05

01J-H. Kim and H-J. Lee2014-06
IEC 62047-25 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
47F/183/CD2013-031CD
  • 1CD
  • 1st Committee Draft

2013-12

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-05

01Z. Dacheng2015-12
IEC 62047-26 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
47F/178/CD2013-071CD
  • 1CD
  • 1st Committee Draft

2013-11

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-03

01Y. Isono2015-12
IEC 62047-27 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
47F/173/NP2014-02ANW
  • ANW
  • Approved New Work

2014-02

1CD
  • 1CD
  • 1st Committee Draft

2014-07

02L. Stühler2016-12
PNW 47F-187 Ed. 1.0  

Future IEC 62047-28: Semiconductor devices - Micro-electromechanical devices - Part 28: Vibration-driven MEMS electret energy harvesting devices
47F/187/NP PNW
  • PNW
  • Proposed New Work

2014-03

ANW
  • ANW
  • Approved New Work

2014-07

03Y. Suzuki