International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (5)

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IEC 62047-25 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
47F/219/CDV2013-03RDIS
  • RDIS
  • Text for FDIS received and registered

2016-05

CDIS
  • CDIS
  • Draft circulated as FDIS

2016-08

WG 1Z. Dacheng2016-11
IEC 62047-27 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
47F/230A/CDV2014-02CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-11

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-05

WG 2L. Stühler2017-02
IEC 62047-28 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
47F/242/CDV2014-08CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-04

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-10

WG 3Y. Suzuki2017-06
IEC 62047-29 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding MEMS materials under room temperature
47F/243/CD2015-111CD
  • 1CD
  • 1st Committee Draft

2016-03

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-06

WG 2J H Kim, H J Lee2019-03
IEC 62047-30 Ed. 1.0  

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
47F/241/CD2015-111CD
  • 1CD
  • 1st Committee Draft

2016-02

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-06

WG 2I. Kanno2018-01